Seniorprofessoren
Vita
Karlheinz Bock studierte ab 1979 Allgemeine Elektrotechnik an der Universität des Saarlandes. Nach Abschluss seines Studiums 1986 und nach Industrietätigkeit als Systemanalysator bei Kappmeyer & Partner wechselte er 1989 an das Institut für Hochfrequenztechnik der TU Darmstadt und forschte auf dem Gebiet der hochfrequenten integrierten Schaltungen und deren Zuverlässigkeit bei Professor Hans Hartnagel. Im Jahr 1994 promovierte er auf dem Gebiet der feldemissionsbasierten ESD-Schutzschaltungen für GaAs-Bauelemente und deren integrierte Mikrowellenschaltungen.
Nach Aufenthalten in Japan an der Tohoku Universität in Sendai und am IMEC in Leuven, Belgien, arbeitete er seit 1999 bei der Fraunhofer Gesellschaft, seit 2001 am Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM in München (seit 2010 EMFT) als Leiter der Abteilung Polytronik und Multifunktionale Systeme an der Entwicklung von dünnen und flexiblen Systemen und an Technologien für chemische und biologische Sensoren und bioanalytische Systeme. Von März 2008 bis September 2014 war er parallel auch als Professor für Polytronische Mikrosysteme an der TU Berlin berufen. Ihm wurde im Jahr 2012 der Ehrendoktor von der Polytechnischen Universität in Bukarest, Rumänien, verliehen. Von Oktober 2014 bis September 2025 diente er als Professor für Aufbau- und Verbindungstechnik der Elektronik und als Direktor des Instituts für Aufbau- und Verbindungstechnik (IAVT) an der TU Dresden. Seit 1.10.2025 ist Prof. Bock Seniorprofessor am IAVT.
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Referenzen
2025
Dev, S.; Catuneanu, M.; He, M. et. al.
Silicon nitride-based integrated photonic platform for applications in trustworthy communication systems
Proc. SPIE 13530, Integrated Optics: Design, Devices, Systems, and Applications VIII, 1353003 (5 June 2025); https://doi.org/10.1117/12.3056489.
Nieweglowski, K.; Patela, S.; Köst, V. C.; Weyers, D.; Śniadek, P.; Laszczyk, K.; Lettrichova, I.; Pudis, D.; Walczak, R.; Bock, K.
International Collaborative Hands-on Activities on Advanced Electronics and Photonics for Higher Education Using 3D Printing Techniques
2025 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 2025, pp. 1-6, doi: 10.1109/ISSE65583.2025.11120902.
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Characterization and modeling of solder interconnects for wafer level packaging applications subjected to low cycle fatigue stress
Journal of IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025, DOI: 10.1109/TCPMT.2025.3592042
Patrizi, G.; Carratù, M.; Meier, K.; Sommella, P.; Pietrosanto, A.; Bock, K.; Ciani, L.
Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling
Proceedings of the 2025 IEEE Instrumentation and Measurement Technology Conference (I2MTC)
Haeusler, M.; Meier, K.; Lyu, S; Bock, K.
Isothermal Shock Testing on Flip-Chip Interconnects
Proceedings of the IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas (US), 2025, DOI: 10.1109/ECTC51687.2025.00130
Singh, P. K.; Geisler, H.; Machani, K. V.; Breuer, D.; Meier, K.; Kuechenmeister, F.; Bock, K.
Temperature-dependent Material Characterization of Back-end-of-line Copper with Nanoindentation for FEM-based Wafer Warpage Prediction
Proceedings of the IEEE 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht (Netherlands), 2025, DOI: 10.1109/EuroSimE65125.2025.11006541
Lyu, C.; Meier, K.; Bock, K.
Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads
Proceedings of the IEEE 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht (Netherlands), 2025, DOI: 10.1109/EuroSimE65125.2025.11006543
Alfonso, C. G.; Meier, K.; Albrecht, O.; Qi, Y.; Patrizi, G.; Ciani, L.; Grasso, F.; Bock, K.
Machine Learning Modelling for Electronic Reliability Analysis in Solder Joints
Proceedings of the IEEE 48th International Spring Seminar on Electronics Technology (ISSE), Budapest (Hungary), 2025, DOI: 10.1109/ISSE65583.2025.11121026
2024
Köst, V. C.; Fekri, Z.; Zscharchuch, J.; Garcia Valenzuela, A.; Nieweglowski, K.; Erbe, A.; Bock, K.
Evaluation und Weiterentwicklung eines Permeationssetups zur Charakterisierung von Polymermembranen
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Patela, S.; Nieweglowski, K.; Sniadek, P.; Laszczyk, K.; Köst, V.; Weyers, D.; Lettrichova, I.; Pudis, D.; Bock, K.; Walczak, R.
Integrating 3D printing into higher education curricula for electronics: challenges and opportunities
ICERI2024 Proceedings, pp. 8384-8392, DOI: 10.21125/iceri.2024.2069.
Singh, P. K.; Mueller, M.; Geisler, H.; Hecker, M.; Richter, I.; Yu, M.; Breuer, D.; Machani, K. V.; Meier, K.; Kuechenmeister, F.; Bock, K.
Study on Effect of Microstructure Evolution on Wafer Warpage for High Temperature Annealed and Self-Annealed Copper Thin Films
Journal of IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 15 (3), p. 15, DOI: 10.1109/TCPMT.2025.3540216
Meyer, J.; Gierth, K. F. W.; Meier, K.; Bock, K.
Bond Strength Comparison of Commercial and Custom Copper Sinter Pastes under Sinter Process Modifications
Proceedings of the IEEE 26th Electronic Packaging Technology Conference (EPTC), Singapore, 2024, DOI: 10.1109/EPTC62800.2024.10909860
Patrizi, G.; Meier, K.; Haeusler, M.; Ciani, L.; Catelani, M.; Bock, K.
A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads
Proceedings of the 24th IMEKO World Congress (IMEKO), Hamburg (Germany), 2024
Häusler, M.; Meier, K.; Bock, K.
Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603578
Lyu, C.; Meier, K.; Bock, K.
Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603965
Stadermann, F.; Köst, V. C.; Nieweglowski, K.; Meier, K.; Bock, K.
Evaluation of Semipermeable Membranes for Encapsuling Gas Sensors in Human Intestinal Environments
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603601
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Mueller, M.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
Proceedings of the IEEE 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania (Italy), 2024, DOI: 10.1109/EuroSimE60745.2024.10491475
Nguyen, H.-H.; Meier, K.; Bock, K.
Numerical Study on the Correlation between Board-level Drop and Shock Tests for Chip-Scale Packages
Proceedings of the IEEE 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania (Italy), 2024, DOI: 10.1109/EuroSimE60745.2024.10491520
Meyer, J.; Metasch, R.; Meier, K.; Röllig, M.; Bock, K.
Mikrostrukturanalyse an Silbersinterkontakten unter Variation der Prozessparameter und Korrelation zu mechanischen Eigenschaften
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Knoch, P.; Meier, K.; Bock, K.
Entwicklung eines auf ultradünnem Glas basierten Absolutdrucksensors für Hochtemperaturanwendungen
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Krzysztof Nieweglowski, David Weyers, Akash Mistry und Karlheinz Bock
Microprinting process development enabling cost effective, high density and flexible electro-optical integration
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1790-1796, doi: 10.1109/ECTC51529.2024.00298.
Ernst, D.; Nieweglowski, K.; Bock, K.
Spannungsreduzierte Kontaktierungen in dehnbaren Elektroniksystemen
12. DVS/GMM-Fachtagung, Elektronische Baugruppen und Leiterplatten "EBL 2024", Fellbach, 05.03.2024
2023
Fekri, Z.; Köst, V. C.; Zscharchuch, J.; Lambeva,N.; Watanabe, K.; Taniguchi, T.; Bock, K. and Erbe, A.
Field effect transistor CO 2 detector based on few layers of black phosphorus
IEEE Nanotechnology Materials and Devices Conference (NMDC), Oct. 2023
https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=10344220
David Weyers, Krzysztof Nieweglowski und Karlheinz Bock
Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), Cambridge, United Kingdom, 2023, pp. 1-8, doi: 10.23919/EMPC55870.2023.10418392.
David Weyers, Mircea-Traian Catuneanu, Margarita Lapteva, Vinya Vibhuti, Menglong He Sascha Boenhardt, Matthias Landwehr, Johann Fell, Krzysztof Nieweglowski, Kambiz Jamshidi und Karlheinz Bock
Electro-optical co-integration platform for high-density hybrid systems – SILHOUETTE
MikroSystemTechnik Kongress 2023; Kongress, Dresden, Deutschland, 2023, pp. 774-781.
Albrecht, O.; Hoehne, R.; Barkur, D.; Meier, K.; Bock, K.
Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder Interconnects
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Meyer, J.; Gierth, K. F. W.; Meier, K.; Bock, K.
Feasibility and Optimisation of Cu-Sintering under Nitrogen Atmosphere
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Mueller, M.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Singh, P. K.; Rohlfs, P.; Sandmann, G.; Machani, K. V.; Breuer, D.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging
Proceedings of the 24th European Microelectronics and Packaging Conference (EMPC), Hinxton (UK), 2023
Yin, R.; Morath, H. P. E.; Hoyer, C.; Nieweglowski, K.; Meier, K.; Wagner, J.; Ellinger, F.; Bock, K.
Characterization of Embedded and Thinned RF Chips
Proceedings of the 24th European Microelectronics and Packaging Conference (EMPC), Hinxton (UK), 2023
Dudash, V.; Machani, K. V.; Boehme, B.; Capecchi, S.; Ok, J.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling
Proceedings of the IEEE International Reliability Physics Symposium (IRPS), Monterey, CA (USA), 2023, DOI: 10.1109/IRPS48203.2023.10117636
Hoehne, R.; Meier, K.; Reim, M.; Lehmann, M.; Bock, K.
Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill
Proceedings of the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz (Austria), 2023, DOI: 10.1109/EuroSimE56861.2023.10100809
Singh, P. K.; Machani, K. V.; Breuer, D.; Hecker, M.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer
Proceedings of the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz (Austria), 2023, DOI: 10.1109/EuroSimE56861.2023.10100826
Hoehne, R. ; Albrecht, O.; Yichen, Q.; Meier, K.; Bock, K.
Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA
Proceedings of the IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL (USA), 2023, DOI: 10.1109/ECTC51909.2023.00202
Singh, P. K.; Müller, M.; Machani, K. V.; Breuer, D.; Hecker, M.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
Proceedings of the 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023, DOI: 10.1109/IITC/MAM57687.2023.10154658
2022
Albrecht, O.; Meier, K.; Schaulin, M.; Toussaint, P.-L.; Gamba, B.; Cruz, R.; Vernhes, P.; Goetze, C.; Bock, K.
Warpage Measurements to Support the Development of mmWave Modules
Proceedings of the 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis, Berlin (Germany), 2022
Albrecht, O.; Meier, K.; Schaulin, M.; Toussaint, P.-L.; Gamba, B.; Cruz, R.; Vernhes, P.; Goetze, C.; Bock, K.
Warpage measurements to support the development of mmWave modules
Microelectronics Reliability, Vol. 138, 2022, DOI: 10.1016/j.microrel.2022.114731
Yin, R.; Pechnig, C.; Nieweglowski, K.; Meier, K.; Bock, K.
Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips
Proceedings of the IEEE 45th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology Innovations towards Green Electronics, Vienna, (Austria), 2022, DOI: 10.1109/ISSE54558.2022.9812790
Dudash, V.; Meier, K.; Machani, K. V.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Design of reliability test assemblies for WLCSP solder interconnects using finite element modeling
Proceedings of the IEEE 45th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology Innovations towards Green Electronics, Vienna, (Austria), 2022, DOI: 10.1109/ISSE54558.2022.9812715
Meier, K.; Schaulin, M.; Goetze, C.; Wieland, M.; Bock, K.
Board Level Reliability Study on Large Antenna-in-Package Solutions for Automotive Radar Applications
Proceedings of the 24th Electronic Packaging Technology Conference (EPTC), Singapore, 2022, DOI: 10.1109/EPTC56328.2022.10013234
Yin, R.; Nieweglowski, K.; Meier, K.; Bock, K.
Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterization
Proceedings of the 24th Electronic Packaging Technology Conference (EPTC), Singapore, 2022, DOI: 10.1109/EPTC56328.2022.10013121
Meier, K.; Bock, K.; Endisch, C.; Schulze, R.; Reichel, L.; Knoch, P.; Esche, M.
Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature Application
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939433
Heine, M.; Meier, K.; Wenzel, L.; Goetze, C.; Bock, K.
Reliability Improvement of Large BGA-Packages Using Sidefill-Support
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939434
Yin, R.; Nieweglowski, K.; Meier, K.; Bock, K.
Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939532
Meyer, J.; Meier, K.; Bock, K.
LogiPow – Leiterplattentechnologieentwicklung zur Integration von Leistungselektronik und Logik
Elektronische Baugruppen und Leiterplatten EBL 2022 Intelligentes Design, Intelligente Fertigung, Prüfung und Applikation, 11. DVS/GMM-Fachtagung, Fellbach, 2022
Akash Mistry; David Weyers; Krzysztof Nieweglowski; Karlheinz Bock
Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, 2022, pp. 01-07, doi: 10.1109/ESTC55720.2022.9939534.
David Weyers; Krszystof Nieweglowski; Karlheinz Bock
Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDL
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, 2022, pp. 405-409, doi: 10.1109/ESTC55720.2022.9939517.
Ernst, D.; Nieweglowski, K.; Bock, K.
Feasibility Study of Magnetically Enhanced Interconnects for Integration of Flexible and Stretchable Electronics
9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania
Franke, J.; Overmeyer, L.; Lindlein, N.; Bock, K.; Kaierle, S.; Suttmann, O.; Wolter. K.
Optical Polymer Waveguides
Springer Cham, 2022, ISBN 978-3-030-92853-7; https://doi.org/10.1007/978-3-030-92854-4
David Weyers; Akash Mistry; Krzystof Nieweglowski; Karlheinz Bock
Hybrid lithography approach for single mode polymeric waveguides and out-of-plane coupling mirrors
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, pp. 1919-1926, doi: 10.1109/ECTC51906.2022.00301.
2021
Lorenz, Lukas; Hanesch, Florian; Nieweglowski, Krzysztof; Hamjah, Mohd-Khairulamzari; Franke, Jörg; Hoffmann, Gerd-Albert; Overmeyer, Ludger; Bock, Karlheinz
Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers
Proceedings of IEEE 71th Electronic Components and Technology Conf. (ECTC), pp. 14-21, doi: 10.1109/ECTC32696.2021.00014
Weyers, D.; Nieweglowski, K.; Lorenz, L.; Bock, K:
Analysis of polymeric singlemode waveguides for inter-system communication
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021,
pp. 1-7, doi: 10.23919/EMPC53418.2021.9584994
Ernst, D.; Nieweglowski, K.; Schubert, M.; Bock, K.
Magnetically Enhanced Stretchable Interconnects for Human- Machine Interface
MikroSystemTechnik Kongress 2021, Ludwigsburg, 08.-10.11.2021
Hoehne, R.; Leslie, D.; Meier, K.; Dasgupta, A.; Bock, K.
Improved Damage Modeling for Solder Joints under Combined Vibration and Temperature Cycling Loading
IEEE 71st Electronic Components and Technology Conference (ECTC), DOI: 10.1109/ECTC32696.2021.00218
Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Board Level Temperature Cycling Reliability of mmWave Modules on Hybrid Substrates
IEEE 71st Electronic Components and Technology Conference (ECTC), DOI: 10.1109/ECTC32696.2021.00151
Chaudhuri, A.; Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Warpage Behaviour and Thermo-Mechanical Robustness of Large Packages for mmWave Applications
IEEE 44th International Spring Seminar on Electronics Technology (ISSE), DOI: 10.1109/ISSE51996.2021.9467580
Meier, K.; Ochmann, M.; Leslie, D.; Dasgupta, A.; Bock, K.
The effect of low temperature conditions on vibration durability of SAC105 interconnects
Journal Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114160
2020
K. Nieweglowski, L. Lorenz, T. Ackstaller, K. Bock
3D-Integration für elektro-optische Systeme auf Modulebene
Tagungsband von EBL 2020 - Elektronische Baugruppen und Leiterplatten
Fellbach, 18-19 Februar 2020
Nieweglowski, K.; Lorenz, L.; Catuneanu, M.; Jamshidi, K. & Bock, K.
Electro-optical co-integration of chip-components in optical transceivers for optical inter-chip communication
IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 139-147, doi: 10.1109/ECTC32862.2020.00035.
Schubert, M.; Wambera, L.; Mudrievska, O.; Nieweglowski, K.; Wagner, J.; Partzsch, J.; Mayr, C.; Ellinger, F.; Bock, K.
Flexible and stretchable redistribution layer with embedded chips for human-machine interface
IEEE 8th Electronics System-Integration Technology Conference (ESTC), Vestfold, Norway, doi: 10.1109/ESTC48849.2020.9229694.
Schaulin, M.; Bock, K.
Flexible Aufbau- und Verbindungstechnik für die mobile in-vivo Blutspektrometrie
Elektronische Baugruppen und Leiterplatten (EBL), 10. DVS/GMM-Fachtagung, Fellbach, 2020.
L. Lorenz; F. Hanesch; K. Nieweglowski; Y. Eiche; J. Franke; G.-A. Hoffmann; L. Overmeyer; K. Bock
3D-Opto-MID for Asymmetric Optical Bus Couplers
IEEE Electronics System-Integration Technology Conference (ESTC), Vestfold, Norway, 2020
Ackstaller, T.; Meier, K.; Bock, K.
A Finite Element Study on Acceleration of Reliability Testing for Solder Interconnects
Proceedings of the 43rd International Spring Seminar on Electronics Technology (ISSE) Trends in Microelectronics Packaging and Interconnection Technology, virtual event, 2020
Knoch, P.; Meier, K.; Luniak, M.; Bock, K.
Deposition Technologies for Electronic Systems Based on Ultra-Thin Glass
Proceedings of the 43rd International Spring Seminar on Electronics Technology (ISSE) Trends in Microelectronics Packaging and Interconnection Technology, virtual event, 2020
Ochmann, M.; Leslie, D.; Meier, K.; Dasgupta, A.; Bock, K.
The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), virtual event, 2020
Meier, K.; Wambera, L.; Boehme, B.; Goetze, C.; Capecchi, S.; Paul, J.; Wieland, M.; Bock, K.
Reliability Testing of FCCSP Packages for Automotive Applications
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virutal event, 2020
Knoch, P.; Meier, K.; Luniak, M.; Esche, M.; Bock, K.
Ultra-Thin Glass Based Temperature Sensor Package for High Temperature Applications
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virtual event, 2020
Meier, K.; Ochmann, M.; Leslie, D.; Dasgupta, A.; Bock, K.
Low Temperature Vibration Reliability of Lead-free Solder Joints
Proceedings of the 68th Electronic Components and Technology Conference (ECTC), virtual event, 2020
Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Reliability Assessment of mmWave Modules
Proceedings of the 70th Electronic Components and Technology Conference (ECTC), virtual event, 2020; DOI: 10.1109/ECTC32862.2020.00125
Meyer, J.; Bickel, S.; Meier, K.; Bock, K.
Thermische Charakterisierung Eingebetteter Bauelemente zur Strukturüberwachung - Thermal Characterisation of Embedded Components for Structural Monitoring
Elektronische Baugruppen und Leiterplatten EBL 2020 Technologische Plattform für die digitale Transformation, 10. DVS/GMM-Fachtagung, Fellbach, 2020
L. Lorenz; T. Ackstaller; K. Bock
Stereolithographic printed polymers on ceramic for 3D-opto-MID
Proc. of SPIE Vol. 11349 (3D Printed Optics and Additive Photonic Manufacturing II), SPIE Photonics Europe, France, 2020
L. Lorenz; K. Nieweglowski; Z. Al-Husseini; N. Neumann; D. Plettemeier; T. Reitberger; J. Franke; K. Bock
Aerosol Jet Printed Optical Waveguides for Short Range Communication
IEEE Journal of Lightwave Technology
DOI: 10.1109/JLT.2020.2983792
2019
Schaulin, M.; Zaunseder, S.; Schmidt, M.; Bock, K.
Aufbau und Verbindungstechnik für Mobile In-vivo Blutspektrometrie
MikroSystemTechnik Kongress (MST), Berlin, 2019
Nieweglowski, K.; Lorenz, L.; Ellinger, F.; Fettweis, G.P.; Bock, K.
Electro-optical co-integration of chip-components for optical and wireless communication in high-performance computing systems
50th IEEE Semiconductor Interface Specialists Conference, San Diego, USA
Meier, K.; Meyer, J.; Schein, F.-L.; Sirkeci, D.; Ostmann, A.; Oertel, E.; Westphal, H.; Lang, K.-D.; Bock, K.
Reliability of Substrate Embedded Rectifiers for High Voltage Applications
Proceedings of the 21st Electronic Packaging Technology Conference (EPTC), Singapore, 2019
Meier, K.; Leslie, D.; Dasgupta, A.; Roellig, M.; Bock, K.
Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading
Proceedings of the 21st Electronic Packaging Technology Conference (EPTC), Singapore, 2019
Schubert, M.; Rasche, J.; Laurila, M.-M.; Tiina Vuorinen, T.; Mäntysalo, M.; Bock, K.
Printed Flexible Microelectrode for Application of Nanosecond Pulsed Electric Fields on Cells
Materials 2019, 12(17):2713.
Nieweglowski, K.; Lorenz, L.; Tiedje, T.; Lüngen, S.; Bock, K.
Elektrooptische Systemintegration für optische Chip-to-Chip Kurzstreckenverbindungen
Tagungsband von MST Kongress 2019, Berlin
Ackstaller, T.; Lorenz, L.; Nieweglowski, K.; Bock, K.
Combination of thick-film hybrid technology and polymer additive manufacturing for high-performance mechatronic integrated devices
Proc. of 42nd International Spring Seminar on Electronics Technology (ISSE)
Bickel, S.; Meier, K.; Roellig, M.; Bock, K.
Manufacturing and reliability issues of highly integrated packages for power electronic applications
Proceedings of the 42nd International Spring Seminar on Electronics Technology (ISSE) Advances in Printed and Ceramic Microsystems, Wroclaw (Poland), 2019
Meier, K.; Leslie, D.; Storz, T.; Dasgupta, A.; Bock, K.
Harmonic Vibration Durability Tests on Lead-Free Solder Alloys at Different Isothermal Conditions
Proceedings of the 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Hannover (Germany), 2019
Meier, K.; Wambera, L.; Boehme, B.; Goetze, C.; Paul, J.; Bock, K.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
Proceedings of the Advanced Packaging Conference, Munich (Germany), 2019
Meier, K.; Winkler, M.; Leslie, D.; Dasgupta, A.; Bock, K.
Fatigue Behaviour of Lead-Free Solder Joints Under Combined Thermal and Vibration Loads
Proceedings of the 69th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada (USA), 2019
Lorenz, L.; Reitberger, T.; Franke, J.; Bock, K.
Aerosol Jet-gedruckte optische Wellenleiter für 3D-Opto-MID
Produktion von Leiterplatten und Systemen (PLUS) 5/2019, S. 755-757, Eugen G. Leuze Verlag, Bad Saulgau
Wambera, L.; Meier, K.; Höhne, R.; Böhme, B.; Götze, C.; Paul, J.; Wieland, M.; Bock, K.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover, Germany, March 24-27; DOI: 10.1109/EuroSimE.2019.8724515
Christian Maleck, Gottfried Nieke, Karlheinz Bock, Detlef Pabst, Meinhard Schulze, Marcel Stehli
A Robust Multi-Stage Scheduling Approach for Semiconductor Manufacturing Production Areas with Time Constraints
30th Annual SEMI® Advanced Semiconductor Manufacturing Conference
Lorenz, L.; Ott, L.; Nieweglowski, K.; Reitberger, T.; Franke, J.; Bock, K.
Evaluation of the Coupling Performance and Long-Term Stability of Aerosol Jet Printed and Photolithographic Manufactured Waveguides for Asymmetric Optical Bus Couplers
Proc. of SPIE Vol. 10924 (Optical Interconnects XIX), SPIE Photonics West, San Francisco, USA, 2019
2018
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Microelectronics Reliability 2018, vol. 87, 125-132; https://doi.org/10.1016/j.microrel.2018.06.003
Nieweglowski, K.; Fritsche, D.; Seiler, P.; Lüngen, S.; Carta, C.; Ellinger, F.; Plettemeier, D.; Bock, K.
Interconnect technology development for 180GHz wireless mm-wave system-in-foil transceivers
Proc. of IEEE 68th Electronic Components and Technology Conf. (ECTC), pp. 527–532
Nieweglowski, K.; Lorenz, L.; Lüngen, S.; Tiedje, T.; Wolter, K.-J.; Bock, K.
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
Microelectronics Reliability, vol. 84, pp. 121–126
Tiedje, T.; Lüngen, S.; Nieweglowski, K.; Bock, K.
Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?
Proc. of 7th Electronic System-Integration Technology Conference (ESTC)
Lüngen, S.; Tiedje, T.; Meier, K.; Nieweglowski, K.; Bock, K.
Reliability of 3D additive manufactured packages
Proceedings of 7th Electronic System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Maleck, C.; Nieke, G.; Bock, K.; Pabst, D.; Stehli, M.
A Comparison of an CP and MIP Approach for Scheduling Jobs in Production Areas with Time Constraints and Uncertainties
Proceedings of the 2018 Winter Simulation Conference, Pages: 3526-3537, Gothenburg, Sweden, December 9-12, 2018
Nieke, G.; Stehli, M.; Kalisch, S.; Maleck, C.; Bock. K.
A Mathematical Model for the External Scheduling of a Cluster Tool Workstation
Proceedings of the 2018 Winter Simulation Conference, Pages: 3538-3549, Gothenburg, Sweden, December 9-12, 2018
Schloß, D.; Bock, K.
A CP model for a scheduling problem with limited secondary resources compared to a DES model
Proceedings of the 2018 Winter Simulation Conference, IEEE, Pages 3684-3695, December 9-12. Gothenburg, Sweden
Reitberger, T.; Stoll, T.; Hoffmann, G.-A.; Lorenz, L.; Neermann, S.; Overmeyer, L.; Bock, K.; Wolter, K.-J.; Franke, J.
The future of short-range high-speed data transmission: printed polymer optical waveguides (POW) innovation, fabrication, and challenges
SPIE Optics + Photonics, San Diego, USA
Schubert, M.; Wang, Y.; Rebohle, L.; Schumann, T.; Vinnichenko, M.; Fritsch, M.; Bock, K.
Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Application
7th Electronic System-Integration Technology Conference (ESTC), DOI: 10.1109/ESTC.2018.8546494
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Two-Stage Simulation for Coupling Schemes in the Device Communication using Ray Tracing and Beam Propagation Method
7th Electronics System-Integration Technology Conference (ESTC), Dresden
Ernst, D.; Menzel, S.; Brachmann, E.; Bock, K.
Realization of wire bond interconnecting process stable for high temperature applications with platinum wire and SAW sensors
Surface Acoustic Wave Sensor & Actuator (SAW) Symposium, Dresden, Germany, 2018
Ernst, D.; Brachmann, E.; Menzel, S.; Bock, K.
Wire Bonding of Surface Acoustic Wave (SAW) Sensors for High Temperature Applications
7th Electronics System-Integration Technology Conference (ESTC), Dresden, Germany, 2018
Meier, K.; Liu, Y.; Bock, K.
Investigation of Solder Joint Reliability under High Temperature Vibration
Proceedings of the 41st International Spring Seminar on Electronics Technology (ISSE) Research and Development Tendencies in Advanced Electronics Technologies, Zlatibor (Serbia), 2018
Meier, K.; Roellig, M.; Bock, K.
Developments for Highly Reliable Electronics – Experiments on Combined Thermal and Vibration Loading
Proceedings of the 68th Electronic Components and Technology Conference (ECTC), San Diego, California (USA), 2018
2017
Tiedje, T.; Lüngen, S.; Schubert, M.; Luniak, M.; Nieweglowski, K.; Bock, K.
Will low-cost 3D additive manufactured packaging replace the fan-out wafer level packages?
Proc. of IEEE 67th Electronic Components and Technology Conf. (ECTC), pp. 1065–1070
Lüngen, S.; Charania, S.; Tiedje, T.; Nieweglowski, K.; Killge, S.; Lorenz, L.; Bartha, J.; Bock, K.
3D optical coupling techniques on polymer waveguides for wafer and board level integration
Proc. of IEEE 67th Electronic Components and Technology Conf. (ECTC), pp. 1612–1618
Charania, S.; Lüngen, S.; Al-Husseini, Z.; Killge, S.; Nieweglowski, K.; Neumann, N.; Plettemeier, D.; Bock, K.; Bartha, J. W.
Micro structured coupling elements for 3D silicon optical interposer
in Integrated Optics: Physics and Simulations III, vol. 10242 of Proceedings of SPIE, pp. 0V:1–0V:10
Nieweglowski, K.; Tiedje, T.; Schöniger, D.; Henker, R.; Ellinger, F.; Bock, K.
Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication
in Optical Fibers and Their Applications, vol. 10325 of Proceedings of SPIE, pp. 0V:1–0V:7
Henker, R.; Schoeniger, D.; Belfiore, G.; Szilagyi, L.; Pliva, J.; Khafaji, M.; Ellinger, F.; Nieweglowski, K.; Tiedje, T. ; Bock, K.
Tunable broadband integrated circuits for adaptive optical interconnects
in Optical Fibers and Their Applications, vol. 10325 of Proceedings of SPIE, pp. 0V:1–0V:7
Meier, K.; Roellig, M.; Liu, Y.; Bock, K.
Solder Joint Fatigue Analysis under Combined Thermal and Vibration Loading
Proceedings of the 19th Electronics Packaging Technology Conference (EPTC), Singapore, 2017
Schubert, M.; Friedrich, S.; Wedekind, D.; Zaunseder, S.; Malberg, H.; Bock, K
3D printed flexible substrate with pneumatic driven electrodes for health monitoring
21st European Microelectronics and Packaging Conference (EMPC), pp. 1-5, DOI: 10.23919/EMPC.2017.8346846
Schubert, M.; Schmidt, M.; Wolter, P.; Malberg, H.; Zaunseder, S.; Bock, K.
Additively Manufactured Pneumatically Driven Skin Electrodes
Materials. 2018; 11(1):19.
Lorenz, L.; Nieweglowski, K.; Al-Husseini, Z.; Neumann, N.; Plettemeier, D.; Wolter, K.-J.; Reitberger, T.; Franke, J.; Bock, K.
Asymmetric optical bus coupler for interruption-free short range connections on board and module level
IEEE Journal of Lightwave Technology Vol.35 (18), S. 4033-4039
DOI: 10.1109/JLT.2017.2728198
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Hoffmann, G.-A.; Overmeyer, L.; Reitberger, T.; Franke, J.; Bock, K.
Additive waveguide manufacturing for optical bus couplers by aerosol jet printing using conditioned flexible substrates
IMAPS 21st European Microelectronics Packaging Conf. (EMPC), Warschau, Polen
Lorenz, L.; Nieweglowski, K.; Reitberger, T.; Franke, J.; Wolter, K.-J.; Bock, K.
Asymmetric optical bus couplers with Aerosol Jet printed polymer waveguides
118th Annual Meeting of the DGaO, Dresden
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Fatigue Measurement Setup under Combined Thermal and Vibration Loading on Electronic SMT Assembly
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
Meier, K.; Bock, K.
Developments for Highly Reliable Consumer Electronics
Proceedings of the 8th Electronic Materials and Processes for Space (EMPS) Workshop, Nordwijk, 2017
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Loosen, F.; Lindlein, N.; Bock, K.
Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers
IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 14, No.1 pp.1-10, http://dx.doi.org/10.4071/imaps.530
2016
Schubert, M.; Berg, H.; Friedrich, S.; Bock, K.
Evaluation of Dispensed Carbon Nanotube Ink on Flexible Substrates for Biocompatible Application
6th Electronic System-Integration Technology Conference (ESTC), 2016 6th), DOI: 10.1109/ESTC.2016.7764737
Berg, H.; Schubert, M.; Friedrich S.; Bock, K.
Screen printed conductive pastes for biomedical electronics
39th International Spring Seminar on Electronics Technology (ISSE), DOI: 10.1109/ISSE.2016.7562870
Ernst, D.; Menzel, S.; Brachmann, E.; Bock, K.
Platinum Wire Bonding for High Temperature Sensor Applications
Surface Acoustic Wave Sensor & Actuator Symposium, Dresden, Germany, 2016
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Analysis of bending effects for optical-bus-couplers
IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas
Nieweglowski, K.; Bock, K.
Assembly of optical transceivers for board-level optical interconnects
Proc. SPIE 9888, Micro-Optics 2016, 98880S (April 27, 2016); doi:10.1117/12.2227903
Tiedje, T.; Meier, K.; Bock, K.
Experimental Methodology for Low Temperature Vibration Investigations on Electronic Modules
Proceedings of the 39th International Spring Seminar on Electronics Technology (ISSE) Printed electronics and smart textiles, Pilsen (Czech Republic), 2016
Meier, K.; Röllig, M.; Bock, K.
Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Elektronische Baugruppen und Leiterplatten EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit?, 8. DVS/GMM-Fachtagung, Fellbach, 2016
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Simulation of bended planar waveguides for optical bus couplers
Proc. SPIE 9889, Optical Modelling and Design IV
2015
Schubert, M.; Kirsten, S.; Voitsekhivska, T.; Bock, K.
Characterization of Polymeric Encapsulation for Implantable Microsystems Applying Dynamic Fluidic and Electrical Load
38th International Spring Seminar on Electronics Technology (ISSE), pp. 129-133, DOI: 10.1109/ISSE.2015.7247976
Lorenz, L.; Rieske, R.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Wafer-Level Integration Technology for Multi Emitter High Power Fiber Coupled Lasers
Proc. of IMAPS 20th European Microelectronics Packaging Conf. (EMPC), pp.: 1-6
Nieweglowski, K.; Lorenz, L.; Wolter, K.-J.; Bock, K.
Multichannel optical link based on polymer multimode waveguides for boardlevel interchip communication
Proc. of IMAPS 20th European Microelectronics Packaging Conf. (EMPC), pp.: 1-7
Voitsekhivska, T.; Zörgiebel, F.; Suthau, E.; Wolter, K.-J.; Bock, K. and Cuniberti, G.
pH measurements of FET-based (bio)chemical sensors using portable measurement system
37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’15), pp. 6445-6448, ISSN: 978-1-4244-9270-1/15
Meier, K.; Röllig, M.; Bock, K.
Untersuchung des Ausfallverhaltens von Lotkontakten unter Temperaturwechsel- und Vibrationsbelastung
VDE GMM 6. Mikrosystemtechnik-Kongress, Karlsruhe, 2015
Nieweglowski, K.; Henker, R.; Schoeniger, D.; Ellinger, F.; Wolter, K. . J.; Bock, K.
Energy-Efficient Optical Interconnects for High Performance Computing
Fachzeitschrift PLUS, Ausgabe 1/2015, S. 137-124
Schubert, M.; Kirsten, S.; Bock, K.
Protective Function of Polymeric Encapsulation for Long-Term Implantable Microsystems
581. WE-Heraeus Seminar on "Flexible, Stretchable and Printable High Performance Electronics", Bad Honnef
2014
Tetzner, K.; Schroder, K. A.; Bock, K.
Photonic curing of sol-gel derived HfO2 Dielectrics for organic field-effect transistors
Ceramics International 2014, 40, 15753–15761
Bose, I.; Tetzner, K.; Borner, K.; Bock, K.
Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequncy RFID tags
Microelectronics Reliability 2014, 54, 1643–1647
Tetzner, K.; Bose, I. R.; Bock, K.
Organic Field-Effect Transistors Based on a Liquid-Crystalline Polymeric Semiconductor using SU-8 Gate Dielectrics on Flexible Substrates
Materials 2014, 7, 7226-7242
Tetzner, K.; Bock, K.
Development of Organic Field-Effect Transistors Based on Semiconducting Liquid-Crystal Polymers
Microelectronic Packaging in the 21st Century, Eds: R. Aschenbrenner, M. Schneider-Ramelow, Fraunhofer Verlag, 2014
2013
Tetzner, K.; Duffy, W.; Bock, K.
Performance spread reduction in organic field-effect transistors using semiconducting liquid-crystal polymers
Applied Physics Letters 2013, 103, 093304
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