Scientists
Vita
Dr.-Ing. Maik Müller was born in 1980 in Lauchhammer and studied from 2000 to 2005 at TU Dresden. In 2014 he defended his thesis on "The solidification microstructure of low-volume, lead-free solder interconnects ". He currently directs the group for "microstructure characterization" at IAVT (TU Dresden). In 2009, he was a visiting scholar at the Center for Advanced Life Cycle Engineering at the University of Maryland in College Park (USA). Dr. Müller developed an extensive knowledge in the field of physics of failure analysis and specializes in the evaluation of the microstructure of lead-free solder materials and electrodeposited Cu-layers.
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Referenzen
2024
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Mueller, M.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
Proceedings of the IEEE 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania (Italy), 2024, DOI: 10.1109/EuroSimE60745.2024.10491475
2023
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Mueller, M.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Singh, P. K.; Müller, M.; Machani, K. V.; Breuer, D.; Hecker, M.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
Proceedings of the 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023, DOI: 10.1109/IITC/MAM57687.2023.10154658
2022
Panchenko, I.; Wenzel, L.; Mueller, M.; Rudolph, C.; Hanisch, A.; Wolf J. M.
Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 3, pp. 410-421, March 2022. doi: 10.1109/TCPMT.2022.3149788.
Mueller, M.; Schindler, S.; Wolter, K.-J.; Wiese, S.; Panchenko, I.
Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermography
Thermochimica Acta, Volume 714, 2022, 179245.
ISSN 0040-6031, https://doi.org/10.1016/j.tca.2022.179245.
2020
Panchenko, I.; Wambera, L.; Mueller, M.; Rudolph, C.; Hanisch, A.; Bartusseck, I.; Wolf, M. J.
Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virutal event, 2020
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Balls
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 1, pp 18 -29, Jan. 2020; DOI: 10.1109/TCPMT.2019.2952093
2019
Wiese, S.; Mueller, M.; Čáp, D.; Barth, D.; Yuile, A.; Schindler, S.; Panchenko, I.
Temperature evaluation of solder joints for adjusting reflow profiles
22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, Pisa, Italy, 2019; DOI: 10.23919/EMPC44848.2019.8951800
2018
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Balls
7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 2019, DOI: 10.1109/ESTC.2018.8546391
2017
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M. J.
Influence of Flux-Assisted Isothermal Storage on Intermetallic Compounds in Cu/SnAg Microbumps
40th International Spring Seminar on Electronics Technology (ISSE), Sofia, Bulgaria, May 10-14 (ISSE 2017 Award - Best Presentation Award for Young Scientist); DOI: 10.1109/ISSE.2017.8000909
2016
Mueller, M.; Türke, A.; Panchenko, I.
DSC investigation of the undercooling of SnAgCu solder alloys
39th International Spring Seminar on Electronics Technology (ISSE), Pilsen, Czech Republic, 2016, pp. 53-57; DOI: 10.1109/ISSE.2016.7563160
2014
Panchenko, I.; Grafe, J.; Mueller, M; Wolter, K.-J.; Wolf, M. J.; Lang, K.-D.
Processing and Microstructure of Solid-Liquid Interdiffusion Interconnects for 3D Integration
DATE Conference - Design, Automition and Test in Europe , Dresden, 24.03.-28.03.2014 , 2014
2013
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Microstructure Investigation of the Cu/SnAg Solid-Liquid Interdiffusion Interconnects by Electron Backscatter Diffraction
15th Electronics Packaging Technology Conference (EPTC), Singapore, December 11-13 (Best Academic Paper Award)
2012
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Einfluss der Bondkraft auf die Qualität von Cu/SnAg SLID Verbindungen für 3D Integration
AVT-Tagung, Warstein, 12. Dezember, 2012 (Vortrag)
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Effects of Bonding Pressure on Quality of SLID Interconnects
4th Electronics Systemintegration Technology Conference (ESTC), Amsterdam, September 17 – 20, 2012
Müller, M.; Kriz, J.; Meinhold, D.; Zerna, T.
Influence of Liner-System and Cu-Layer Thickness on the Grain Structure of Electroplated Cu
4th ESTC, Amsterdam, Netherlands, September 17-20, 2012
2011
Müller, M.; Panchenko, I.
Charakterisierung der Mikrostruktur von Loten mittels Electron Backscatter Diffraction (EBSD) (oral presentation)
Industriepartner Symposium, 06.Oktober, 2011, Dresden
Wiese, S.; Müller, M.; Panchenko, I.; Metasch, R.; Röllig, M.; Wolter, K.-J.
The Creep Behaviour and microstructure of Ultra Small Solder Joints
EuroSime, April 18th-20th, Linz, Austria
Panchenko, I.; Mueller, M.; Wiese. S.; Schindler, S.; Wolter, K.- J.
Solidification Processes in the Sn-rich Part of the SnCu System
61st Electronic Components and Technology Conference, Orlando, 31st of May - 4th of June
2010
Panchenko, I.; Müller, M.; Wolter, K.-J.
Microstructure Characterization of Lead-Free Solders Depending on Alloy Composition (poster)
1st RTG Workshop 2010 - DFG Report and Defense Colloquium “Bio-Nano-Tech 2010”, Dresden
Wiese, S.; Mueller, M.; Panchenko, J.; Metasch, R.; Wolter, K.- J.; Roellig, M.
The Scaling Effect on Microstructure and Creep Properties of Sn-based Solders
Electronics System Integration Technology Conference, Berlin, 13th - 16th of May
Panchenko, I.; Mueller, M.; Wolter, K.- J.
Microstructure Characterisation of Lead-Free Solders Depending on Alloy Composition
AIP Proceedings of the 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau,12th-14th of April
Panchenko, I.; Mueller, M.; Wolter, K.- J.
Metallographic Preparation of the SnAgCu Solders for Optical Microscopy and EBSD Investigations
33rd International Spring Seminar on Electronics Technology, Warsaw, 12th-16th of May
Tkachenko, A.; Müller, M.; Zerna, T.; Wolter, K.-J.
Influence of metallographic preparation on EBSD characterization of Cu wire bonds
3rd ESTC, Berlin
Tkachenko, A.; Müller, M.; Zerna, T.; Wolter, K.-J.
Influence of metallographic preparation on EBSD characterization of Cu wire bonds
33rd ISSE, Warsaw, Poland
2007
Müller, M.; Wiese, S.; Rollig, M.; Wolter, K.-J.
The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 446-455
Wiese, S.; Röllig, M.; Müller, M.; Wolter, K.-J.
The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties
EuroSimE 2007, 16.-18. April , London (GB), S: 699-706
Müller, M.; Wiese, S.; Röllig, M.; Wolter, K.-J.
Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints
57th ECTC 2007, 29.5 . 1.6.05 in Reno, (USA), S. 1579 . 1588
Wiese, S.; Röllig, M.; Müller, M.; Bennemann, S.; Petzold, M.; Wolter, K.-J.
The Size Effect on the Creep Properties of SnAgCu-Solder Alloys
57th ECTC 2007, 29.5 . 1.6.05 in Reno, (USA), S. 548 . 557
2006
Müller, M.; Wiese, S.; Wolter, K.-J.
Influence of Cooling Rate and Composition on the Solidification of SnAgCu Solders
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 1303 - 1311
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.
Analytical and Mechanical Methods for Material Property Investigations of SnAgCu-Solder
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 376 - 382
Wiese, S.; Röllig, M., Müller, M.; Rzepka, S.; Nocke, K.; Luhmann, C.; Krämer, F.; Meier, K.; Wolter, K.-J.
The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 912 - 925
Wiese, S.; Krämer, F.; Krause, M.; Bennemann, S.; Müller, M.; Röllig, M.; Petzold, M.; Wolter, K.-J.
Compositional Effects on the Creep Properties of SnAgCu Solder
EuroSimE 2006, April 24th to 26th in Como (I), S: 684-653
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