Quality Assurance
Subject
There are increasing quality demands on electronics packaging especially from the automotive industry. One main goal is a persistent and successful implementation of the quality strategy “Six sigma”. The field of activity quality assurance is particularly addressed to the realisation of the DMAIC - method (Define, Measure, Analyse, Improve, Control) for the production of electronics focused on electronics packaging. This includes especially the practical usage of SPC (Statistical Process Control), MCA/PCA (Machine and Process capability analysis) and the Design of Experiments (DoE). All these methods are adapted to the specific characteristics of production processes in electronics. The numerical statistical analysis of reliability data is an additional topic.
- Goals of the quality assurance in a SMT Production line
Prospect
The permanently miniaturization, the moving towards nanoelectronics and the increasing usage of three dimensional structures demands also new dimensions for the quality assurance. The proportion between the signal usable for the quality assurance and the always existing noise level will be decreased by these tendencies. That makes it necessary to develop new evaluation methods and furthermore the ongoing adaptation and specialisation of existing methods for this quantitative and qualitative new demands.
Head
Dr.-Ing. habil. Heinz Wohlrabe (*1955) studied from 1974 till 1978 Electronics Technology at the Technische Universität Dresden. From 1978 till 1984 he worked as a scientific assistant at the Department “Process Technology of Electronics” and received there his PhD in 1984 in the field of Elecrtronics Technology. Since 1984 he was working as an assistant professor at the later Electronics Technology Laboratory active in different research projects, students’ education and further training. Since 2000 he works in the Center of Microtechnical Manufacturing.
