Stellvertreter IAVT
Vita
Dr.-Ing. Krzysztof Nieweglowski (*1978) studierte von 1998 bis 2003 an der Politechnika Wroclawska (Polen) Elektronik mit der Studienrichtung Optoelektronik und Lichtwellenleitertechnik. Anschließend war er als wissenschaftlicher Mitarbeiter am Institut für Aufbau- und Verbindungstechnik der Elektronik (TU Dresden) in mehreren Forschungsprojekten tätig. Im Jahr 2010 erlangte er die Promotion mit dem Thema „Beiträge zur Aufbau- und Verbindungstechnik für optische Kurzstreckenverbindungen“. Derzeit hat er eine Stelle als Postdoc im DFG-Sonderforschungsbereich SFB 912 „HAEC - Highly Adaptive Energy-Efficient Computing“ im Teilprojekt „Energy-Adaptive Optical Onboard Links for Inter-Chip Communication“. Dr. Nieweglowski leistete wissenschaftliche Beiträge auf dem Gebiet der elektro-optischen Leiterplatte. Seine Spezialisierungen liegen im Bereich der Fertigung, optischen Charakterisierung und Integration von optischen Verbindungen auf der Leiterplattenebene.
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Referenzen
2025
Dev, S.; Catuneanu, M.; He, M. et. al.
Silicon nitride-based integrated photonic platform for applications in trustworthy communication systems
Proc. SPIE 13530, Integrated Optics: Design, Devices, Systems, and Applications VIII, 1353003 (5 June 2025); https://doi.org/10.1117/12.3056489.
Nieweglowski, K.; Patela, S.; Köst, V. C.; Weyers, D.; Śniadek, P.; Laszczyk, K.; Lettrichova, I.; Pudis, D.; Walczak, R.; Bock, K.
International Collaborative Hands-on Activities on Advanced Electronics and Photonics for Higher Education Using 3D Printing Techniques
2025 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 2025, pp. 1-6, doi: 10.1109/ISSE65583.2025.11120902.
2024
Köst, V. C.; Fekri, Z.; Zscharchuch, J.; Garcia Valenzuela, A.; Nieweglowski, K.; Erbe, A.; Bock, K.
Evaluation und Weiterentwicklung eines Permeationssetups zur Charakterisierung von Polymermembranen
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Patela, S.; Nieweglowski, K.; Sniadek, P.; Laszczyk, K.; Köst, V.; Weyers, D.; Lettrichova, I.; Pudis, D.; Bock, K.; Walczak, R.
Integrating 3D printing into higher education curricula for electronics: challenges and opportunities
ICERI2024 Proceedings, pp. 8384-8392, DOI: 10.21125/iceri.2024.2069.
Stadermann, F.; Köst, V. C.; Nieweglowski, K.; Meier, K.; Bock, K.
Evaluation of Semipermeable Membranes for Encapsuling Gas Sensors in Human Intestinal Environments
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10603601
Krzysztof Nieweglowski, David Weyers, Akash Mistry und Karlheinz Bock
Microprinting process development enabling cost effective, high density and flexible electro-optical integration
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1790-1796, doi: 10.1109/ECTC51529.2024.00298.
Ernst, D.; Nieweglowski, K.; Bock, K.
Spannungsreduzierte Kontaktierungen in dehnbaren Elektroniksystemen
12. DVS/GMM-Fachtagung, Elektronische Baugruppen und Leiterplatten "EBL 2024", Fellbach, 05.03.2024
2023
Fekri, Z.; Köst, V. C.; Zscharchuch, J.; Lambeva,N.; Watanabe, K.; Taniguchi, T.; Bock, K. and Erbe, A.
Field effect transistor CO 2 detector based on few layers of black phosphorus
IEEE Nanotechnology Materials and Devices Conference (NMDC), Oct. 2023
https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=10344220
Köst, V. C.; Fekri, Z.; Zscharchuch, J.; Nieweglowski, K.; Erbe, A.; Bock, K.
Polymer Membrane for Characterisation of Gas Permeability and Encapsulation of a Black Phosphorous Sensor
https://ieeexplore.ieee.org/document/10168504
David Weyers, Krzysztof Nieweglowski und Karlheinz Bock
Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), Cambridge, United Kingdom, 2023, pp. 1-8, doi: 10.23919/EMPC55870.2023.10418392.
David Weyers, Mircea-Traian Catuneanu, Margarita Lapteva, Vinya Vibhuti, Menglong He Sascha Boenhardt, Matthias Landwehr, Johann Fell, Krzysztof Nieweglowski, Kambiz Jamshidi und Karlheinz Bock
Electro-optical co-integration platform for high-density hybrid systems – SILHOUETTE
MikroSystemTechnik Kongress 2023; Kongress, Dresden, Deutschland, 2023, pp. 774-781.
Yin, R.; Morath, H. P. E.; Hoyer, C.; Nieweglowski, K.; Meier, K.; Wagner, J.; Ellinger, F.; Bock, K.
Characterization of Embedded and Thinned RF Chips
Proceedings of the 24th European Microelectronics and Packaging Conference (EMPC), Hinxton (UK), 2023
2022
Yin, R.; Pechnig, C.; Nieweglowski, K.; Meier, K.; Bock, K.
Process Developments on Sheet Molding and Redistribution Deposition for Cu-Pillar Chips
Proceedings of the IEEE 45th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology Innovations towards Green Electronics, Vienna, (Austria), 2022, DOI: 10.1109/ISSE54558.2022.9812790
Yin, R.; Nieweglowski, K.; Meier, K.; Bock, K.
Embedding of Thinned RF Chips and Electrical Redistribution Layer Characterization
Proceedings of the 24th Electronic Packaging Technology Conference (EPTC), Singapore, 2022, DOI: 10.1109/EPTC56328.2022.10013121
Yin, R.; Nieweglowski, K.; Meier, K.; Bock, K.
Characterization of material adhesion in redistribution multilayer for embedded high-frequency packages
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 2022, DOI: 10.1109/ESTC55720.2022.9939532
Akash Mistry; David Weyers; Krzysztof Nieweglowski; Karlheinz Bock
Out-of-Plane Mirrors for Single-Mode Polymeric RDL using Direct Laser Writing
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, 2022, pp. 01-07, doi: 10.1109/ESTC55720.2022.9939534.
David Weyers; Krszystof Nieweglowski; Karlheinz Bock
Advances in UV-lithographic patterning of multi-layer waveguide stack for single mode polymeric RDL
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, 2022, pp. 405-409, doi: 10.1109/ESTC55720.2022.9939517.
Ernst, D.; Nieweglowski, K.; Bock, K.
Feasibility Study of Magnetically Enhanced Interconnects for Integration of Flexible and Stretchable Electronics
9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania
David Weyers; Akash Mistry; Krzystof Nieweglowski; Karlheinz Bock
Hybrid lithography approach for single mode polymeric waveguides and out-of-plane coupling mirrors
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, pp. 1919-1926, doi: 10.1109/ECTC51906.2022.00301.
2021
Lorenz, Lukas; Hanesch, Florian; Nieweglowski, Krzysztof; Hamjah, Mohd-Khairulamzari; Franke, Jörg; Hoffmann, Gerd-Albert; Overmeyer, Ludger; Bock, Karlheinz
Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers
Proceedings of IEEE 71th Electronic Components and Technology Conf. (ECTC), pp. 14-21, doi: 10.1109/ECTC32696.2021.00014
Weyers, D.; Nieweglowski, K.; Lorenz, L.; Bock, K:
Analysis of polymeric singlemode waveguides for inter-system communication
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021,
pp. 1-7, doi: 10.23919/EMPC53418.2021.9584994
Ernst, D.; Nieweglowski, K.; Schubert, M.; Bock, K.
Magnetically Enhanced Stretchable Interconnects for Human- Machine Interface
MikroSystemTechnik Kongress 2021, Ludwigsburg, 08.-10.11.2021
2020
K. Nieweglowski, L. Lorenz, T. Ackstaller, K. Bock
3D-Integration für elektro-optische Systeme auf Modulebene
Tagungsband von EBL 2020 - Elektronische Baugruppen und Leiterplatten
Fellbach, 18-19 Februar 2020
Nieweglowski, K.; Lorenz, L.; Catuneanu, M.; Jamshidi, K. & Bock, K.
Electro-optical co-integration of chip-components in optical transceivers for optical inter-chip communication
IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, pp. 139-147, doi: 10.1109/ECTC32862.2020.00035.
Schubert, M.; Wambera, L.; Mudrievska, O.; Nieweglowski, K.; Wagner, J.; Partzsch, J.; Mayr, C.; Ellinger, F.; Bock, K.
Flexible and stretchable redistribution layer with embedded chips for human-machine interface
IEEE 8th Electronics System-Integration Technology Conference (ESTC), Vestfold, Norway, doi: 10.1109/ESTC48849.2020.9229694.
L. Lorenz; L. Ott; K. Nieweglowski; K. Bock
Influence of Temperature Cycling on Asymmetric Optical Bus Couplsers
IEEE Electronics System-Integration Technology Conference (ESTC), Vestfold, Norway
L. Lorenz; F. Hanesch; K. Nieweglowski; Y. Eiche; J. Franke; G.-A. Hoffmann; L. Overmeyer; K. Bock
3D-Opto-MID for Asymmetric Optical Bus Couplers
IEEE Electronics System-Integration Technology Conference (ESTC), Vestfold, Norway, 2020
L. Lorenz; K. Nieweglowski; Z. Al-Husseini; N. Neumann; D. Plettemeier; T. Reitberger; J. Franke; K. Bock
Aerosol Jet Printed Optical Waveguides for Short Range Communication
IEEE Journal of Lightwave Technology
DOI: 10.1109/JLT.2020.2983792
2019
Nieweglowski, K.; Lorenz, L.; Ellinger, F.; Fettweis, G.P.; Bock, K.
Electro-optical co-integration of chip-components for optical and wireless communication in high-performance computing systems
50th IEEE Semiconductor Interface Specialists Conference, San Diego, USA
Nieweglowski, K.; Lorenz, L.; Tiedje, T.; Lüngen, S.; Bock, K.
Elektrooptische Systemintegration für optische Chip-to-Chip Kurzstreckenverbindungen
Tagungsband von MST Kongress 2019, Berlin
Nieweglowski, K.; Schröder, H.
„Elektro-optische Leiterplatten“ (Kapitel 23), in Handbuch der Leiterplattentechnik Band 5
Eugen G. Leuze Verlag KG, Bad Saulgau 2019, ISBN 978-3-87480-355-7
Ackstaller, T.; Lorenz, L.; Nieweglowski, K.; Bock, K.
Combination of thick-film hybrid technology and polymer additive manufacturing for high-performance mechatronic integrated devices
Proc. of 42nd International Spring Seminar on Electronics Technology (ISSE)
Lorenz, L.; Ott, L.; Nieweglowski, K.; Reitberger, T.; Franke, J.; Bock, K.
Evaluation of the Coupling Performance and Long-Term Stability of Aerosol Jet Printed and Photolithographic Manufactured Waveguides for Asymmetric Optical Bus Couplers
Proc. of SPIE Vol. 10924 (Optical Interconnects XIX), SPIE Photonics West, San Francisco, USA, 2019
2018
Lorenz, L.; Nieweglowski, K.
Vorrichtung und Verfahren zum Testen eines zu überprüfenden Lichtwellenleiters
Patent: Offenlegungsschrift DE 10 2017 204 034 B3, Anmeldetag 10.03.2017, Offenlegungstag 03.05.2018
Nieweglowski, K.; Fritsche, D.; Seiler, P.; Lüngen, S.; Carta, C.; Ellinger, F.; Plettemeier, D.; Bock, K.
Interconnect technology development for 180GHz wireless mm-wave system-in-foil transceivers
Proc. of IEEE 68th Electronic Components and Technology Conf. (ECTC), pp. 527–532
Nieweglowski, K.; Lorenz, L.; Lüngen, S.; Tiedje, T.; Wolter, K.-J.; Bock, K.
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
Microelectronics Reliability, vol. 84, pp. 121–126
Tiedje, T.; Lüngen, S.; Nieweglowski, K.; Bock, K.
Will 3D-semiadditive packaging with high conductive redistribution layer and process temperatures below 100°C enable new electronic applications?
Proc. of 7th Electronic System-Integration Technology Conference (ESTC)
Lüngen, S.; Tiedje, T.; Meier, K.; Nieweglowski, K.; Bock, K.
Reliability of 3D additive manufactured packages
Proceedings of 7th Electronic System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Two-Stage Simulation for Coupling Schemes in the Device Communication using Ray Tracing and Beam Propagation Method
7th Electronics System-Integration Technology Conference (ESTC), Dresden
2017
Tiedje, T.; Lüngen, S.; Schubert, M.; Luniak, M.; Nieweglowski, K.; Bock, K.
Will low-cost 3D additive manufactured packaging replace the fan-out wafer level packages?
Proc. of IEEE 67th Electronic Components and Technology Conf. (ECTC), pp. 1065–1070
Lüngen, S.; Charania, S.; Tiedje, T.; Nieweglowski, K.; Killge, S.; Lorenz, L.; Bartha, J.; Bock, K.
3D optical coupling techniques on polymer waveguides for wafer and board level integration
Proc. of IEEE 67th Electronic Components and Technology Conf. (ECTC), pp. 1612–1618
Charania, S.; Lüngen, S.; Al-Husseini, Z.; Killge, S.; Nieweglowski, K.; Neumann, N.; Plettemeier, D.; Bock, K.; Bartha, J. W.
Micro structured coupling elements for 3D silicon optical interposer
in Integrated Optics: Physics and Simulations III, vol. 10242 of Proceedings of SPIE, pp. 0V:1–0V:10
Nieweglowski, K.; Tiedje, T.; Schöniger, D.; Henker, R.; Ellinger, F.; Bock, K.
Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication
in Optical Fibers and Their Applications, vol. 10325 of Proceedings of SPIE, pp. 0V:1–0V:7
Henker, R.; Schoeniger, D.; Belfiore, G.; Szilagyi, L.; Pliva, J.; Khafaji, M.; Ellinger, F.; Nieweglowski, K.; Tiedje, T. ; Bock, K.
Tunable broadband integrated circuits for adaptive optical interconnects
in Optical Fibers and Their Applications, vol. 10325 of Proceedings of SPIE, pp. 0V:1–0V:7
Lorenz, L.; Nieweglowski, K.; Al-Husseini, Z.; Neumann, N.; Plettemeier, D.; Wolter, K.-J.; Reitberger, T.; Franke, J.; Bock, K.
Asymmetric optical bus coupler for interruption-free short range connections on board and module level
IEEE Journal of Lightwave Technology Vol.35 (18), S. 4033-4039
DOI: 10.1109/JLT.2017.2728198
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Hoffmann, G.-A.; Overmeyer, L.; Reitberger, T.; Franke, J.; Bock, K.
Additive waveguide manufacturing for optical bus couplers by aerosol jet printing using conditioned flexible substrates
IMAPS 21st European Microelectronics Packaging Conf. (EMPC), Warschau, Polen
Lorenz, L.; Nieweglowski, K.; Reitberger, T.; Franke, J.; Wolter, K.-J.; Bock, K.
Asymmetric optical bus couplers with Aerosol Jet printed polymer waveguides
118th Annual Meeting of the DGaO, Dresden
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Loosen, F.; Lindlein, N.; Bock, K.
Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers
IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 14, No.1 pp.1-10, http://dx.doi.org/10.4071/imaps.530
2016
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Analysis of bending effects for optical-bus-couplers
IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas
Nieweglowski, K.; Bock, K.
Assembly of optical transceivers for board-level optical interconnects
Proc. SPIE 9888, Micro-Optics 2016, 98880S (April 27, 2016); doi:10.1117/12.2227903
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Simulation of bended planar waveguides for optical bus couplers
Proc. SPIE 9889, Optical Modelling and Design IV
2015
Nieweglowski, K.; Jenning. M.; Rieske, R.; Wolter, K.-J.; Plettemeier, D.; Fettweis, G.
System und Verfahren zur Übertragung von Daten mit mindestens zwei zur Datenübertragung und Datenverarbeitung ausgebildeten Elementen
Patent: Offenlegungsschrift DE 10 2014 213 037 A1, Anmeldetag 04.07.2014, Offenlegungstag 08.01.2015
Lorenz, L.; Rieske, R.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Wafer-Level Integration Technology for Multi Emitter High Power Fiber Coupled Lasers
Proc. of IMAPS 20th European Microelectronics Packaging Conf. (EMPC), pp.: 1-6
Nieweglowski, K.; Lorenz, L.; Wolter, K.-J.; Bock, K.
Multichannel optical link based on polymer multimode waveguides for boardlevel interchip communication
Proc. of IMAPS 20th European Microelectronics Packaging Conf. (EMPC), pp.: 1-7
Fischer-Hirchert, U.H.P.; Nieweglowski, K.
Optical motherboard (Chapter 10), in Fischer-Hirchert, U.H.P. (Hrsg.): Photonic Packaging Sourcebook
Springer-Verlag, Berlin Heidelberg 2015 (DOI 10.1007/978-3-642-25376-8_10)
Nieweglowski, K.; Henker, R.; Schoeniger, D.; Ellinger, F.; Wolter, K. . J.; Bock, K.
Energy-Efficient Optical Interconnects for High Performance Computing
Fachzeitschrift PLUS, Ausgabe 1/2015, S. 137-124
2014
Lorenz, L.; Sohr, S.; Rieske, R.; Nieweglowski, K.; Zerna, T.; Wolter, K.-J.
Development of a wafer-level Integration Technology for Photonic Transceivers Based on Planar Lightwave Circuits
37th International Spring Seminar on Electronics Technology, Dresden, Germany, 7th - 11th of May 2014
Nieweglowski, K.; Henker, R.; Ellinger, F.; Wolter, K.-J.
Performance of step index multimode waveguides with tuned numerical aperture for on-board optical links
Proc. of SPIE Vol. 8991, Optical Interconnects XIV
2013
Nieweglowski, K.; Rieske, R.; Henker, R.; Schoeniger, D.; Ellinger, F.; Wolter, K. . J.
Optical interconnects for adaptive high performance computing
IEEE Workshop „Photonics and Microsystems”
Mauermann, C.;Sohr, S.; Rieske, R.; Nieweglowski, K. and Wolter, K.-J.
Photolithographic structuring of planar optical waveguides on flexible, organic substrates
2013 International Students and Young Scientists Workshop Photonics and Microsystems
Nieweglowski, K.; Rieske, R.; Sohr, S.; Wolter, K.-J.
Design and Optimization of Planar Multimode Waveguides for High Speed Board-Level Optical Interconnects
63rd Electronic Components and Technology Conference, Las Vegas, 27th - 31st of May
Sohr, S.; Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging
63rd Electronic Components and Technology Conference, Las Vegas, 27th - 31st of May
2012
Rieske, R.; Nieweglowski, K.
Integrierbares optisches Koppelelement und Verfahren zu seiner Herstellung
Patent: Offenlegungsschrift DE 10 2011 101 433 A1, Anmeldetag 10.05.2011, Offenlegungstag 13.12.2012
Rieske, R.; Sohr, S.; Nieweglowski, K.; Wolter, K.-J.
Assembly tolerance requirements for photonics packaging of multi-cell laser power converters
Proceedings of the 4th Electronics Systemintegration Technology Conference (ESTC) 2012, Amsterdam
Meyer, D.; Wagner, M.; Beintner, M.; Meier, K.; Nieweglowski, K.; Wonisch, A.; Kraft, T.
Lotpastendruckverständnis für den Pin-in-Paste-Prozess
Proceedings of the 6th DVS/GMM Symposium Elektronische Baugruppen und Leiterplatten EBL, Fellbach, 2012
2011
Sohr, S.; Fischer, D., Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Packaging and Characterisation of Ultra Low Power VCSEL for Sensor Networks
2011 International Students and Young Scientists Workshop Photonics and Microsystems
Sohr, S.; Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Laser Power Converters for Optical Power Supply
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May
2010
Sohr, S.; Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Characterisation of Laser Power Converters (LPC)
2010 International Students and Young Scientists Workshop Photonics and Microsystems
Nieweglowski, K.; Rieske, R; Wolter, K.-J.
Assembly Requirements for Multi-Channel Coupling Micro-Optics in Board-Level Optical Interconnects
IEEE CPMT Proceedings of the 3rd Electronics Systemintegration Technology Conference, Berlin, September 13-16, 2010
2009
Nieweglowski, K.; Rieske, R; Wolter, K.-J.
Demonstration of Board-Level Optical Link with Ceramic Optoelectronic Multi-Chip Module
IEEE CPMT Proceedings of the 59th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1879 - 1886
Nieweglowski, K.; Rieske, R; Wolter, K.-J.
Board-level optical link for high-speed parallel interconnection
VII. ITG – Workshop “Photonische Aufbau- und Verbindungstechnik”, Wernigerode, 7 - 8 Mai 2009
2008
Walter, S.; Nieweglowski, K.; Rebenklau, L.; Wolter, K.-J.; Lamek, B.; Schubert, F.; Heuer, H.; Meyendorf, N.
Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers
31st International Spring Seminar on Electronics Technology (ISSE) 2008, IEEE, 2008, S. 255-260.
Walter, S.; Nieweglowski, K.; Rebenklau, L.; Wolter, K.-J.; Lamek, B.; Schubert, F.; Heuer, H.; Meyendorf, N.
Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers
Proc. 31st International Spring Seminar on Electronics Technology (ISSE)
Rieske, R.; Nieweglowski, K.; Wolter, K.-J.
Elektro-Optische Leiterplatte – Trends und aktuelle Forschung
Konferenzband zur 16. FED-Konferenz: "Elektronik-Design – Leiterplatten – Baugruppen 2008", Bamberg, 25 - 27 September 2008, pp. 259 – 265
Siesicki, M.; Nieweglowski, K.; Wolter, K.-J.; Patela, S.
Integrated optical waveguides for electrooptical PCB
IEEE Proceedings of the 2008 International Students and Young Scientists Workshop "Photonics and Microsystems", Wroclaw/Szklarska Poreba, June 20-23, 2008n
Siesicki, M.; Nieweglowski, K.; Wolter, K.-J.; Patela, S.
Development of Sol-Gel Integrated Optical Waveguides for Electro-Optical PCB
IEEE CPMT Proceedings of the 31th International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-17, 2008, pp. 224 – 229
Nieweglowski, K.; Wolter, K.-J.
Novel Optical Transmitter and Receiver for Parallel Optical Interconnects on PCB-Level
IEEE CPMT Proceedings of the 2nd Electronics Systemintegration Technology Conference, Vol 1, Greenwich, UK, September 5-7, 2008, pp. 607-611
2006
Nieweglowski, K.; Wolter, K.-J.
Elektro-optisches Modul für optische Verbindungen auf LP-Ebene - Koppelkonzept und optische Charakterisierung
9. Workshop "Optik in Rechentechnik" - ORT 2006, Siegen, Germany, 27. Oktober, 2006
Nieweglowski, K.; Wolter, K.-J.
Optical Analysis of Short-Distance Optical Interconnect on the PCB-Level
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, pp. 392-397
Galardziak, P.; Nieweglowski, K.; Patela, S.; Wolter; K.-J.
Optical Multi-Chip Ceramic Transmitter Module
2006 International Students and Young Scientists Workshop "Photonics and Microsystems", June 30th - July 2d, 2006, Wroclaw/Szklarska Poreba, Poland
Nieweglowski, K.; Galardziak, P.; Wolter, K.-J.
Ceramic Interposer for Optoelectronic Array Devices
29th International Spring Seminar on Electronics Technology, IEEE Catalog Number: 06EX1493C, St. Marienthal, Germany, May 10th to 14th, 2006, pp. 68-73
2005
Nieweglowski, K.; Rieske, R.; Schulze, D.; Wolter, K.-J.
Technology downscale for optical waveguides in cost performance electrical-optical circuit boards
IEEE CPMT Proceedings of the 28th International Spring Seminar on Electronics Technology, Wiener Neustadt, Austria, May 19-20, 2005, pp. 202-206
2004
Nieweglowski, K.; Wolter, K.-J.
Optical Interconnections on PCBs - recent developments
2004 International Students and Young Scientists Workshop "Photonics and Microsystems", Wroclaw/Szklarska Poreba, June 24-27, 2004, IEEE Conference Proceedings (ISBN 0-7803-8598-5), 2004.
Hormanski, P.; Nieweglowski, K.; Wolter, K.-J.; Patela, S.
Investigation on Butt-coupling of VCSEL into PCB integrated Waveguides
IEEE CPMT Proceedings of the 27th Int. Spring Seminar on Electronics Technology (Annual School Lectures, Vol 24, ISBN 0-7803-8422-9, IEEE Cat.No. 04EX830), Sofia, Bulgaria, May 14-16, 2004, pp. 167-170.
2003
Rieske, R.; Nieweglowski, K.; Wolter, K.-J.
Cost Effective Method for Spatially Resolved Characterisation of Board Level Optical Waveguides
ISSE 2003, Stara Lesna, Slovakia
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