Direktorin des IAVT
Frau Prof. Panchenko ist am Fraunhofer IZM ASSID Dresden tätig.
Vita
Frau Prof. Dr.-Ing. Juliana Panchenko studierte Mikroelektronik an der Nationalen Technischen Universität der Ukraine in Kyiv (M.Sc. Abschluss 2009). Ihre Masterarbeit (Mikrostrukturuntersuchungen an bleifreien Lotwerkstoffen) führte sie im Rahmen eines Forschungsaufenthalts im Jahr 2009 am Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT) der TU Dresden durch. Anschließend war sie am IAVT als wissenschaftliche Mitarbeiterin und Doktorandin tätig und erlangte ihre Promotion im Jahr 2013. In dieser Zeit war sie als Stipendiat im DFG-Graduiertenkolleg „Nano- und Biotechniken für das Packaging elektronischer Systeme“ sowie als Kollegiat in der SAB-Nachwuchsforschergruppe „Hochzuverlässige 3D-Mikrosysteme“ integriert und absolvierte einen halbjährigen Forschungsaufenthalt am IMEC in Belgien. Frau Panchenko hat sich während dieser Tätigkeit auf dem Gebiet der Mikroverbindungstechniken mit intermetallischen Phasen (SLID oder TLP) für 3D-Integration spezialisiert und dabei insbesondere auf dem Gebiet der Mikrostrukturanalyse (SEM, EDX, EBSD) international anerkannte Ergebnisse veröffentlicht. Seit Juli 2014 war sie als Juniorprofessorin für „Nanomaterials for Electronics Packaging“ am IAVT tätig und arbeitete gleichzeitig als Gruppenleiterin auf dem Gebiet der 3D-Systemintegration und des Wafer-Level-Packaging für 300 mm Wafer am Fraunhofer IZM-ASSID.
Ab März 2024 war Frau Prof. Panchenko Honorar-Professorin.
Ab 1.11.2025 ist Frau Prof. Panchenko Direktorin des IAVT.
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Referenzen
2022
Panchenko, I.; Wenzel, L.; Mueller, M.; Rudolph, C.; Hanisch, A.; Wolf J. M.
Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 3, pp. 410-421, March 2022. doi: 10.1109/TCPMT.2022.3149788.
Mueller, M.; Schindler, S.; Wolter, K.-J.; Wiese, S.; Panchenko, I.
Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermography
Thermochimica Acta, Volume 714, 2022, 179245.
ISSN 0040-6031, https://doi.org/10.1016/j.tca.2022.179245.
2020
Panchenko, I.; Wambera, L.; Mueller, M.; Rudolph, C.; Hanisch, A.; Bartusseck, I.; Wolf, M. J.
Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virutal event, 2020
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Balls
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 1, pp 18 -29, Jan. 2020; DOI: 10.1109/TCPMT.2019.2952093
2019
Wiese, S.; Mueller, M.; Čáp, D.; Barth, D.; Yuile, A.; Schindler, S.; Panchenko, I.
Temperature evaluation of solder joints for adjusting reflow profiles
22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, Pisa, Italy, 2019; DOI: 10.23919/EMPC44848.2019.8951800
2018
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Balls
7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 2019, DOI: 10.1109/ESTC.2018.8546391
M. Lykova, E. Langer, K. Hinrichs, I. Panchenko, J. Meyer, U. Künzelmann, M.J. Wolf, K.D. Lang
Characterization of self-assembled monolayers for Cu-Cu bonding technology
Microelectronic Engineering, Volume 202, 2018, pages 19-24, ISSN 0167-9317,
https://doi.org/10.1016/j.mee.2018.09.008
Lykova M., Panchenko I., Künzelmann, U., Reif J., Geidel M., Wolf J. M., and Lang K.-D.
Characterisation of Cu/Cu bonding using self-assembled monolayer
Soldering & Surface Mount Technology, Vol. 30, No. 2, Apr. 2018, pp. 106–111; DOI: 10.1108/SSMT-10-2017-0033
2017
Lykova M., Panchenko I., Geidel M., Reif J., Wolf J. M., and Lang K.-D.
Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration
40th International Spring Seminar on Electronics Technology (ISSE), Sofia, Bulgaria, May 10-14 (ISSE 2017 Award - Excellent Presentation Award for Young Scientist); DOI: 10.1109/ISSE.2017.8000916
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M. J.
Accelerated SLID Bonding for Fine-Pitch Interconnects with Porous Microstructure
IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, USA, May 30-June 2; DOI: 10.1109/ECTC.2017.231
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M. J.
Influence of Flux-Assisted Isothermal Storage on Intermetallic Compounds in Cu/SnAg Microbumps
40th International Spring Seminar on Electronics Technology (ISSE), Sofia, Bulgaria, May 10-14 (ISSE 2017 Award - Best Presentation Award for Young Scientist); DOI: 10.1109/ISSE.2017.8000909
Metasch, R.; Roellig, M.; Kuczynska, M.; Schafet, N.; Becker, U.; Meier, K.; Panchenko, I.
Accelerated Life Time Measurement with In-situ Force and Displacement Monitoring during Thermal Cycling on Solder Joints
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
2016
Mueller, M.; Türke, A.; Panchenko, I.
DSC investigation of the undercooling of SnAgCu solder alloys
39th International Spring Seminar on Electronics Technology (ISSE), Pilsen, Czech Republic, 2016, pp. 53-57; DOI: 10.1109/ISSE.2016.7563160
2014
Panchenko, I.; Grafe, J.; Mueller, M; Wolter, K.-J.; Wolf, M. J.; Lang, K.-D.
Processing and Microstructure of Solid-Liquid Interdiffusion Interconnects for 3D Integration
DATE Conference - Design, Automition and Test in Europe , Dresden, 24.03.-28.03.2014 , 2014
Panchenko, I.; Croes, K.; De Wolf, I.; De Messemaeker, J.; Beyne, E.; Wolter K.-J.
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Microelectronic Engineering, Vol. 17, April, 2014, pp. 26-34; DOI: 10.1016/j.mee.2013.12.003
2013
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Microstructure Investigation of the Cu/SnAg Solid-Liquid Interdiffusion Interconnects by Electron Backscatter Diffraction
15th Electronics Packaging Technology Conference (EPTC), Singapore, December 11-13 (Best Academic Paper Award)
2012
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Einfluss der Bondkraft auf die Qualität von Cu/SnAg SLID Verbindungen für 3D Integration
AVT-Tagung, Warstein, 12. Dezember, 2012 (Vortrag)
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Effects of Bonding Pressure on Quality of SLID Interconnects
4th Electronics Systemintegration Technology Conference (ESTC), Amsterdam, September 17 – 20, 2012
2011
Müller, M.; Panchenko, I.
Charakterisierung der Mikrostruktur von Loten mittels Electron Backscatter Diffraction (EBSD) (oral presentation)
Industriepartner Symposium, 06.Oktober, 2011, Dresden
Aryasomayajula, L.; Meier, K.; Saettler, P.; Panchenko, I.; Frömmig, M.; Graf, M.; Rieske, R.; Wolter, K.-J.
Integration Technologies for 3D Packaging
Workshop-GIT 2011, November 14-15, Atlanta Georgia, USA
Panchenko, I.; Wolter, K.-J.
Interconnect Technology for 3D Chip Integration (abstract, oral presentation)
XXXI International Scientific Conference “Electronics and Nanotechnology”, April 12th – 14th, 2011, Kyiv, Ukraine
Wolter, K.-J.; Meier, K.; Sättler, P.; Panchenko, I.; Frömmig, M.; Graf, M.
Bonding Technologies for 3D-Packaging
35th International Conference of IMAPS-CPMT IEEE, September 21st – 24th, Gdansk-Sobieszewo
Yeap, K.B.; Hangen, U.D.; Wyrobek, T.; Kong, L.W.; Karmakar, A.; Xu, X.; Panchenko, I.; Zschech, E.
Elastic Anisotropy of Cu and the Impact on Stress Management for 3D IC: Nanoindentation and TCAD Simulation Study
Journal of Materials Research
Wiese, S.; Müller, M.; Panchenko, I.; Metasch, R.; Röllig, M.; Wolter, K.-J.
The Creep Behaviour and microstructure of Ultra Small Solder Joints
EuroSime, April 18th-20th, Linz, Austria
Panchenko, I.; Mueller, M.; Wiese. S.; Schindler, S.; Wolter, K.- J.
Solidification Processes in the Sn-rich Part of the SnCu System
61st Electronic Components and Technology Conference, Orlando, 31st of May - 4th of June
2010
Panchenko, I.; Neumann, V.; Grafe, J.; Wolter, K.-J.
“Interconnect Technology for Three-Dimensional Chip Integration using Solid-Liquid Interdiffusion Bonding” (poster)
Industriepartner Symposium, 30. September, 2010, Dresden
Panchenko, I.; Müller, M.; Wolter, K.-J.
Microstructure Characterization of Lead-Free Solders Depending on Alloy Composition (poster)
1st RTG Workshop 2010 - DFG Report and Defense Colloquium “Bio-Nano-Tech 2010”, Dresden
Wiese, S.; Mueller, M.; Panchenko, J.; Metasch, R.; Wolter, K.- J.; Roellig, M.
The Scaling Effect on Microstructure and Creep Properties of Sn-based Solders
Electronics System Integration Technology Conference, Berlin, 13th - 16th of May
Panchenko, I.; Mueller, M.; Wolter, K.- J.
Microstructure Characterisation of Lead-Free Solders Depending on Alloy Composition
AIP Proceedings of the 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau,12th-14th of April
Panchenko, I.; Mueller, M.; Wolter, K.- J.
Metallographic Preparation of the SnAgCu Solders for Optical Microscopy and EBSD Investigations
33rd International Spring Seminar on Electronics Technology, Warsaw, 12th-16th of May
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