IAVT and ZµP are active in basic and applied research in the field of Electronics Packaging and Electronics Production. The work is focused in the research fields:

• Electronic packages and devices
• Substrates and MEMS
• Assembling technologies
• Production processes and systems

The research work is organized in "working fields".

The work is based on the following fundamental technologies, for which extensive technological and diagnostic equipment is available:

• Printed circuit boards and flat modules
• Thick film technology
• Thin film technology (under development)

Research work is advanced by public funded projects and contract research for industry.