Stellvertreter IAVT
Referenzen
2025
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Characterization and modeling of solder interconnects for wafer level packaging applications subjected to low cycle fatigue stress
Journal of IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025, DOI: 10.1109/TCPMT.2025.3592042
Patrizi, G.; Carratù, M.; Meier, K.; Sommella, P.; Pietrosanto, A.; Bock, K.; Ciani, L.
Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling
Proceedings of the 2025 IEEE Instrumentation and Measurement Technology Conference (I2MTC)
Haeusler, M.; Meier, K.; Lyu, S; Bock, K.
Isothermal Shock Testing on Flip-Chip Interconnects
Proceedings of the IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas (US), 2025, DOI: 10.1109/ECTC51687.2025.00130
Singh, P. K.; Geisler, H.; Machani, K. V.; Breuer, D.; Meier, K.; Kuechenmeister, F.; Bock, K.
Temperature-dependent Material Characterization of Back-end-of-line Copper with Nanoindentation for FEM-based Wafer Warpage Prediction
Proceedings of the IEEE 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht (Netherlands), 2025, DOI: 10.1109/EuroSimE65125.2025.11006541
Lyu, C.; Meier, K.; Bock, K.
Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads
Proceedings of the IEEE 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht (Netherlands), 2025, DOI: 10.1109/EuroSimE65125.2025.11006543
Alfonso, C. G.; Meier, K.; Albrecht, O.; Qi, Y.; Patrizi, G.; Ciani, L.; Grasso, F.; Bock, K.
Machine Learning Modelling for Electronic Reliability Analysis in Solder Joints
Proceedings of the IEEE 48th International Spring Seminar on Electronics Technology (ISSE), Budapest (Hungary), 2025, DOI: 10.1109/ISSE65583.2025.11121026
2024
Singh, P. K.; Mueller, M.; Geisler, H.; Hecker, M.; Richter, I.; Yu, M.; Breuer, D.; Machani, K. V.; Meier, K.; Kuechenmeister, F.; Bock, K.
Study on Effect of Microstructure Evolution on Wafer Warpage for High Temperature Annealed and Self-Annealed Copper Thin Films
Journal of IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 15 (3), p. 15, DOI: 10.1109/TCPMT.2025.3540216
Meyer, J.; Gierth, K. F. W.; Meier, K.; Bock, K.
Bond Strength Comparison of Commercial and Custom Copper Sinter Pastes under Sinter Process Modifications
Proceedings of the IEEE 26th Electronic Packaging Technology Conference (EPTC), Singapore, 2024, DOI: 10.1109/EPTC62800.2024.10909860
Meier, K.
Board Level Interconnect Reliability under Harsh Conditions – Testing, Modelling and Prognostic Perspectives
IEEE 25th International Conference on Electronic Packaging Technology (ICEPT), Tianjin (China), 2024
Adavi, K.; Quednau, S.; Mueller, X.; Ernst, D.; Meier, K.; Platz, H.
Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology based on Static I-V
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024, DOI: 10.1109/ESTC60143.2024.10712135
Tiedje, T.; Meyer, J.; Luniak, M.; Knoch, P.; Meier, K.; Zerna, T.
Using Polymer Paste as Dielectric Material for PCB based Module-to-Module Sintering
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024, DOI: 10.1109/ESTC60143.2024.10712000
Patrizi, G.; Meier, K.; Haeusler, M.; Ciani, L.; Catelani, M.; Bock, K.
A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads
Proceedings of the 24th IMEKO World Congress (IMEKO), Hamburg (Germany), 2024
Adavi, K.; Quednau, S.; Mueller, X.; Ernst, D.; Meier, K.; Platz, H.
Experimental Study of a Novel Printed Circuit Board Interconnection Technology
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10604153
Häusler, M.; Meier, K.; Bock, K.
Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test Method
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603578
Lyu, C.; Meier, K.; Bock, K.
Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration Loads
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603965
Stadermann, F.; Köst, V. C.; Nieweglowski, K.; Meier, K.; Bock, K.
Evaluation of Semipermeable Membranes for Encapsuling Gas Sensors in Human Intestinal Environments
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603601
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Mueller, M.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling
Proceedings of the IEEE 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania (Italy), 2024, DOI: 10.1109/EuroSimE60745.2024.10491475
Nguyen, H.-H.; Meier, K.; Bock, K.
Numerical Study on the Correlation between Board-level Drop and Shock Tests for Chip-Scale Packages
Proceedings of the IEEE 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania (Italy), 2024, DOI: 10.1109/EuroSimE60745.2024.10491520
Meyer, J.; Metasch, R.; Meier, K.; Röllig, M.; Bock, K.
Mikrostrukturanalyse an Silbersinterkontakten unter Variation der Prozessparameter und Korrelation zu mechanischen Eigenschaften
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Knoch, P.; Meier, K.; Bock, K.
Entwicklung eines auf ultradünnem Glas basierten Absolutdrucksensors für Hochtemperaturanwendungen
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Röllig, M.; Schwerz, R.; Meyer, J.; Meier, K.
Materialmodellierung von Ag-Sinter-Kontakten für FEM-Berechnungen unter Berücksichtigung von Plastizität, Porosität und Herstellungseinflüssen
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
2023
Albrecht, O.; Hoehne, R.; Barkur, D.; Meier, K.; Bock, K.
Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder Interconnects
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Meyer, J.; Gierth, K. F. W.; Meier, K.; Bock, K.
Feasibility and Optimisation of Cu-Sintering under Nitrogen Atmosphere
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Dudash, V.; Machani, K. V.; Meier, K.; Geisler, H.; Mueller, M.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling
Proceedings of the 25th Electronic Packaging Technology Conference (EPTC), Singapore, 2023
Singh, P. K.; Rohlfs, P.; Sandmann, G.; Machani, K. V.; Breuer, D.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging
Proceedings of the 24th European Microelectronics and Packaging Conference (EMPC), Hinxton (UK), 2023
Yin, R.; Morath, H. P. E.; Hoyer, C.; Nieweglowski, K.; Meier, K.; Wagner, J.; Ellinger, F.; Bock, K.
Characterization of Embedded and Thinned RF Chips
Proceedings of the 24th European Microelectronics and Packaging Conference (EMPC), Hinxton (UK), 2023
Dudash, V.; Machani, K. V.; Boehme, B.; Capecchi, S.; Ok, J.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling
Proceedings of the IEEE International Reliability Physics Symposium (IRPS), Monterey, CA (USA), 2023, DOI: 10.1109/IRPS48203.2023.10117636
Hoehne, R.; Meier, K.; Reim, M.; Lehmann, M.; Bock, K.
Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill
Proceedings of the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz (Austria), 2023, DOI: 10.1109/EuroSimE56861.2023.10100809
Singh, P. K.; Machani, K. V.; Breuer, D.; Hecker, M.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer
Proceedings of the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz (Austria), 2023, DOI: 10.1109/EuroSimE56861.2023.10100826
Hoehne, R. ; Albrecht, O.; Yichen, Q.; Meier, K.; Bock, K.
Feasibility Investigation of Machine Learning for Electronic Reliability Analysis using FEA
Proceedings of the IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL (USA), 2023, DOI: 10.1109/ECTC51909.2023.00202
Singh, P. K.; Müller, M.; Machani, K. V.; Breuer, D.; Hecker, M.; Meier, K.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
Proceedings of the 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023, DOI: 10.1109/IITC/MAM57687.2023.10154658
2022
Albrecht, O.; Meier, K.; Schaulin, M.; Toussaint, P.-L.; Gamba, B.; Cruz, R.; Vernhes, P.; Goetze, C.; Bock, K.
Warpage Measurements to Support the Development of mmWave Modules
Proceedings of the 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis, Berlin (Germany), 2022
Albrecht, O.; Meier, K.; Schaulin, M.; Toussaint, P.-L.; Gamba, B.; Cruz, R.; Vernhes, P.; Goetze, C.; Bock, K.
Warpage measurements to support the development of mmWave modules
Microelectronics Reliability, Vol. 138, 2022, DOI: 10.1016/j.microrel.2022.114731
Yin, R.; Pechnig, C.; Nieweglowski, K.; Meier, K.; Bock, K.
Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips
Proceedings of the IEEE 45th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology Innovations towards Green Electronics, Vienna, (Austria), 2022, DOI: 10.1109/ISSE54558.2022.9812790
Dudash, V.; Meier, K.; Machani, K. V.; Kuechenmeister, F.; Wieland, M.; Bock, K.
Design of reliability test assemblies for WLCSP solder interconnects using finite element modeling
Proceedings of the IEEE 45th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology Innovations towards Green Electronics, Vienna, (Austria), 2022, DOI: 10.1109/ISSE54558.2022.9812715
Meier, K.; Schaulin, M.; Goetze, C.; Wieland, M.; Bock, K.
Board Level Reliability Study on Large Antenna-in-Package Solutions for Automotive Radar Applications
Proceedings of the 24th Electronic Packaging Technology Conference (EPTC), Singapore, 2022, DOI: 10.1109/EPTC56328.2022.10013234
Yin, R.; Nieweglowski, K.; Meier, K.; Bock, K.
Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterization
Proceedings of the 24th Electronic Packaging Technology Conference (EPTC), Singapore, 2022, DOI: 10.1109/EPTC56328.2022.10013121
Meier, K.; Bock, K.; Endisch, C.; Schulze, R.; Reichel, L.; Knoch, P.; Esche, M.
Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature Application
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939433
Heine, M.; Meier, K.; Wenzel, L.; Goetze, C.; Bock, K.
Reliability Improvement of Large BGA-Packages Using Sidefill-Support
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939434
Yin, R.; Nieweglowski, K.; Meier, K.; Bock, K.
Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939532
Metasch, R.; Roellig, M.; Schwerz, R.; Gleichauf, J.; Maniar, Y.; Ratchev, R.; Meier, K.
Optimized TMF Measurement Setup for reproducible Lifetime Measurements on Solder Joints under accelerated thermal-mechanical conditions
Proceedings of the 23th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Malta, 2022, DOI: 10.1109/EuroSimE54907.2022.9758911
Meyer, J.; Meier, K.; Bock, K.
LogiPow – Leiterplattentechnologieentwicklung zur Integration von Leistungselektronik und Logik
Elektronische Baugruppen und Leiterplatten EBL 2022 Intelligentes Design, Intelligente Fertigung, Prüfung und Applikation, 11. DVS/GMM-Fachtagung, Fellbach, 2022
2021
Meier, K.; Roellig, M.; Kuntzsch, R.; Rammer, T.; Peuckert, M.
Technologie-Entwicklung für PCB-integrierte Leistungsund Logikstrukturen
Produktion von Leiterplatten und Systemen (PLUS) 6/2021, S. 719-729, Eugen G. Leuze Verlag, Bad Saulgau
Hoehne, R.; Leslie, D.; Meier, K.; Dasgupta, A.; Bock, K.
Improved Damage Modeling for Solder Joints under Combined Vibration and Temperature Cycling Loading
IEEE 71st Electronic Components and Technology Conference (ECTC), DOI: 10.1109/ECTC32696.2021.00218
Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Board Level Temperature Cycling Reliability of mmWave Modules on Hybrid Substrates
IEEE 71st Electronic Components and Technology Conference (ECTC), DOI: 10.1109/ECTC32696.2021.00151
Schlipf, S.; Sander, C.; Clausner, A.; Paul, J.; Capecchi, S.; Wambera, L.; Meier, K.; Zschech, E.
IC package related stress effects on the characteristics of ring oscillator circuits
IEEE 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), DOI: 10.1109/EuroSimE52062.2021.9410858
Chaudhuri, A.; Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Warpage Behaviour and Thermo-Mechanical Robustness of Large Packages for mmWave Applications
IEEE 44th International Spring Seminar on Electronics Technology (ISSE), DOI: 10.1109/ISSE51996.2021.9467580
Meier, K.; Ochmann, M.; Leslie, D.; Dasgupta, A.; Bock, K.
The effect of low temperature conditions on vibration durability of SAC105 interconnects
Journal Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114160
2020
Schwerz, R.; Metasch, R.; Roellig, M.; Meier, K.
FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), virtual event, 2020
Ackstaller, T.; Meier, K.; Bock, K.
A Finite Element Study on Acceleration of Reliability Testing for Solder Interconnects
Proceedings of the 43rd International Spring Seminar on Electronics Technology (ISSE) Trends in Microelectronics Packaging and Interconnection Technology, virtual event, 2020
Knoch, P.; Meier, K.; Luniak, M.; Bock, K.
Deposition Technologies for Electronic Systems Based on Ultra-Thin Glass
Proceedings of the 43rd International Spring Seminar on Electronics Technology (ISSE) Trends in Microelectronics Packaging and Interconnection Technology, virtual event, 2020
Schlipf, S.; Clausner, A.; Paul, J.; Capecchi, S.; Wambera, L.; Meier, K.; Zschech, E.
Nanoindenation to investigate IC performance using ring oscillator circuits as a CPI sensor
Proceedings of the International Reliability Physics Symposium (IRPS), virtual event, 2020
Ochmann, M.; Leslie, D.; Meier, K.; Dasgupta, A.; Bock, K.
The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), virtual event, 2020
Meier, K.; Wambera, L.; Boehme, B.; Goetze, C.; Capecchi, S.; Paul, J.; Wieland, M.; Bock, K.
Reliability Testing of FCCSP Packages for Automotive Applications
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virutal event, 2020
Knoch, P.; Meier, K.; Luniak, M.; Esche, M.; Bock, K.
Ultra-Thin Glass Based Temperature Sensor Package for High Temperature Applications
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virtual event, 2020
Albrecht, O.; Wohlrabe, H.; Meier, K.
Study on the Effect of the Warpage of Electronic Assemblies on Their Reliability
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virtual event, 2020
Meier, K.; Ochmann, M.; Leslie, D.; Dasgupta, A.; Bock, K.
Low Temperature Vibration Reliability of Lead-free Solder Joints
Proceedings of the 68th Electronic Components and Technology Conference (ECTC), virtual event, 2020
Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Reliability Assessment of mmWave Modules
Proceedings of the 70th Electronic Components and Technology Conference (ECTC), virtual event, 2020; DOI: 10.1109/ECTC32862.2020.00125
Wohlrabe, H.; Meier, K.; Albrecht, O.
Einflüsse von Verwindungen und Wölbungen während des Lötpro-zesses auf die Qualität und Zuverlässigkeit von Lötstellen
Elektronische Baugruppen und Leiterplatten EBL 2020 Technologische Plattform für die digitale Transformation, 10. DVS/GMM-Fachtagung, Fellbach, 2020
Meyer, J.; Bickel, S.; Meier, K.; Bock, K.
Thermische Charakterisierung Eingebetteter Bauelemente zur Strukturüberwachung - Thermal Characterisation of Embedded Components for Structural Monitoring
Elektronische Baugruppen und Leiterplatten EBL 2020 Technologische Plattform für die digitale Transformation, 10. DVS/GMM-Fachtagung, Fellbach, 2020
2019
Meier, K.; Meyer, J.; Schein, F.-L.; Sirkeci, D.; Ostmann, A.; Oertel, E.; Westphal, H.; Lang, K.-D.; Bock, K.
Reliability of Substrate Embedded Rectifiers for High Voltage Applications
Proceedings of the 21st Electronic Packaging Technology Conference (EPTC), Singapore, 2019
Meier, K.; Leslie, D.; Dasgupta, A.; Roellig, M.; Bock, K.
Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading
Proceedings of the 21st Electronic Packaging Technology Conference (EPTC), Singapore, 2019
Trodler, J.; Wohlrabe, H.; Meier, K.; Albrecht, O.
RELIABILITY OF ELECTRICAL DEVICES DUE TO WARPAGE BEHAVIOR OF SMD-PACKAGES AND BOARDS DURING SOLDERING
SMTA International, Rosemont, Illinois (USA), 2019
Wohlrabe, H.; Meier, K.; Albrecht, O.; Trodler, J.
EVALUATION OF THE WARPAGE BEHAVIOR OF SMD-PACKAGES AND PRINTED CIRCUIT BOARDS DURING SOLDERING
SMTA International, Rosemont, Illinois (USA), 2019
Bickel, S.; Meier, K.; Roellig, M.; Bock, K.
Manufacturing and reliability issues of highly integrated packages for power electronic applications
Proceedings of the 42nd International Spring Seminar on Electronics Technology (ISSE) Advances in Printed and Ceramic Microsystems, Wroclaw (Poland), 2019
Albrecht, O.; Wohlrabe, H.; Meier, K.
Impact of Warpage Effects on Quality and Reliability of Solder Joints
Proceedings of the 42nd International Spring Seminar on Electronics Technology (ISSE) Advances in Printed and Ceramic Microsystems, Wroclaw (Poland), 2019
Meier, K.; Leslie, D.; Storz, T.; Dasgupta, A.; Bock, K.
Harmonic Vibration Durability Tests on Lead-Free Solder Alloys at Different Isothermal Conditions
Proceedings of the 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Hannover (Germany), 2019
Metasch, R.; Roellig, M.; Knoch, P.; Weinmann, C.; Meier, K.
Methodology for Correlation of Porosity and Mechanical Properties of Silver Sintered Joints in Electronics
Proceedings of the 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Hannover (Germany), 2019
Meier, K.; Wambera, L.; Boehme, B.; Goetze, C.; Paul, J.; Bock, K.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
Proceedings of the Advanced Packaging Conference, Munich (Germany), 2019
Metasch, R.; Schwerz, R.; Meier, K.; Roellig, M.
Numerical Study on the Influence of Material Models for Tin-based Solder Alloys on Reliability Statements
Proceedings of the 22nd European Microelectronics and Packaging Conference (EMPC), Pisa (Italy), 2019
Meier, K.; Winkler, M.; Leslie, D.; Dasgupta, A.; Bock, K.
Fatigue Behaviour of Lead-Free Solder Joints Under Combined Thermal and Vibration Loads
Proceedings of the 69th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada (USA), 2019
Wambera, L.; Meier, K.; Höhne, R.; Böhme, B.; Götze, C.; Paul, J.; Wieland, M.; Bock, K.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover, Germany, March 24-27; DOI: 10.1109/EuroSimE.2019.8724515
2018
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Microelectronics Reliability 2018, vol. 87, 125-132; https://doi.org/10.1016/j.microrel.2018.06.003
Kraemer, F.; Roellig, M.; Metasch, R.; Wiese, S.; Ahmar, J.; Meier, K.
Experimental Determination of the Young’s Modulus of various Electronic Packaging Materials
Microelectronics Reliability 2018, vol. 91, 251-256; https://doi.org/10.1016/j.microrel.2018.06.002
Metasch, R.; Meier, K.; Roellig, M.
Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Proceedings of the 7th Electronics System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Wohlrabe, H.; Meier, K.; Albrecht, O.
Influences of SMD Package and Substrate Warpage on Quality and Reliability – Measurement, Effects and Counteractions
Proceedings of the 7th Electronics System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Schellenberg, C.; Strogies, J.; Wilke, K.; Meier, K.
Investigations on the high temperature suitability of diffusion soldered interconnects
Proceedings of the 7th Electronics System-Integration Technology Conference (ESTC), Dresden, 2018
Wohlrabe, H.; Meier, K.; Albrecht, O.
Verwindungen und Wölbungen im Lötprozess – Messung, Auswirkungen und Gegen-maßnahmen
Elektronische Baugruppen und Leiterplatten EBL 2018 Multifunktionale Aufbau- und Verbindungstechnik – Beherrschung der Vielfalt, 9. DVS/GMM-Fachtagung, Fellbach, 2018
Lüngen, S.; Tiedje, T.; Meier, K.; Nieweglowski, K.; Bock, K.
Reliability of 3D additive manufactured packages
Proceedings of 7th Electronic System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Albrecht, O.; Wohlrabe, H.; Meier, K.; Oppermann, M.; Zerna, T.
In-situ X-ray Characterization of IC Package Warpage at Elevated Temperatures
Proceedings of the 7th Electronics System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Meier, K.; Liu, Y.; Bock, K.
Investigation of Solder Joint Reliability under High Temperature Vibration
Proceedings of the 41st International Spring Seminar on Electronics Technology (ISSE) Research and Development Tendencies in Advanced Electronics Technologies, Zlatibor (Serbia), 2018
Meier, K.; Roellig, M.; Bock, K.
Developments for Highly Reliable Electronics – Experiments on Combined Thermal and Vibration Loading
Proceedings of the 68th Electronic Components and Technology Conference (ECTC), San Diego, California (USA), 2018
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Elektronische Baugruppen und Leiterplatten EBL 2018 Multifunktionale Aufbau- und Verbindungstechnik – Beherrschung der Vielfalt, 9. DVS/GMM-Fachtagung, Fellbach, 2018
2017
Meier, K.; Roellig, M.; Liu, Y.; Bock, K.
Solder Joint Fatigue Analysis under Combined Thermal and Vibration Loading
Proceedings of the 19th Electronics Packaging Technology Conference (EPTC), Singapore, 2017
Metasch, R.; Roellig, M.; Kuczynska, M.; Schafet, N.; Becker, U.; Meier, K.; Panchenko, I.
Accelerated Life Time Measurement with In-situ Force and Displacement Monitoring during Thermal Cycling on Solder Joints
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
Kraemer , F.; Roellig, M.; Metasch, R.; Wiese, S.; Al Ahmar, J.; Meier, K.
Experimental Determination of the Young’s Modulus of various Electronic Packaging Materials
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Fatigue Measurement Setup under Combined Thermal and Vibration Loading on Electronic SMT Assembly
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
Meier, K.; Bock, K.
Developments for Highly Reliable Consumer Electronics
Proceedings of the 8th Electronic Materials and Processes for Space (EMPS) Workshop, Nordwijk, 2017
2016
Tiedje, T.; Meier, K.; Bock, K.
Experimental Methodology for Low Temperature Vibration Investigations on Electronic Modules
Proceedings of the 39th International Spring Seminar on Electronics Technology (ISSE) Printed electronics and smart textiles, Pilsen (Czech Republic), 2016
Meier, K.; Röllig, M.; Bock, K.
Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Elektronische Baugruppen und Leiterplatten EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit?, 8. DVS/GMM-Fachtagung, Fellbach, 2016
2015
Meier, K.; Röllig, M.; Bock, K.
Untersuchung des Ausfallverhaltens von Lotkontakten unter Temperaturwechsel- und Vibrationsbelastung
VDE GMM 6. Mikrosystemtechnik-Kongress, Karlsruhe, 2015
Röllig, M.; Metasch, R.; Meier, K.; Schwerz, R.
Simulationsgestützte mikromechanische Werkstoffmodellierung von Zinn-Basisloten basierend auf produktangepassten Prüfkörpern und Messtechnik für Berechnungen von Temperaturwechselbeanspruchungen
VDE GMM 6. Mikrosystemtechnik-Kongress, Karlsruhe, 2015
Meier, K.; Röllig, M.
Reliability Study on SMD Components on an Organic Substrate with a Thick Copper Core for Power Electronics Applications
Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Budapest, 2015
2014
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.
Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung – Untersuchungen bei Raumtemperatur, bei Hochtemperatur und nach isothermer Voralterung
Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag; ISSN 1436-7505
Meier, K.; Wolter, K.-J.
Reliability of SMD Capacitor Solder Joints under Sequential Thermo-Mechanical and Vibration Loading
4th Global Interposer Technology (GIT) 2014 Workshop, Atlanta, 2012
Metasch, R.; Roellig, M.; Kabakchiev, A.; Metais, B.; Ratchev, R.; Meier, K.; Wolter, K.-J.
Experimental Investigation of the Visco-plastic Mechanical Properties of a Sn-based Solder Alloy for Material Modelling in Finite Element Calculations of Automotive Electronics
Proceedings of the 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Gent, 2014
Meier, K.; Lautenschläger, G.; Röllig, M.; Schießl, A.; Wolter, K.-J.
Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Elektronische Baugruppen und Leiterplatten EBL 2014 Von Hochstrom bis Hochintegration, 7. DVS/GMM-Fachtagung, Fellbach, 2014
Meier, K.; Röllig, M.; Schießl, A.; Wolter, K.-J.
Reliability Study on Chip Capacitor Solder Joints under Thermo-Mechanical and Vibration Loading
Proceedings of the 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Gent, 2014
2013
Schwerz, R.; Meier, K.; Röllig, M.; Osmolovskyi, S.; Wolter, K.-J.
Reliability of Passive Components Embedded in Organic Substrates
3rd Global Interposer Technology Workshop (GIT) 2013, Atlanta (USA)
Meier, K.; Röllig, M.; Wolter, K.-J.
The Effect of Cu and Ag on the Yielding Behaviour of Lead-Free Solders at High Strain Rates
Proceedings of the 15th Electronics Packaging Technology Conference (EPTC), Singapore
Röllig, M.; Metasch, R.; Schingale, A.; Schießl, A.; Meier, K.; Meyendorf, N.
Novel Quick Predict Approach for Identification of Critical Loadings in Electronic Components on PCB under Vibration Realized as a Design Support Tool
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Schwerz, R.; Meier, K.; Röllig, M.; Schingale, A.; Schießl, A.; Wolter, K.-J.; Meyendorf, N.
Evaluation of Embedded IC Approach for Automotive Application
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.; Meyendorf, N.
Determination of Life-time of Solder Joints under Temperature and Vibration Loadings
Proceedings of the International Conference MicroCar 2013
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.
Lifetime Assessment for Bipolar Components under Vibration and Temperature Loading
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Bohm, J., Meier, K., Wolter K.-J.
Induktionsthermografie zur zerstörungsfreien Rissprüfung an Leiterplatten-Vias
'Produktion von Leiterplatten und Systemen' (PLUS), Ausgabe 01/2013, S. 162ff, Leuze-Verlag Bad Saulgau, ISSN 1436-7505
2012
Frömmig, M.; Meier, K.; Wolter, K.-J.
Warpage Reduction by Underfill Capillary Action for Thin Die Bonding
2nd Global Interposer Technology (GIT) 2012 Workshop, Atlanta, 2012
Sättler, P.; Meier, K.; Böttcher, M.; Wolter, K.-J.
Annealing Behavior of copper-filled TSVs
2nd Global Interposer Technology (GIT) 2012 Workshop, Atlanta, 2012
Meier, K.; Johannsen, S. T.; Graf, M.; Wolter, K.-J.
Die Stacking Technology Using Nano-Wire Filled Polymer Films
2nd Global Interposer Technology (GIT) 2012 Workshop, Atlanta, 2012
Krämer, F.; Meier, K.; Wiese S.
The Influence of Strain-Rate Dependent Solder Material Models on the Interconnections Stress of BGA Components in JEDEC Drop Test
4th Electronics Systemintegration Technology Conference, Amsterdam, 2012
Bohm, J., Meier, K., Wolter, K.-J.
Inductively Excited Lock-in Thermography for PCB-Vias
Proceedings of 4th ESTC, Amsterdam
Schwerz, R.; Roellig, M.; Meier, K.; Wolter, K.-J.
Lifetime Assessment of BGA Solder Joints with Voids under Thermo-Mechanical Load
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Saettler, P.; Kovalenko, D.; Meier, K.; Roellig , M.; Boettcher , M.; Wolter, K.-J.
Thermo-mechanical Characterization and Modeling of TSV Annealing Behavior
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Meyer, D.; Wagner, M.; Beintner, M.; Meier, K.; Nieweglowski, K.; Wonisch, A.; Kraft, T.
Lotpastendruckverständnis für den Pin-in-Paste-Prozess
Proceedings of the 6th DVS/GMM Symposium Elektronische Baugruppen und Leiterplatten EBL, Fellbach, 2012
Kraemer, F.; Meier, K.; Wiese, S.; Rzepka, S.
FEM Stress Analysis in BGA Components Subjected to Jedec Drop Test Applying High Strain Rate Lead-Free Solder Material Models
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Meier, K.; Kraemer, F.; Wolter, K.-J.
High Strain Rate Behaviour of Lead-Free Solders Depending on Alloy Composition and Thermal Aging
Proceedings of the 62nd Electronic Components and Technology Conference (ECTC), San Diego, California (USA), 2012
Meier, K.; Kraemer, F.; Roellig, M.; Wolter, K.-J.
Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
2011
Röllig, M.; Meier, K.; Metasch, R.; Schießl, A.
Hoch- und niederzyklische Ermüdungsuntersuchungen an Lotwerkstoffen zur Absicherung robuster Automobilelektronik
Proceedings of the International Conference MicroCar 2011
Graf, M.; Meier, K.; Hähnel, V.; Schlörb, H.; Eychmüller, A.; Wolter, K.J.
Nanowire Filled Polymer Films for 3D Integration
International Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), Dresden, Germany
Sättler, P.; Meier, K.; Wolter, K.-J.
Characterization of Cu-TSV microstructure by EBSD for Si-Interposer
Global Interposer Technology (GIT) 2011 Workshop, Atlanta, 14th - 15th Novmeber 2011
Sättler, P.; Meier, K.; Wolter, K.-J.
Considering Copper Anisotropy for advanced TSV-modeling
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May
Aryasomayajula, L.; Meier, K.; Saettler, P.; Panchenko, I.; Frömmig, M.; Graf, M.; Rieske, R.; Wolter, K.-J.
Integration Technologies for 3D Packaging
Workshop-GIT 2011, November 14-15, Atlanta Georgia, USA
Roellig, M.; Boehme, B.; Meier, K.; Metasch, R.
Determination of Thermal and Mechanical Properties of Packaging Materials for the Use in FEM-Simulations
AIP 2011, AIP Conference Proceedings, vol.1378, nr. 1, Pages 79-103
Wolter, K.-J.; Meier, K.; Sättler, P.; Panchenko, I.; Frömmig, M.; Graf, M.
Bonding Technologies for 3D-Packaging
35th International Conference of IMAPS-CPMT IEEE, September 21st – 24th, Gdansk-Sobieszewo
Schwerz, R.; Meyer, S.; Roellig, M.; Meier, K.; Wolter, K.-J.
Finite Element Modeling on Thermal Fatigue of BGA Solder Joints with Multiple Voids
34th International Spring Seminar on Electronics Technology (IEEE); High tatras, Slovakia, 11 – 15 Mai
Meier, K.; Roellig, M.; Schießl, A.; Wolter; K.-J.
Life Time Prediction for Lead-free Solder Joints under Vibration Loads
Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Linz, 2011
2010
Sättler, P.; Meier, K.; Wolter, K.-J.
Thermo-mechanical Behavior of Dies Containing Through-Silicon-Vias
Industriepartner Symposium (IPS) (Vortrag/Poster)
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Mechanical Behaviour of Typical Lead-Free Solders at High Strain Rate Conditions
Proceedings of the 12th Electronics Packaging Technology Conference (EPTC), Singapore, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Rate Dependent Mechanical Behaviour of SAC Solder in Fast Tensile Experiments
Proceedings of the 3rd Electronics Systemintegration Technology Conference, Berlin, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates
Proceedings of the 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Bordeaux, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Mechanical Solder Characterisation under High Strain Rate Conditions
11th International Workshop on Stress-Induced Phenomena in Metallization, ISSN 0094-243X, American Institute of Physics, Bad Schandau, 2010
2009
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J.
Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Proceedings of the 59th Electronic Components and Technology Conference (ECTC); San Diego (California, USA); pp. 1781-1787
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Combining Experimental and Simulation Methods for the Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE); Delft; pp. 563 – 569
2008
Röllig, M.; Wiese, S.; Meier, K.; Wolter, K.-J.
Creep Measurements on SnAgCu Solder Joints in Different Compositions and after Mechanical and Thermal Treatment
Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME
2007
Meier, K.; Röllig, M.; Wiese, S.; Götte, C.; Deml, U.; Wolter, K.-J.
Elektromigration an Baugruppen der Leistungselektronik
Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag; ISSN 1436-7505
Röllig, M.; Wiese, S.; Meier, K.; Wolter, K.-J.
Creep Measurements of 200µm - 400µm Solder Joints
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 255-264
Meier, K.; Röllig, M.; Wiese, S.; Goette, C.; Deml, U.; Wolter, K.-J.
Electromigration in Large Volume Solder Joints
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 464-470
Wiese, S.; Meier, K.; Scholz, D.; Müller, A.; Röllig, M.; Rzepka, S.; Wolter, K.-J.
Experimental Determination of Time Independent Elastic Plastic Behaviour of Solder Joints at High Strain Rates
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 422-426
Meier, K.; Röllig, M.; Wiese, S.; Goette, C.; Deml, U.; Wolter, K.-J.
Mechanical Degradation, Thermal- and Electromigration in Large Volume Solder Joints
57th ECTC 2007, 29.5 . 1.6.05 in Reno (USA), S. 1839 . 1845
2006
Wiese, S.; Röllig, M., Müller, M.; Rzepka, S.; Nocke, K.; Luhmann, C.; Krämer, F.; Meier, K.; Wolter, K.-J.
The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 912 - 925
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