productronica 2023
Projektteam Ankotherm gewinnt den “productronica Innovation Award” in der Kategorie “Inspection & Quality”

56th International Symposium on Microelectronics, IMAPS, San Diego, USA
BEST STUDENT PRESENTATION AWARD
Tobias Tiedje, Stereolithographic process for embedding of electronic components into multi-material flexible and stretchable polymer substrate to reduce stress during stretching

46th ISSE, Timisoara, Romania
EXCELLENT PAPER AWARD
Akash Mistry, Hybrid-Lithography for the Master of Multi-Mode Waveguides NIL Stamp

9th ESTC, Sibiu, Romania
OUTSTANDING POSTER AWARD
Daniel Ernst, Feasibility Study of Magnetically Enhanced Interconnects for Integration of Flexible and Stretchable Electronics

Berufsausbildung Mikrotechnologin
Janine Naumann
Ehrenurkunde der Landesarbeitsgemeinschaft der Industrie- und Handelskammern im Freistaat Sachsen für den besten Berufsabschluss im Berufsbild Mikrotechnologe 2020 in Sachsen

8th ESTC, Vestfold, Norway
BEST POSTER AWARD
Lukas Lorenz, Lennard Ott, Krzysztof Nieweglowski, Karlheinz Bock
Influence of Temperature Cycling on Asymmetric Optical Bus Couplers

IEEE-EPS
Prof. Thomas Zerna wird mit dem “IEEE-EPS Regional Contribution Award 2020” ausgezeichnet. 

Embedded World 2020
Projektteam KONEKT belegt den 2. Platz im Wettbewerb “Embedded Award”.

productronica 2019
Projektteam KONEKT belegt den 2. Platz im “Fast Forward Award”, dotiert mit einem Marketing-Budget für junge Unternehmen.

21st EMPC, Warsaw, Poland
BEST PAPER AWARD
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Künzelmann, U.; Wolf, J.; Lang, K.-D.
Characterisation of Cu/Cu Bonding Using Self-assembled Monolayer as Oxidation Inhibitor

40th IEEE-ISSE, Sofia, Bulgaria
EXCELLENT PRESENTATION AWARD FOR YOUNG SCIENTISTS
Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.; Lang, K.-D.
Cu Passivation with Self-assembled Monolayers for Direct Metal Bonding in 3D Integration

40th IEEE-ISSE, Sofia, Bulgaria
BEST PRESENTATION AWARD FOR YOUNG SCIENTISTS
Wambera, L.; Panchenko, I.; Steller, W., Müller, M.; Wolf, M.
Influence of Flux-Assisted Isothermal Storage on Intermetallic Compounds in Cu/SnAg Microbumps

18th EuroSimE, Dresden, Germany
OUTSTANDING POSTER AWARD
Kraemer , F.; Roellig, M.; Metasch, R.; Wiese, S.; Al Ahmar, J.; Meier, K.
Experimental Determination of the Young’s Modulus of various Electronic Packaging Materials

39th ISSE, Plzen, Czech Republic
BEST PRESENTATION AWARD
Maik Müller
DSC Investigation of the Undercooling of SnAgCu Solder Alloys

39th ISSE, Plzen, Czech Republic
EXCELLENT POSTER AWARD FOR YOUNG SCIENTISTS
Martin Schubert
Screen Printed Conductive Pastes for Biomedical Electronics

63rd ECTC, Las Vegas, USA
BEST INTERACTIVE PRESENTATION PAPER
Peter Sättler, M. Böttcher, Catharina Rudolph, Klaus-Jürgen Wolter
Bath Chemistry and Copper Overburden as Influencing Factors of the TSV Annealing

4th ESTC, Amsterdam, Netherlands
BEST POSTER AWARD
Johannes Bohm, Karsten Meier, Klaus-Jürgen Wolter
Inductively Excited Lock-in Thermography for PCB-Vias

62nd ECTC, San Diego, USA
BEST INTERACTIVE PRESENTATION PAPER
Thomas D. Ewald, Norbert Holle, Klaus-Jürgen Wolter
Void Formation during Reflow Soldering

HEINRICH-BARKHAUSEN-PREIS der Fakultät EuI der TU Dresden für die beste Dissertation 2011
verliehen am 9.11.2012
Andreas Klemmt
Ablaufplanung in der Halbleiter- und Elektronikproduktion: hybride Optimierungsverfahren und Dekompositionstechniken

12th EPTC 2010, Singapore
BEST POSTER AWARD
Martin Oppermann, Thomas Zerna, Klaus-Jürgen Wolter
X-ray Computed Tomography for Nano Packaging - A Progressive NDE Method

59th ECTC, San Diego, USA
OUTSTANDING POSTER PAPER
Karsten Meier, Steffen Wiese, Mike Röllig, Klaus-Jürgen Wolter
Mechanical Characterization of Lead-Free Solder Alloys under High Strain Rate Loads

59th ECTC, San Diego, USA
BEST POSTER PAPER
Krzysztof Nieweglowski, Ralf Rieske, Klaus-Jürgen Wolter
Demonstration of Board-Level Optical Link with Ceramic Optoelectronic Multi-Chip Module