Externe Doktoranden
Referenzen
2021
Schlipf, S.; Sander, C.; Clausner, A.; Paul, J.; Capecchi, S.; Wambera, L.; Meier, K.; Zschech, E.
IC package related stress effects on the characteristics of ring oscillator circuits
IEEE 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), DOI: 10.1109/EuroSimE52062.2021.9410858
Chaudhuri, A.; Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Warpage Behaviour and Thermo-Mechanical Robustness of Large Packages for mmWave Applications
IEEE 44th International Spring Seminar on Electronics Technology (ISSE), DOI: 10.1109/ISSE51996.2021.9467580
2020
Schubert, M.; Wambera, L.; Mudrievska, O.; Nieweglowski, K.; Wagner, J.; Partzsch, J.; Mayr, C.; Ellinger, F.; Bock, K.
Flexible and stretchable redistribution layer with embedded chips for human-machine interface
IEEE 8th Electronics System-Integration Technology Conference (ESTC), Vestfold, Norway, doi: 10.1109/ESTC48849.2020.9229694.
Panchenko, I.; Wambera, L.; Mueller, M.; Rudolph, C.; Hanisch, A.; Bartusseck, I.; Wolf, M. J.
Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability Testing
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virutal event, 2020
Schlipf, S.; Clausner, A.; Paul, J.; Capecchi, S.; Wambera, L.; Meier, K.; Zschech, E.
Nanoindenation to investigate IC performance using ring oscillator circuits as a CPI sensor
Proceedings of the International Reliability Physics Symposium (IRPS), virtual event, 2020
Meier, K.; Wambera, L.; Boehme, B.; Goetze, C.; Capecchi, S.; Paul, J.; Wieland, M.; Bock, K.
Reliability Testing of FCCSP Packages for Automotive Applications
Proceedings of the 8th Electronics System-Integration Technology Conference (ESTC), virutal event, 2020
Wambera, L.; Meier, K.; Goetze, C.; Wieland, M.; Bock, K.
Reliability Assessment of mmWave Modules
Proceedings of the 70th Electronic Components and Technology Conference (ECTC), virtual event, 2020; DOI: 10.1109/ECTC32862.2020.00125
2019
Meier, K.; Wambera, L.; Boehme, B.; Goetze, C.; Paul, J.; Bock, K.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
Proceedings of the Advanced Packaging Conference, Munich (Germany), 2019
Wambera, L.; Meier, K.; Höhne, R.; Böhme, B.; Götze, C.; Paul, J.; Wieland, M.; Bock, K.
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Hannover, Germany, March 24-27; DOI: 10.1109/EuroSimE.2019.8724515
2017
Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M. J.
Accelerated SLID Bonding for Fine-Pitch Interconnects with Porous Microstructure
IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, USA, May 30-June 2; DOI: 10.1109/ECTC.2017.231
Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M. J.
Influence of Flux-Assisted Isothermal Storage on Intermetallic Compounds in Cu/SnAg Microbumps
40th International Spring Seminar on Electronics Technology (ISSE), Sofia, Bulgaria, May 10-14 (ISSE 2017 Award - Best Presentation Award for Young Scientist); DOI: 10.1109/ISSE.2017.8000909
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