Services and Equipment

Planning, Simulation, Optimization

Simulation and Optimization of Production Processes
Simulation and Optimization of Production Processes

Services

  • Modelling and analysis of manufacturing processes
  • Simulation of production processes
  • Simulation  aided and mathematical optimization of the production process scheduling, especially in electronics production
  • Simulation and optimization methods for planning and controlling production systems
  • Training and workshops about planning and controlling

Methods / Tools

  • Simulation system simcron MODELLER with integrated heuristic optimization algorithms
  • IBM ILOG CPLEX Optimization Studio (LP-, MIP- and CP-Solver)
  • Powerful DELL blade server (24 cores, 128 GB RAM) for extensive calculations
  • Long term experience in the development and practical use of Software for planning and controlling, especially in semiconductor industry
Dipl.-Math.
Dirk Schloß
Phone:
(0351) 463 31696
Quality Management, Design of Experiments, Statistical Process Control
Quality Management, Design of Experiments, Statistical Process Control

Services

  • Preparation and interpretation of statistical experiments (DoE)
    • Planning of experiments under consideration of special constraints
    • Analysis and interpretation of experimental results
  • Investigation of process and machine capability coefficients
    • Adaption to special constraints of electronics production
    • Advice about interpretation of borderline cases
  • Solutions for the application of SPC (Statistical Process Control)
    • Design of special quality control charts

Methods / Tools

  • Design of Experiments
  • Statistical Process Control
  • Data evaluation with StatGraphics
  • self-developed software tools
  • CM-Controller
Dr.-Ing. habil.
Heinz Wohlrabe
Phone:
(0351) 463 35479

Manufacturing, Assembling, Treatment

Printed Circuit Boards and Printing Masks
Printed Circuit Boards and Printing Masks

Services

  • Manufacturing of Herstellung von phot masters for PCB production
  • Manufacturing of one-sided, double-sided and multilayer PCBs (up to 6 layers) including through hole metallization
  • Manufacturing of copper printing masks by etching

Equipment

  • Equipment for manufacturing of PCBs and printing masks
    • Computer controlled mill-drill-plotter Fa. Bungard CCD, max. rotation speed 60.000 rot./min, drilling diameter 0.3 - 4 mm
    • PCB brush engine, Fa. Bungard
    • Galvanic Compakta for tenting technology, Fa. Bungard, max. workpiece size 300 mm x 400 mm
    • Etching machine, Fa. Bungard, copper-II-chloride
    • Stripper sodium hydroxide
    • Rigid resist laminators (Hot rol), Fa. Bungard
      • phot. etching resist 40 µm, width 300 mm
      • phot. solder mask 65 µm, width 400 mm
    • Exposurer, Fa. Bungard EXP 8000
    • Multi layer laminator MLP 20
Dr.-Ing.
Gerald Hielscher
Phone:
(0351) 463 32159
Thick Film Technology
Thick Film Technology
 

Services

  • Testing of new materials and development of technologies
  • Prototyping and manufacturing of examples
  • Characterization of thick film components and layer systems

Equipment

  • Mask preparation
    • photo plotter (Gerber format)
    • screens with emulsion (steel and polyester canvas, standard / fine)
    • copper masks (double sided etched)
    • steel masks (laser cut)
  • Laser technology
    • drilling of vias in ceramic substrates and polymer foils
    • cutting and scribing of outlines for panel separation
    • resistor trimming
  • Screen printing technology
    • MPM-SPM (with vision system)
    • EKRA X5 STS
  • Sintering technology
    • programmable batch furnace ATV PEO 603
    • zone furnace BTU up to 1100 °C
  • Possible technologies
    • CERMET thick film technology on Al2O3-ceramics
    • Low Temperature Cofired Ceramic Technology – LTCC
    • Polymer thick film technology on organic flex substrates
 
Dr.-Ing.
Marco Luniak
Phone:
(0351) 463 32478
Prototyping and Module Assembly
Prototyping and Module Assembly
Mehrkopf-Drahtbonder 56xx
SMD-Montagelinie (Schablonendrucker, Bestückautomat, Konvektionslötanlage)

Services

  • Assembly of electronic modules, prefered in SMD technology
  • First- and second-level interconnect technologies

Equipment

Micro assembly:
  • Ultrasonic and thermosonic wire bonder F&K Delvotec 54xx and 56xx
  • Flip chip bonder
  • Fineplacer
Application of interconnect materials:
  • Mask printing equipment EKRA X3
  • Dispensing machine Martin
Placement of components:
  • SMD-assembling machine SIPLACE SX1
  • SMD-aasembling machine Fuji NXT-II
  • Places for manual assembly
Soldering technologies:
  • Convection reflow soldering equipment Rehm V8 2.1
  • Wave soldering equipment Seho GoWave
  • Vapor phase soldering equipment IBL
  • Rehm Condenso XM
  • Selective soldering equipment (light) ATN economic A400
Contact concerning micro assembling
Dipl.-Ing.
Daniel Ernst
Phone:
(0351) 463 36941
Contact concerning prototyping
Carsten Ließ
Phone:
(0351) 463 32718
Contact concerning soldering technologies
Dr.-Ing. habil.
Heinz Wohlrabe
Phone:
(0351) 463 35479
Laser treatment of materials
Laser treatment of materials
Laser station

Services

  • Material treatment of ceramics and thin metal foils
  • Thick film resistor trimming
  • Drilling and cutting
  • Laser soldering
  • Laser micro welding

Equipment

  • 3D-Micromac microCUTms10.6: CO2 laser, 200 W + fibre laser, 20 W
  • Welding laser LSW 4001
Dr.-Ing.
Marco Luniak
Phone:
(0351) 463 32478

Measuring

Geometrical characterization
Geometrical characterization
3D profiling NanoFocus µscan with different sensors
Measurement of a printed solder volume

Services

  • contact-free topological measurement of surfaces
  • determination of roughness
  • volume calculation

Equipment

  • Laser profilometer NanoFOCUS µScan AF2000
  • Measurement system NanoFOCUS µSurf
  • 3D-coordinates measurement equipment PMC 500
  • Two-coordinates Measurement microscope ZKM 01-250C (Carl Zeiss)
Dr.-Ing.
Marco Luniak
Phone:
(0351) 463 32478
Thermoiré measurement
Thermoiré measurement
Extreme bow (180 µm) of a BGA at 180°C
Coplanarity trend of a BGA during typical temperature profile of reflow soldering process

Services

Measurement of bow (warpage) and its changing of flat objects under changing temperatures (e.g. simulation of a temperature profile during soldering)
Objects:
  • Printed Circuit Boards
  • Components (BGA, QFP,...)
  • Photovoltaic cells
Objects  testable after preparation:
  • SMD connectors
  • SMD relays
Additional objects on request.

Equipment

  • Acrometrix TherMoire PS 88
    • Object size (35x25) mm2 …(202x250) mm2
    • Infrared heating (max. temperature gradient 1K/s)
    • Konvektion (max. temperature gradient 0,25K/s)
    • Temperature range: max. 260°C
    • Measurement accuracy: 2.5 µm repeatability (on white surface)
Dr.-Ing. habil.
Heinz Wohlrabe
Phone:
(0351) 463 35479
Physical characterization
Physical characterization

Rheology

Services

  • Determination of rheological behaviour of pastes
  • Investigation of the influence of surface treatment, e.g. on the releasing behaviour of printing screens and masks

Equipment

  • Rheometer HAAKE RheoStress 600
    • VC Motor controlled
      • mimimum torque 0.5 µNm
      • angle resolution of 0.012 µrad
    • Peltier-tempered plate-conus-system
      • T=(-60 – 185) °C
    • Measurement in three modes:
      • shear stress presetting (CS-mode)
      • rotation speed presetting (CR-mode)
      • deformation-controlled (CD-Modus)

Contact angle measurement

Services

  • Contact Angle measurement
  • Calculation of surface tension and surface energy of packaging materials
  • Statistical analysis and failure analysis

Equipment

  • Contact angle measurement equipment dataphysics OCA 20
Contact concerning rheology measurement
Dr.-Ing.
Krzysztof Nieweglowski
Phone:
(0351) 463 35291
Concact concerning contact angle measurement
Dipl.-Ing.
Martin Schubert
Phone:
(0351) 463 42510

Analyze

Scanning acoustic microscopy
Scanning acoustic microscopy
Scanning acoustic microscope
Failure detection in DCB modules

Service

  • Non-destructive inspection of prototypes and samples of packaged and unpackaged components, devices and substrates.
  • Layer by layer detection of failures like delaminations, gas inclusions,  cracks and selective micro defects, especially of laminates, large area adhesions (e.g. heatsinks) and DCB substrates.
  • Run-time analysis to describe material inhomogeneity.
  • Ultrasonic scans are documented as files or color printed images.

Equipment

Ultrasonic microscope SONOSCAN C-SAM® Gen5™
  • Changeable transducers with the following frequencies and lateral resolutions:
    • 10 MHz: 250 µm
    • 15 MHz: 175 µm
    • 20 MHz: 125 µm
    • 30 MHz: 75 µm
    • 50 MHz: 50 µm
    • 60 MHz: 30 µm
    • 100 MHz: 25 µm
    • 230 MHz: 10 µm
  • Investigation depth up to some millimeters depending on the frequency and the material
  • Investigation methods C-Scan, Q-BAM™, THRU-Scan™
  • VRM™ (complete storage of echo signals of the specimen), regenerating of defect images of any layer, extraction of three-dimensional information, run-time topography
  • Coupling medium: de-ionised water
PD Dr.-Ing. habil.
Martin Oppermann
Phone:
(0351) 463 35051
X-ray diagnostics
X-ray diagnostics
Radiography of BGA solder joints using oblique view
Volume model of a tomography of a passives solder joint

X-ray radiography

Service

  • Non-destructive inspection of electronic devices and modules, especially with high contrastive materials (solder, metallisation), e.g.:
    • Standard- and fine-pitch-SMT and THT solder joints
    • BGA-, COB-, CSP- and Flip-Chip solder joints
    • Missing and imperfect solder joints
    • Displacement
    • Shorts
    • Solder joint analysis (voids, ...)
    • Multilayer PCB

    Equipment

    • X-ray microscope phoenix|x-ray nanome|x
      • high resolution vertical or oblique view up to 70°
      • high resolution real time image processing or alternatively digital detector
      • CCD camera: 1126 x 1600 pixel, 12 bit
      • Digital detector: 1920 x 1536 pixel, 14 bit
      • geometrical magnification: > 1.000 times
      • minimal detail visibility: 400nm

X-ray Computer Tomography

Services

  • Volume analysis and reconstruction of electronic devices and modules

Equipment

  • X-ray Computer Tomography equipment nanotom
    • open nanofocus tube with tungsten target
    • acceleration voltage: 10 – 180kV / 15W
    • beam current: 5 – 1.000µA
    • precision manipulation on a granit base
    • high resolution digital detector with 2.400 x 2.400 Pixel, 12 bit
    • pixel size: 50µm x 50µm
    • minimal voxel size: < (500nm x 500nm x 500nm)
    • geometric magnification: 1,7-times…1.000-times
    • maximal specimen size/ weight: h = 150mm, d = 120mm, m = 1kg
    PD Dr.-Ing. habil.
    Martin Oppermann
    Phone:
    (0351) 463 35051
    Metallographic preparation of packages
    Metallographic preparation of packages

    Services

    • Preparation of a target layer
    • Analysis of microstructures, cracks, delaminations and voids (e.g. for packaging qualification after thermal-mechanical stress)
    • Measurement of structure size, like intermetallics, lengths, layer thicknesses
    • Documentation and reporting of the results

    Equipment

    • Grinding and polishing: TegraSystem (TegraForce-5, TegraPol-35)
    • Precision sectioning saws: IsoMet 1000 (bis 1000 RPM), Accutom-2 (3000 RPM)
    • Microscopy: Leica DM4000 M (max. magnification 1000x) and digital camera (2080x1544 pixel)
      • Reflected light methods: bright field, dark field, polarized light, differential
        interference contrast
    • Database image management system
    Frank Schumann
    Phone:
    (0351) 463 36408
    Storage testing, accelerated aging
    Storage testing, accelerated aging

    Service

    • Temperature profile detection
    • Off-line measurement
    • On-line measurement
      • Zero-Ohms resistance measurement
      • Failure detection with defined shut down of cycle chambers
      • Voltage measurement

    Equipment

    • Temperature test chamber
      • Single chamber system Feutron TPK 600
      • Temperature range: -70 °C to 180 °C
      • Temperature gradient: 10K/min (-55 °C to 150 °C)
    • Power cycle chamber
      • Two chamber system Feutron TSK 200
      • Hot chamber: 10 °C to 200 °C
      • Cold chamber: -75 °C to 180 °C
    • Zerol-Ohm measurement system
      • Four-point resistance measurement
        • Software controlled
        • Temperature triggered
      • Keithley-Delta-Mode System
        • Nano volt meter Keithley Modell 2182A
        • Current source Keithley Modell 6121
      • 128 channel multiplexer
      • Voltage measurement
    • Isothermal storage
      • Temperature range: -80 °C to 300 °C
    Dr.-Ing.
    Karsten Meier
    Phone:
    (0351) 463 36594
    Note
    Additional information about equipment and services and how you can use it can be found following the links below: