The Electronic Packaging Laboratory (German abbreviation: IAVT) and the Center of Microtechnical Manufacturing (German abbreviation: ZmP) are working together for more than 10 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.
A unique selling point of IAVT/ZmP is the comprehensive consideration of Electronic Packaging as a unified whole of procedure and process technologies and the additional regarding of product process specific topics.
Electronics packaging influences decisively the functional properties, the reliability and the costs of the whole electronic system. The drivers of this progression are the trends in system integration:
The fields of activity of IAVT/ZmP cover a wide range from bio-compatible packaging, different substrate and assembling technologies (organic substrates, thick film and LTCC substrates, micro assembling technologies, surface mount technology, conductive and non-conductive adhesives, optical interconnects etc.), process development and reliability investigations on to destructive and non-destructive testing in electronics production. Topics like quality management and process simulation and optimization complete this.
Object of the research work is the comparison, analysis and selection of suitable technologies and materials to ensure reliable packaging as well as the development, diagnostic and reliability evaluation of new packaging technologies.