With the expanding use of electronic systems, sustainable manufacturing and electronics packaging technologies are becoming increasingly important throughout the entire product life cycle. Against the backdrop of rising resource consumption and growing volumes of electronic waste, our institute develops concepts that reduce material consumption, enable the use of recycled materials, and improve the overall recyclability of electronic systems.

The research area "Sustainable Electronics Packaging" aims the development and processing of alternative, recyclable substrate materials as substitutes for conventional glass fiber-reinforced epoxy substrates. Particular emphasis is placed on investigation of their compatibility with the thermal and chemical processes of electronics manufacturing and evaluation of their suitability for industrial applications. Another key area of research is the processing of recycled metallic materials, such as recycled solder alloys and sinter pastes, to realize reliable interconnection technologies with reduced reliance on primary raw materials. In addition, innovative interconnection technologies are being developed to reduce the energy demand of manufacturing processes. These include approaches to lower process and melting temperatures as well as gentle bonding processes featuring short processing times, low temperatures, and localized energy input. The overall objective is to develop resource-efficient manufacturing processes that combine sustainable materials with high process reliability and performance.