Emeriti und Hochschullehrer i.R.
Prof. Dr.-Ing. habil. Dr. h. c. mult.
Klaus-Jürgen Wolter
Tel.:
(0351) 463 43789
Büro:
N63 A.213
Vita
Prof. Dr. Klaus-Juergen Wolter, TU Dresden, Germany
born 12.03.1949 in Grimmen, Germany
Education:
1973 Diploma (M.Sc.) in Electrical Engineering, National Technical University of Ukraine “NTUU KPI”, Kiev, Ukraine
1983 Dr.-Ing. (Ph.D.) in Electrical Engineering, Dresden University of Technology, Dresden, Germany
1987 Dr.-Ing. habil. in Electrical Engineering, Dresden University of Technology
Professional Experience:
- Since 10/2020 Emeritus Professor of the Electronic Packaging Lab at Dresden University of Technology
- 10/2014-09/2020 Senior Professor of the Electronic Packaging Lab at Dresden University of Technology
- 03/2015-03/2017 Visiting Professor at 3D Systems Packaging Research Center at Georgia Institute of Technology Atlanta, Program manager for advanced automotive electronics
- Since 2006 to 3/2014 Deputy Head of Fraunhofer IKTS-MD Dresden
- Since 2003 to 9/2014 Director of the Electronic Packaging Lab at Dresden University of Technology
- 1992 Appointment to the chair of Procedure Technology of Electronics
Fields of research:
- System integration in electronics
- Assembly technologies
- Interconnect technologies
- Electronics packaging for automotive electronics
- Reliability of electronic devices
- Non-destructive test methods
Teaching experience:
1992-2014 Lecture courses at Dresden University of Technology on:
- Fundamentals of Electronics Packaging
- Fundamentals of Electronics Interconnections and Assembly
- Reliability of electronics devices and systems
- Non-destructive test methods
- Fundamentals of Laser machining
2015-2017 Lectures at Georgia Institute of Technology:
- Lecture on System integration for advanced automotive electronics
- Lecture on advanced automotive sensors
Publications:
- Co-author of 25 journal papers and Author and author and co-author of more than 390 conference paper
- Co-author of 11 patents
- Co-author of seven books in Electronics Packaging
- Editor of book series: „Elektronik-Technologie in Forschung und Praxis“, Verlag Dr. Markus Detert, Templin, Band 1 – 16
- Editor of book series: „System Integration in Electronic Packaging“, Verlag Dr. Markus Detert, Templin, Band 1 – 20
- Editor of book series: „Dresdner Beiträge zur zerstörungsfreien Prüftechnik“, Verlag TUDpress, Dresden, Band 1 – 5
- Editor of book series: „Dresdner Beiträge zur Aufbau- und Verbindungstechnik der Elektronik“, Verlag TUDpress, Dresden, Band 1 – 5
Supervisor of theses:
- Supervisor of 47 Ph.D. students
- Supervisor of 8 doctors of science (Habilitation)
Fellowships and Honours:
- 2014 IEEE CPMT Regional Contributions Award – Region Europe
- Doctor of honoris causa of Technical University Kiev 2014
- Doctor of honoris causa of University Politehnica Bukarest 2013
- Senior Member of IEEE-CPMT, 2009
- General Chair of “International Spring Seminar on Electronic Technology” 2003-2012
- Chair of the 5th and 8th International Academic Conference on Electronic Packaging Education and Training
- General Chair of 1st IEEE CPMT Electronics Systemintegration Technology Conference 2006
- Governor of IEEE-CPMT board 2006 – 2010
- Best paper awards of IEEE ECTC in 2000, 2009 and 2012
- Best paper award of IEEE EPTC in 2013
- Best poster award of IEEE EPTC in 2012
- Best poster award of IEEE ESTC in 2012
Industrial Experiences:
- 1973-1989 Head of a division in electronic design for microelectronic equipment in Centre of Microelectronic Dresden
- 1994 Co-founder of the company KSW Microtec AG Dresden, today Smartrac Technology Dresden GmbH
- 2013 Mentor of the start-up „Lumiloop“ – Photonic Packaging Technologies
Zurück
Referenzen
2022
Franke, J.; Overmeyer, L.; Lindlein, N.; Bock, K.; Kaierle, S.; Suttmann, O.; Wolter. K.
Optical Polymer Waveguides
Springer Cham, 2022, ISBN 978-3-030-92853-7; https://doi.org/10.1007/978-3-030-92854-4
Mueller, M.; Schindler, S.; Wolter, K.-J.; Wiese, S.; Panchenko, I.
Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermography
Thermochimica Acta, Volume 714, 2022, 179245.
ISSN 0040-6031, https://doi.org/10.1016/j.tca.2022.179245.
2020
Klinghammer, S.; Voitsekhivska, T.; Licciardello, N.; Kim, K.; Baek, C.-K.; Cho, H.; Wolter, K.-J.; Kirschbaum, C.; Baraban, L.; Cuniberti, G.;
Nanosensor-Based Real-Time Monitoring of Stress Biomarkers in Human Saliva Using a Portable Measurement System
American Chemical Society, ACS Sensors 12/2020, DOI: 10.1021/acssensors.0c02267
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn–Ag–Cu Solder Balls
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 1, pp 18 -29, Jan. 2020; DOI: 10.1109/TCPMT.2019.2952093
2019
Lee, H.; Tummala, R.; Wolter, K.-J.
Applications of Packaging Technologies in Future Car Electronics
in Rao Tummala: Fundamentals of Device and Systems Packaging, 2019 McGraw-Hill
Hesketh, P.; Brand, O.; Wolter, K.-J.
Fundamentals of MEMS and Sensor Packaging
in Rao Tummala: Fundamentals of Device and Systems Packaging, 2019 McGraw-Hill
Paulasto-Kröckel, M.; Petzold, M.; Wolter, K.-J.
Robust Electronics for Automotive Applications Including Autonomous Driving
Proceedings of ECTC 2019, Professional Development Course No. 16
2018
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder Balls
7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 2019, DOI: 10.1109/ESTC.2018.8546391
Nieweglowski, K.; Lorenz, L.; Lüngen, S.; Tiedje, T.; Wolter, K.-J.; Bock, K.
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
Microelectronics Reliability, vol. 84, pp. 121–126
Reitberger, T.; Stoll, T.; Hoffmann, G.-A.; Lorenz, L.; Neermann, S.; Overmeyer, L.; Bock, K.; Wolter, K.-J.; Franke, J.
The future of short-range high-speed data transmission: printed polymer optical waveguides (POW) innovation, fabrication, and challenges
SPIE Optics + Photonics, San Diego, USA
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Two-Stage Simulation for Coupling Schemes in the Device Communication using Ray Tracing and Beam Propagation Method
7th Electronics System-Integration Technology Conference (ESTC), Dresden
2017
Chorosinski, L.; Sundaram, V.; Wolter, K.; Calatayud, R.; Ralston, P.; Suko, S.; Fry, D.; Ellerhoff, N.
Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small “Dielets”
Proceedings of IMAPS 2017 - 50th International Symposium on Microelectronics - Raleigh, NC USA - Oct. 9-12, 2017
Struk, D.; Buch, C.; Hesketh, P. J.; Wolter, K.-J.; Tummala, R.
Thermal and Mechanical Analysis of 3D Glass Packaging for Automotive Cameras
Proceedings of IEEE ECTC 2017, p. 2269-2274
Buch, C.; Struk, D.; Wolter, K.-J.; Hesketh, P. J.; Sundaram, V.; Tummala, R.
Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors
Proceedings of IEEE ECTC 2017, p. 1088-1097
Lorenz, L.; Nieweglowski, K.; Al-Husseini, Z.; Neumann, N.; Plettemeier, D.; Wolter, K.-J.; Reitberger, T.; Franke, J.; Bock, K.
Asymmetric optical bus coupler for interruption-free short range connections on board and module level
IEEE Journal of Lightwave Technology Vol.35 (18), S. 4033-4039
DOI: 10.1109/JLT.2017.2728198
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Hoffmann, G.-A.; Overmeyer, L.; Reitberger, T.; Franke, J.; Bock, K.
Additive waveguide manufacturing for optical bus couplers by aerosol jet printing using conditioned flexible substrates
IMAPS 21st European Microelectronics Packaging Conf. (EMPC), Warschau, Polen
Lorenz, L.; Nieweglowski, K.; Reitberger, T.; Franke, J.; Wolter, K.-J.; Bock, K.
Asymmetric optical bus couplers with Aerosol Jet printed polymer waveguides
118th Annual Meeting of the DGaO, Dresden
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Loosen, F.; Lindlein, N.; Bock, K.
Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers
IMAPS Journal of Microelectronics and Electronic Packaging, Vol. 14, No.1 pp.1-10, http://dx.doi.org/10.4071/imaps.530
Varga, M.; Wolff P.; Wolter, K.-J.;
Biocompatibility study of three distinct carbon pastes for application as electrode material in neural stimulations and recordings
Journal of Material Science: Materials in Medicine, 2017, 28(2), 1-9
2016
Buch, C.; Raj, P. M.; de Brown, B.; Sharma, H.; Sun, T.; Moon, K.-S.; Wolter, K.-J.; Tummala, R.
Ultra-thin Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors
Proceedings of IEEE ECTC 2016, p. 2364-2371
Varga, M.; Wolter K.-J.
Evaluation of cytotoxic effects of three commercial carbon pastes used as conductor tracks on a hook-up neural electrode
Georgia Bio Innovation Summit, September 28, 2016 (Abstract and Poster presentation)
Reitberger, T.; Hoffmann, G.-A.; Lorenz, L.; Wolter, K.-J.; Overmeyer, L.; Franke, J.
Integration of Polymer Optical Waveguides by Using Flexographic and Aerosol Jet Printing
IEEE CPMT 12th International Congress Molded Interconnect Devices 2016, Würzburg
Hoffmann, G.-A.; Reitberger, T.; Lorenz, L.; Wolter, K.-J.; Franke, J.; Overmeyer, L.
Combination of Flexographic and Aerosol Jet Printing for integrated polymer optical step index waveguides
117th Annual Meeting of the DGaO, Hannover
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Analysis of bending effects for optical-bus-couplers
IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas
Lorenz, L.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Simulation of bended planar waveguides for optical bus couplers
Proc. SPIE 9889, Optical Modelling and Design IV
2015
Nieweglowski, K.; Jenning. M.; Rieske, R.; Wolter, K.-J.; Plettemeier, D.; Fettweis, G.
System und Verfahren zur Übertragung von Daten mit mindestens zwei zur Datenübertragung und Datenverarbeitung ausgebildeten Elementen
Patent: Offenlegungsschrift DE 10 2014 213 037 A1, Anmeldetag 04.07.2014, Offenlegungstag 08.01.2015
Lorenz, L.; Rieske, R.; Nieweglowski, K.; Wolter, K.-J.; Bock, K.
Wafer-Level Integration Technology for Multi Emitter High Power Fiber Coupled Lasers
Proc. of IMAPS 20th European Microelectronics Packaging Conf. (EMPC), pp.: 1-6
Nieweglowski, K.; Lorenz, L.; Wolter, K.-J.; Bock, K.
Multichannel optical link based on polymer multimode waveguides for boardlevel interchip communication
Proc. of IMAPS 20th European Microelectronics Packaging Conf. (EMPC), pp.: 1-7
Bonasewicz, R,; Knies, S.; Krauss, A.; Wolter, K.-J.
Multiphysics Investigation of Gas Sensor PAckage
ISSE 2015
Voitsekhivska, T.; Zörgiebel, F.; Suthau, E.; Wolter, K.-J.; Bock, K. and Cuniberti, G.
pH measurements of FET-based (bio)chemical sensors using portable measurement system
37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’15), pp. 6445-6448, ISSN: 978-1-4244-9270-1/15
Gluch, J.; Löffler, M.; Meyendorf, N.; Oppermann, M.; Röllig, M.; Sättler, P.; Wolter, K.-J.; Zschech, E.
Multi-scale Radiographic Applications in Microelectronic Industry
Vortrag & Paper auf QNDE 2015, 26.-31.07.2015 in Minneapolis (USA)
Voitsekhivska, T.; Suthau, E. ; Wolter, K.-J.
Transportables Messsystem für biochemische Sensoren
9. Deutsches BioSensor Symposium, München, p.130
Nieweglowski, K.; Henker, R.; Schoeniger, D.; Ellinger, F.; Wolter, K. . J.; Bock, K.
Energy-Efficient Optical Interconnects for High Performance Computing
Fachzeitschrift PLUS, Ausgabe 1/2015, S. 137-124
2014
Albrecht, O.; Bellmann, B.; Gueldner, S.; Noetzold, M.; Oppermann, M.; Wolter, K.-J.
Pin-in-Paste für klein- und großvolumige Aluminium-Elektrolytkondensatoren – Technologieentwicklung und Zuverlässigkeitsuntersuchungen
Paper und Präsentation auf der EBL 2014 / Fellbach
Schulz, K.; Ernst, D.; Menzel, S.; Gemming, Th.; Eckert, J.; Wolter, K.-J.
Thermosonic Platinum Wire Bonding on Platinum
37th International Spring Seminar on Electronics Technology, Dresden, Germany, 7th - 11th of May 2014
Voitsekhivska, T.; Suthau, E.; Kirsten, S.; Schubert, M.; Zorgiebel, F. ; Cuniberti, G.; Wolter, K.-J.
Package characterization of FET-based biochemical sensors
IEEE 16th Electronics Packaging Technology Conference (EPTC), Singapur, pp. 725 - 729, DOI: 10.1109/EPTC.2014.7028338
Voitsekhivska, T.; Suthau, E. ; Wolter, K.-J.
CMOS multiplexer for portable biosensing system with integrated microfluidic interface
IEEE 64th Electronic Components and Technology Conference (ECTC), Orlando, FL, pp. 173 - 178, DOI: 10.1109/ECTC.2014.6897285
Kirsten, S.; Schubert, M.; Braunschweig, M.; Woldt, G.; Voitsekhivska, T.; Wolter, K.-J.
Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials
IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 719 - 724, doi: 10.1109/EPTC.2014.7028327
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.
Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung – Untersuchungen bei Raumtemperatur, bei Hochtemperatur und nach isothermer Voralterung
Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag; ISSN 1436-7505
Meier, K.; Wolter, K.-J.
Reliability of SMD Capacitor Solder Joints under Sequential Thermo-Mechanical and Vibration Loading
4th Global Interposer Technology (GIT) 2014 Workshop, Atlanta, 2012
Varga, M.; Wolter, K-J.
Sensors and imaging methods for detecting loosening of orthopedic implants - a review
IEEE XXth International Symposium for Design and Technology in Electronic Packaging, October 23-26, 2014, Bucuresti, Romania, pp. 333-335.
Lorenz, L.; Sohr, S.; Rieske, R.; Nieweglowski, K.; Zerna, T.; Wolter, K.-J.
Development of a wafer-level Integration Technology for Photonic Transceivers Based on Planar Lightwave Circuits
37th International Spring Seminar on Electronics Technology, Dresden, Germany, 7th - 11th of May 2014
Panchenko, I.; Grafe, J.; Mueller, M; Wolter, K.-J.; Wolf, M. J.; Lang, K.-D.
Processing and Microstructure of Solid-Liquid Interdiffusion Interconnects for 3D Integration
DATE Conference - Design, Automition and Test in Europe , Dresden, 24.03.-28.03.2014 , 2014
Panchenko, I.; Croes, K.; De Wolf, I.; De Messemaeker, J.; Beyne, E.; Wolter K.-J.
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Microelectronic Engineering, Vol. 17, April, 2014, pp. 26-34; DOI: 10.1016/j.mee.2013.12.003
Oppermann, M.; Albrecht, O.; Klemm, A.; Zerna, T. & Wolter, K.-J.
Low-Cost Electrical Measurement Systems for Reliability Testing
Paper & Präsentation auf ESTC 2014 in Helsinki
Varga, M.; Schulz, K.; Taschwer, A.; Wolter, K-J.
Towards wireless neural electrodes: system-integration for stimulating and recording of nerve signals (second place in the ranking of papers for the ESTC 2014 best paper award)
5th Electronics System-Integration Technology Conference (ESTC), September 16-18, 2014, Helsinki, Finland, pp. 1-5.
Kirsten, S.; Schubert, M.; Uhlemann, J.; Wolter, K.-J.
Characterization of Ionic Permeability and Water Vapor Transmission Rate of Polymers Used for Implantable Electronics
36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’14), pp. 6561-6554, ISSN: 978-1-4244-7929-0/14
Bohm, J.; Wolter, K.-J.; Heuer, H.
Solder Joint Inspection with Induction Thermography
64th ECTC, Lake Buena Vista
Wolter, K.-J.; Oppermann, M.; Zschech, E.
Hochauflösende Röntgendiagnostik an Bauelementen der 3D-Integration
IMAPS Frühjahrsseminar, Dresden, 20.03.2014
Nieweglowski, K.; Henker, R.; Ellinger, F.; Wolter, K.-J.
Performance of step index multimode waveguides with tuned numerical aperture for on-board optical links
Proc. of SPIE Vol. 8991, Optical Interconnects XIV
Metasch, R.; Roellig, M.; Kabakchiev, A.; Metais, B.; Ratchev, R.; Meier, K.; Wolter, K.-J.
Experimental Investigation of the Visco-plastic Mechanical Properties of a Sn-based Solder Alloy for Material Modelling in Finite Element Calculations of Automotive Electronics
Proceedings of the 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Gent, 2014
Meier, K.; Lautenschläger, G.; Röllig, M.; Schießl, A.; Wolter, K.-J.
Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Elektronische Baugruppen und Leiterplatten EBL 2014 Von Hochstrom bis Hochintegration, 7. DVS/GMM-Fachtagung, Fellbach, 2014
Meier, K.; Röllig, M.; Schießl, A.; Wolter, K.-J.
Reliability Study on Chip Capacitor Solder Joints under Thermo-Mechanical and Vibration Loading
Proceedings of the 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Gent, 2014
2013
Voitsekhivska, T.; Suthau, E. ; Wolter, K.-J. ; Baraban, L.; Zorgiebel, F. ; Cuniberti, G.
Portable measurement system for silicon nanowire field-effect transistor-based biosensors
IEEE 36th International Spring Seminar on Electronics Technology (ISSE), Alba Iulia, pp. 349 - 354, DOI: 10.1109/ISSE.2013.6648271
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Microstructure Investigation of the Cu/SnAg Solid-Liquid Interdiffusion Interconnects by Electron Backscatter Diffraction
15th Electronics Packaging Technology Conference (EPTC), Singapore, December 11-13 (Best Academic Paper Award)
Nieweglowski, K.; Rieske, R.; Henker, R.; Schoeniger, D.; Ellinger, F.; Wolter, K. . J.
Optical interconnects for adaptive high performance computing
IEEE Workshop „Photonics and Microsystems”
Varga, M.; Luniak, M.; Wolter, K.-J.
Technology for bipolar polycarbonate electrodes applied for intraoperative neuromonitoring
15th Electronics Packaging Technology Conference (EPTC), December 11-13, 2013, Singapore, pp. 103-107.
Varga, M.; Wolter, K.-J.
New Frontiers in Education - Training in Biology for Electrical Engineers (Best Poster Award)
IEEE XIXth International Symposium for Design and Technology in Electronic Packaging, October 24-27, 2013, Galati, Romania, pp. 289-293.
Schwerz, R.; Meier, K.; Röllig, M.; Osmolovskyi, S.; Wolter, K.-J.
Reliability of Passive Components Embedded in Organic Substrates
3rd Global Interposer Technology Workshop (GIT) 2013, Atlanta (USA)
Meier, K.; Röllig, M.; Wolter, K.-J.
The Effect of Cu and Ag on the Yielding Behaviour of Lead-Free Solders at High Strain Rates
Proceedings of the 15th Electronics Packaging Technology Conference (EPTC), Singapore
Rieske, R.; Sohr, S.; Suthau, E.; Hildebrandt, S.; Wolter, K.-J.
Optical Energy and Data Transmission in a Self-contained Sensor Interface for EMC Sensitive Environments
2013 Optical Techniques and Nano-Tools for Material and Life Sciences Conference Dresden
Mauermann, C.;Sohr, S.; Rieske, R.; Nieweglowski, K. and Wolter, K.-J.
Photolithographic structuring of planar optical waveguides on flexible, organic substrates
2013 International Students and Young Scientists Workshop Photonics and Microsystems
Lorenz, L.;Sohr, S.; Rieske, R. and Wolter, K.-J.
3D Micro Structuring of Glasses for Wafer-Level Photonic Packaging
2013 International Students and Young Scientists Workshop Photonics and Microsystems
Lauerwald, T.;Sohr, S.; Rieske, R.; Suthau, E. and Wolter, K.-J.
Beam Homogenization for Conversion Efficiency Measurement of Laser Power Converters
2013 International Students and Young Scientists Workshop Photonics and Microsystems
Sohr, S.; Rieske, R. and Wolter, K.-J.
Experimental verification of simulation based laser power converter optimization
2013 International Students and Young Scientists Workshop Photonics and Microsystems
Sättler, P; Böttcher, M.; Rudolph, C.; Wolter, K.-J.
Thermo-mechanische Charakterisierung des TSV-Annealing
Produktion von Leiterplatten und Systemen (PLUS), Fachzeitschrift für Aufbau- und Verbindungstechnik in der Elektronik, 7/2013
Ernst, D.; Zerna, Th.; Wolter, K.-J.
Lifetime evaluation of flexible substrates or flexible systems under mechanical stress conditions
Plastic Electronics Exhibition & Conference, Dresden, 2013
Ernst, D.; Häfner, C.; Müller-Meskamp, L.; Wolter, K.-J.; Zerna, Th.
Realisation and Packaging on Transparent Conductive Layers made by Coating of Silver Nanowires
Large-area, Organic & Printed Electronics Convention (LOPE-C), Munich, 2013
Varga, M.; Luniak, M.; Wolter, K.-J.
Novel electrode designs for intraoperative neuromonitoring (oral presentation)
2nd International conference "Optical Techniques and Nano-Tools for Material and Life Sciences", September 30 - Oktober 1, 2013, Dresden, Germany
Kirsten, S.; Schubert, M.; Uhlemann, J.; Wolter, K.-J.
Fluid Dynamic Load of Polymers Used as Encapsulation Material for Implantable Microsystems
Biomedical Engineering / Biomedizinische Technik, 2013, DOI: 10.1515/bmt-2013-4067
Sättler, P; Böttcher, M.; Rudolph, C.; Wolter, K.-J.
Bath Chemistry and Copper Overburden as influencing Factors of the TSV Annealing
Proceedings of the 63rd Electronic Components and Technology Conference (ECTC), Las Vegas
Sättler, P.; Böttcher , M.; Wolter, K.-J.
μ-Raman Spectroscopy and FE-Analysis of thermo-mechanical Stresses in TSV Periphery
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wrocław
Röllig, M.; Metasch, R.; Schingale, A.; Schießl, A.; Meier, K.; Meyendorf, N.
Novel Quick Predict Approach for Identification of Critical Loadings in Electronic Components on PCB under Vibration Realized as a Design Support Tool
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Schwerz, R.; Meier, K.; Röllig, M.; Schingale, A.; Schießl, A.; Wolter, K.-J.; Meyendorf, N.
Evaluation of Embedded IC Approach for Automotive Application
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Nieweglowski, K.; Rieske, R.; Sohr, S.; Wolter, K.-J.
Design and Optimization of Planar Multimode Waveguides for High Speed Board-Level Optical Interconnects
63rd Electronic Components and Technology Conference, Las Vegas, 27th - 31st of May
Sohr, S.; Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging
63rd Electronic Components and Technology Conference, Las Vegas, 27th - 31st of May
Bohm, J.; Wolter, K.-J.
Anregungstechnik für die Induktiv Angeregte Thermografie in der Aufbau- und Verbindungstechnik
DGZfP-Jahrestagung Dresden
Kirsten, S.; Wetterling, J.; Uhlemann, J.; Zigler, S.; Wolter K.-J.
Barrier Properties of Polymer Encapsulation Materials for Implantable Microsystems
IEEE XXXIII International Scientific Conference on Electronics and Nanotechnology, 2013, pp. 269 - 272, ISBN: 978-1-4673-4670-2
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.; Meyendorf, N.
Determination of Life-time of Solder Joints under Temperature and Vibration Loadings
Proceedings of the International Conference MicroCar 2013
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.
Lifetime Assessment for Bipolar Components under Vibration and Temperature Loading
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Rodriguez, Diaz L.; Varga, M.; Wolter, K-J.; Pliquett, U.
Impedance as guidance for electrode placement in intraoperative monitoring of nerve fibers
Journal of Physics: Conference series 434 (2013) 012025, IEEE XVth International Conference on Electrical Bio-Impedance (ICEBI), April 22-25, 2013, Heilbad Heiligenstadt, Germany
Varga, M.; Luniak M.; Wolter, K-J.
Novel self-folding electrode for neural stimulation and recording
IEEE XXXIII International Scientific Conference on Electronics and Nanotechnology, April 16-19, 2013, Kyiv, Ukraine, pp. 237-240.
Bohm, J., Meier, K., Wolter K.-J.
Induktionsthermografie zur zerstörungsfreien Rissprüfung an Leiterplatten-Vias
'Produktion von Leiterplatten und Systemen' (PLUS), Ausgabe 01/2013, S. 162ff, Leuze-Verlag Bad Saulgau, ISSN 1436-7505
2012
Bramlage, S., Wolter, K.-J.
Effects of Vapor Phase Soldering on the Properties of Piezoceramic Materials
CICMT, Erfurt, 2012.
Frömmig, M.; Meier, K.; Wolter, K.-J.
Warpage Reduction by Underfill Capillary Action for Thin Die Bonding
2nd Global Interposer Technology (GIT) 2012 Workshop, Atlanta, 2012
Sättler, P.; Meier, K.; Böttcher, M.; Wolter, K.-J.
Annealing Behavior of copper-filled TSVs
2nd Global Interposer Technology (GIT) 2012 Workshop, Atlanta, 2012
Meier, K.; Johannsen, S. T.; Graf, M.; Wolter, K.-J.
Die Stacking Technology Using Nano-Wire Filled Polymer Films
2nd Global Interposer Technology (GIT) 2012 Workshop, Atlanta, 2012
Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Wolter, K.-J.; Meyendorf, N.
Progress in the development of radiation resistant, direct converting X-ray line detectors
Eurosensors Conference, Krakow, 2012
Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Wolter, K.-J.; Meyendorf, N.
Modular Design of Fully Integrated Counting Line Detectors
Procedia Engineering, 47, 530-533, 2012
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Einfluss der Bondkraft auf die Qualität von Cu/SnAg SLID Verbindungen für 3D Integration
AVT-Tagung, Warstein, 12. Dezember, 2012 (Vortrag)
Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.
Effects of Bonding Pressure on Quality of SLID Interconnects
4th Electronics Systemintegration Technology Conference (ESTC), Amsterdam, September 17 – 20, 2012
Albrecht, O.; Klemm, A.; Oppermann, M.; Wolter, K.-J.
Electrical Test Method and realized System for High Pin Count Components during Reliability Tests
Paper & Poster Presentation, 14th Electronics Packaging Technology Conference, Singapore, 5 - 7 December 2012
Kirsten, S.; Uhlemann, J.; Wetterling, J.; Wolter, K.-J.
Polymere Einhausungen zum Schutz von aktiven elektronischen Implantaten
Tagungsband 16. Heiligenstädter Kolloquium „Technische Systeme für die Lebenswissenschaften“, 2012, S. 81 - 88, ISBN: 978-3-00-039458-4
Kirsten, S.; Uhlemann, J.; Braunschweig, M.; Wolter, K.-J.
Packaging of Electronic Devices for Long-Term Implantation
35th Int. Spring Seminar on Electronics Technology (ISSE), 2012, pp. 123 - 127, ISSN: 2161-2528
Rieske, R.; Sohr, S.; Nieweglowski, K.; Wolter, K.-J.
Assembly tolerance requirements for photonics packaging of multi-cell laser power converters
Proceedings of the 4th Electronics Systemintegration Technology Conference (ESTC) 2012, Amsterdam
Ernst, D.; Schumann, F.; Nobis, C.; Zerna, T.; Wolter, K.-J.
Mikrokontaktierverfahren auf flexiblen Verdrahtungsträgern
Deutsche IMAPS-Konferenz, München, 11. - 12. Oktober 2012
Bohm, J., Meier, K., Wolter, K.-J.
Inductively Excited Lock-in Thermography for PCB-Vias
Proceedings of 4th ESTC, Amsterdam
Graf, M., Werheid, M., Wagner, M.; Johannsen, S.; Eychmüller, A.; Wolter, K.-J.
Two Basic Approaches towards Adhesive Nanowire-Filled Films for Anisotropic Nanowiring
4th Electronics System Integration Technologies Conference (ESTC), Amsterdam, Netherlands
Graf, M.; Wolter, K.-J.
Synthesis and Characterization of Nanowire Arrays as Anisotropic Interconnectors
IEEE XXXII International Conference on Electronics and Nanotechnology, Kiev, Ukraine
Graf, M.; Eychmüller, A.; Wolter, K.-J.
High Aspect Ratio Metallic Nanowires by Pulsed Electrodeposition
Nanoelectronic Device Applications Handbook, ed. by J. Morris & K. Iniewski, CRC Press Boca Raton, chapter 50
Frömmig, M.; Wolter, K.-J.
Warpage Reduction of Thin Dies by Capillary Action of Underfill Materials
4th Electronics System Integration Technology Conferences (ESTC), Amsterdam, Netherlands, September 17th - 20th
Frömmig, M.; Wolter, K.-J.
Influence Factors of Warpage Reduction of Thin Dies by Capillary Action
35th International Spring Seminar on Electronics Technology (ISSE 2012), Bad Aussee, Austria, May 9th - 13th
Oppermann, M.; Albrecht, O.; Klemm, A.; Wolter, K.-J.
Analysis of Degradation Effects on LEDs According to the Production Processes
Paper & Präsentation auf ESTC 2012 in Amsterdam
Wolter,K.-J.; Oppermann, M.; Luniak, M.; Wohlrabe,H.
Zerstörungsfreie Prüfverfahren für Lötstellen der Aufbau- und Verbindungstechnik der Elektronik
Vortrag auf dem Rehm-Technologietag 08.03.2012
Sättler, P; Böttcher, M.; Wolter, K.-J.
Characterization of the Annealing Behavior for Copper-filled TSVs
Proceedings of the 62nd Electronic Components and Technology Conference (ECTC), San Diego
Lange, J.; Bergs, F.; Weigert, G.; Wolter, K.-J.
Simulation of capacity and cost for the planning of future process chains
International Journal of Production Research
Schwerz, R.; Roellig, M.; Meier, K.; Wolter, K.-J.
Lifetime Assessment of BGA Solder Joints with Voids under Thermo-Mechanical Load
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Saettler, P.; Kovalenko, D.; Meier, K.; Roellig , M.; Boettcher , M.; Wolter, K.-J.
Thermo-mechanical Characterization and Modeling of TSV Annealing Behavior
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Meier, K.; Kraemer, F.; Wolter, K.-J.
High Strain Rate Behaviour of Lead-Free Solders Depending on Alloy Composition and Thermal Aging
Proceedings of the 62nd Electronic Components and Technology Conference (ECTC), San Diego, California (USA), 2012
Meier, K.; Kraemer, F.; Roellig, M.; Wolter, K.-J.
Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Boehme, B.; Roellig, M.; Lautenschlaeger, G.; Franke, M.; Schulz, J.; Wolter, K.-J.
Einbettung von Ultraschallwandler- und Elektroniksystemen in CFK-Strukturen für die sensorische Strukturüberwachung
Elektronische Baugruppen und Leiterplatten; Hochentwickelte Baugruppen aus Europa, 6. DVS/GMM-Fachtagung; Fellbach 14-15. Februar, 2012, Pages 85-90
2011
Graf, M., Eychmüller, A.; Wolter, K.J.
High Aspect Ratio Metallic Nanowire Arrays by Pulsed Electrodeposition
IEEE Conference on Nanotechnology (IEEE-NANO), Portland, OR, USA
Graf, M.; Meier, K.; Hähnel, V.; Schlörb, H.; Eychmüller, A.; Wolter, K.J.
Nanowire Filled Polymer Films for 3D Integration
International Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), Dresden, Germany
Uhlemann, J.; Beshchasna, N.; Engelien, E.; Bellmann, C.; Wolter, K.-J.
Biokompatible Elektronik
14. Europäisches Elektroniktechnologie-Kolleg; Porto Petro (Mallorca), 17.-19.03.2011
Sohr, S.; Fischer, D., Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Packaging and Characterisation of Ultra Low Power VCSEL for Sensor Networks
2011 International Students and Young Scientists Workshop Photonics and Microsystems
Sohr, S.; Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Laser Power Converters for Optical Power Supply
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May
Sättler, P.; Meier, K.; Wolter, K.-J.
Characterization of Cu-TSV microstructure by EBSD for Si-Interposer
Global Interposer Technology (GIT) 2011 Workshop, Atlanta, 14th - 15th Novmeber 2011
Sättler, P.; Meier, K.; Wolter, K.-J.
Considering Copper Anisotropy for advanced TSV-modeling
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May
Aryasomayajula, L.; Meier, K.; Saettler, P.; Panchenko, I.; Frömmig, M.; Graf, M.; Rieske, R.; Wolter, K.-J.
Integration Technologies for 3D Packaging
Workshop-GIT 2011, November 14-15, Atlanta Georgia, USA
Panchenko, I.; Wolter, K.-J.
Interconnect Technology for 3D Chip Integration (abstract, oral presentation)
XXXI International Scientific Conference “Electronics and Nanotechnology”, April 12th – 14th, 2011, Kyiv, Ukraine
Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Zerna, T.; Wolter, K.-J.; Meyendorf, N.
Development of radiation resistant, direct converting X-ray line detectors in terms of their assembly technology
Eurosensors XXV, September 4-7, 2011, Athens, Greece; Procedia Engeneering 25 (2011) 459-462, Elesevier Ltd.
Oppermann, M.; Albrecht, O.; Lohse, T.; Metasch, R.; Zerna, T.; Wolter, K.-J.
Packaging Development for GaAs X-Ray Line Detectors
Paper und Vortrag auf "13th Electronics Packaging Technology Conference", Singapur, 07.-09.12.2011
Oppermann, M.; Wolter, K.-J.
Zerstörungsfreie und zerstörende Prüfmethoden für Lötverbindungen
Jahrbuch Mikroverbindungstechnik 2011/2012, DVS Media GmbH, Düsseldorf, 2011 (Zweitveröffentlichung)
Bohm, J., Wolter, K.-J.
FE-Simulation of Inductively Excited Lock-in Thermography for Electronic Interconnections
Proceedings of 13th Electronics Packaging Technology Conference (EPTC), Singapore, 2011. pp. 439-444.
Ernst, D.; Zerna, T.; Wolter, K.-J.
Influences of Organic Materials on Packaging Technologies and their Consideration for Lifetime Evaluation
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May 2011
Meyer, S.; Metasch, R.; Schwerz, R.; Wohlrabe, H.; Wolter, K.-J.
Process and Material Effects on BGA Board Level Solder Joint Reliability
13th Electronics Packaging Technology Conference (EPTC 2011), Singapore
Mosch, S.; Paproth, A.; Partsch, U.; Wanke, A.; Wolter, K.-J.
Chipanschlußkontaktierung mittels aerosolgedruckter Strukturen
Tutorial "Maskenlose Strukturierungsverfahren für die Mikroelektronik" SMT Hybrid Nürnberg 2011
Wolter, K.-J.; Meier, K.; Sättler, P.; Panchenko, I.; Frömmig, M.; Graf, M.
Bonding Technologies for 3D-Packaging
35th International Conference of IMAPS-CPMT IEEE, September 21st – 24th, Gdansk-Sobieszewo
Wiese, S.; Müller, M.; Panchenko, I.; Metasch, R.; Röllig, M.; Wolter, K.-J.
The Creep Behaviour and microstructure of Ultra Small Solder Joints
EuroSime, April 18th-20th, Linz, Austria
Schwerz, R.; Meyer, S.; Roellig, M.; Meier, K.; Wolter, K.-J.
Finite Element Modeling on Thermal Fatigue of BGA Solder Joints with Multiple Voids
34th International Spring Seminar on Electronics Technology (IEEE); High tatras, Slovakia, 11 – 15 Mai
Frömmig, M.; Wolter, K.-J.
Compensation of Die Warpage by Capillary Action
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May
Lange, J.; Bergs, F.; Weigert, G.; Wolter, K.-J.
Simulation of Capacity and Cost for Planning of Future Process Chains
21th International Conference on Production Research, Stuttgart, Germany, July 31 - August 4, 2011
Panchenko, I.; Mueller, M.; Wiese. S.; Schindler, S.; Wolter, K.- J.
Solidification Processes in the Sn-rich Part of the SnCu System
61st Electronic Components and Technology Conference, Orlando, 31st of May - 4th of June
Oppermann, M.; Wolter, K.-J.
Zerstörungsfreie und zerstörende Prüfmethoden für Lötverbindungen
Paper und eingeladener Vortrag im Rahmen der 2. DVS-Tagung Weichlöten, 08.02.2011 in Hanau
Meier, K.; Roellig, M.; Schießl, A.; Wolter; K.-J.
Life Time Prediction for Lead-free Solder Joints under Vibration Loads
Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Linz, 2011
2010
Bramlage, S.; Walter, S.; Wolter, K.-J.
Influences of soldering processes on piezoelectric properties
3rd Electronic System-Integration Technology Conference (ESTC), 2010, IEEE, 2010, S. 1-3.
Sohr, S.; Rieske, R.;Nieweglowski, K.; Wolter, K.-J.
Characterisation of Laser Power Converters (LPC)
2010 International Students and Young Scientists Workshop Photonics and Microsystems
Bramlage, S., Walter, S., Wolter, K.-J.
Influences of soldering processes on piezoelectric properties
3rd Electronic System-Integration Technology Conference (ESTC), 2010
Graf, M.; Hähnel, V.; Schlörb, H.; Wolter, K.-J.
Development of a thin Nanowire Polymer Composite Film with Anisotropic Electrical Conductivity
IPS
Sättler, P.; Meier, K.; Wolter, K.-J.
Thermo-mechanical Behavior of Dies Containing Through-Silicon-Vias
Industriepartner Symposium (IPS) (Vortrag/Poster)
Albrecht, O.; Wolter, K.–J.; Oppermann, M.
Towards an Interactive Knowledge Transfer – The Non–Destructive Evaluation Knowledge–Based System
33rd International Spring Seminar on Electronics Technology, Warsaw, Poland, May 12th-16th 2010
Panchenko, I.; Neumann, V.; Grafe, J.; Wolter, K.-J.
“Interconnect Technology for Three-Dimensional Chip Integration using Solid-Liquid Interdiffusion Bonding” (poster)
Industriepartner Symposium, 30. September, 2010, Dresden
Panchenko, I.; Müller, M.; Wolter, K.-J.
Microstructure Characterization of Lead-Free Solders Depending on Alloy Composition (poster)
1st RTG Workshop 2010 - DFG Report and Defense Colloquium “Bio-Nano-Tech 2010”, Dresden
Nieweglowski, K.; Rieske, R; Wolter, K.-J.
Assembly Requirements for Multi-Channel Coupling Micro-Optics in Board-Level Optical Interconnects
IEEE CPMT Proceedings of the 3rd Electronics Systemintegration Technology Conference, Berlin, September 13-16, 2010
Wiese, S.; Mueller, M.; Panchenko, J.; Metasch, R.; Wolter, K.- J.; Roellig, M.
The Scaling Effect on Microstructure and Creep Properties of Sn-based Solders
Electronics System Integration Technology Conference, Berlin, 13th - 16th of May
Panchenko, I.; Mueller, M.; Wolter, K.- J.
Microstructure Characterisation of Lead-Free Solders Depending on Alloy Composition
AIP Proceedings of the 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau,12th-14th of April
Panchenko, I.; Mueller, M.; Wolter, K.- J.
Metallographic Preparation of the SnAgCu Solders for Optical Microscopy and EBSD Investigations
33rd International Spring Seminar on Electronics Technology, Warsaw, 12th-16th of May
Lohse,T.; Oppermann, M.; Metasch, R.; Zerna, T.; Seilmayer, M.; Wolter, K.-J.
Packaging for Radiation Resistant X–Ray Detectors
Paper und Vortrag auf der ISSE 2010, 12.-16.05.2010, Warschau
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Mechanical Behaviour of Typical Lead-Free Solders at High Strain Rate Conditions
Proceedings of the 12th Electronics Packaging Technology Conference (EPTC), Singapore, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Rate Dependent Mechanical Behaviour of SAC Solder in Fast Tensile Experiments
Proceedings of the 3rd Electronics Systemintegration Technology Conference, Berlin, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates
Proceedings of the 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Bordeaux, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Mechanical Solder Characterisation under High Strain Rate Conditions
11th International Workshop on Stress-Induced Phenomena in Metallization, ISSN 0094-243X, American Institute of Physics, Bad Schandau, 2010
Paproth, A.; Adolphi, B.; Wolter, K.-J.
Investigation of Adhesive Bonding on Non-noble Metal in Electronic Packaging
ESTC 2010, Berlin, 13-16 September; 2010
Oppermann, M.; Zerna, T.; Wolter, K.-J.
X-ray Computed Tomography for Nano Packaging - A Progressive NDE Method
12th Electronics Packaging Technology Conference, Singapur, 8.-10.12.2010
Tkachenko, A.; Müller, M.; Zerna, T.; Wolter, K.-J.
Influence of metallographic preparation on EBSD characterization of Cu wire bonds
3rd ESTC, Berlin
Tkachenko, A.; Müller, M.; Zerna, T.; Wolter, K.-J.
Influence of metallographic preparation on EBSD characterization of Cu wire bonds
33rd ISSE, Warsaw, Poland
Hildebrandt, S.; Böhme, B.; Wolter, K.-J.
Influence of Accelerated Aging on the Acoustic Properties of a Ceramic Microsystem for Structural Health Monitoring
ESTC 2010, Berlin, 13-16 September; 2010
Roellig, M.; Boehme, B.; Lautenschlaeger, G.; Koehler, B.; Schubert, F.; Heinrich, F. .; Bergander, A..; Schulz, J.; Wolter, K.-J., Hentschel, D.; Franke, R.
Integration of US-based SHM Sensor System in CFRP-Airplane Structures
4th Airportseminar; Dresden; 3-4. November; 2010
Heimann, M.; Böhme, B.; Scheffler, S.; Wirts-Ruetters, M.; Wolter, K.-J.
CNTs - a Comparable Study of CNT-filled Adhesives with Common Materials
Journal Micro and Nanosystems, Volume 2, Number 1, March, 2010
Boehme, B.; Roellig, M.; Wolter, K.-J.
Measurement of Viskoelastic Material Properties of Adhesives for SHM Sensors Under Harsh Environmental Conditions
11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Bordeaux, Fr, 26.-28. April, 2010
Boehme, B.; Roellig, M.; Wolter, K.-J.
Moisture Induced Change of the Viskoelastic Material Properties of Adhesives for SHM Sensor Applications
60th Electronic Component & Technology Conference (IEEE), Las Vegas, USA, 1.-4. Juni, 2010
Meyer, S.; Wohlrabe, H.; Wolter, K.-J.
Neural Network Modeling to Predict Quality and Reliability for BGA Solder Joints
Proceedings of 60th Electronic Components and Technology Conference (ECTC), pp 1596 - 1603, Las Vegas, Nevada, June 1-4, 2010
Oppermann, M.; Lohse, T.; Metasch, R.; Zerna, T.; Wolter, K.-J.
X-Ray Resistant Packaging for X-Ray Line Detectors
Paper und Präsentation auf der ESTC 2010 in Berlin, 13.-16.09.2010
Oppermann, M.; Zerna, T.; Wolter, K.-J.
X-ray Computed Tomography for Nano Packaging – A Current Challenge
"High Resolution X-ray CT Symposium 2010" der Fa. GE Sensing & Inspaction Technologies GmbH in Dresden, 31.08.-02.09.2010
Bohm, J.; Wolter, K.-J.
Inductive Excited Lock–In Thermography for Electronic Packages and Modules
33rd Int. Spring Seminar on Electronics Technology
Oppermann, M.; Zerna, T.; Wolter, K.-J.
Röntgen-Computertomografie an miniaturisierten Kontakstellen für die Nano-AVT
Paper und Vortrag auf der EBL 2010, 24.-25.02.2010, Fellbach
2009
Wolter, K.-J.; Zerna, T.
Forschung und Lehre für die Systemintegration
IPP der Fakultät EuI der TU Dresden
Zerna, T.; Wolter, K.-J.
System integration - Recent Developments in Electronic Packaging
Workshop, Wroclaw, Poland
Hildebrandt, S.; Böhme, B.; Wolter, K.-J.
Design for Reliability of Sensor Systems for Structural Health Monitoring
33rd International Microelectronics and Packaging IMAPS-CPMT Poland Conference, Gliwice - Pszczyna, 21-24 September, 2009
Hetschel, Th.; Wolter, K.-J.; Phillipp, F.:
Reflow Ageing and Influences and Wettability Effects of Immersion Tin Final Finishes with lead-free Solder
Circuit World, Volume 35, Number 2, 2009, pages 37-44
Streller, A.; Zimmermann, A.; Eisenberg, St.; Wolter, K.-J.; Lange, P.:
Reliability Testing and Damage Analysis of Lead-Free Solder Joints: New Assessment Criteria for Laboratory Methods,
SAE International Journal of Materials & Manufacturing, October 2009 - 2, pages 502-510
Wanke, A.; Paproth, A.; Uhlemann, J.; Wolter, K.J.
Influences of Sterilisation Procedures on Polymer Surfaces
Proceedings ISSE 2009, Brno/Czech Republic, Mai 2009
Bach, F.-W.; Möhwald, K.; Schaup, J.; Holländer, U. Wolter, K.J.; Herzog, T. Wohlrabe, H.;Wielage, B.; Lampke, T.; Weber-Nestler, D.; Bobzin, K.; Schlegel, A.
Detektion von Verunreinigungen beim bleifreien Wellen- und Selektivlöten und deren Auswirkungen auf die Lötstelle
Schweißen & Schneiden 07/09
Oppermann, M.; Wolter, K.-J.; Zerna, T.
X-ray Computed Tomography on Miniaturized Solder Joints for Nano Packaging
11th Electronics Packaging Technology Conference, Singapur, 9.-11.12.2009
Meyer, S.; Wohlrabe, H.; Wolter, K.-J.
Data Mining in Electronics Packaging
32th International Spring Seminar on Electronics Technology (IEEE); Brno; 13-17 Mai 2009
Autorenkollektiv
Fehlermechanismen und Prüfverfahren miniaturisierter Lötverbindungen. Ergebnisbericht des BMBF-Verbundprojektes nanoPAL
Buchreihe "System Integration in Electronics Packaging", Verlag Dr. Markus A. Detert, Templin, 2009.
Nieweglowski, K.; Rieske, R; Wolter, K.-J.
Demonstration of Board-Level Optical Link with Ceramic Optoelectronic Multi-Chip Module
IEEE CPMT Proceedings of the 59th Electronic Components and Technology Conference, San Diego, CA, May 26-29, 2009, pp. 1879 - 1886
Nieweglowski, K.; Rieske, R; Wolter, K.-J.
Board-level optical link for high-speed parallel interconnection
VII. ITG – Workshop “Photonische Aufbau- und Verbindungstechnik”, Wernigerode, 7 - 8 Mai 2009
Oppermann, M.; Wolter, K.-J.; Zerna, T.
Nano Packaging - A Challenge for Non-destructive Testing
Workshop "Nanoscaled Materials for Electronics Systemintegration" am 23.-24.11.09 in Kiew
Klemmt, A.; Horn, S.; Weigert, G.; Wolter, K.-J.
Simulation-based Optimization vs. Mathematical Programming: A Hybrid Approach for Optimizing Scheduling Problems
Journal of Robotics and Computer Integrated Manufacturing, Vol. 25, pp. 917-925
Böhme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.-J.
Thermo Mechanical Characterization of Packaging Polymers
EMPC 2009 European Microelectronics and Packaging Conference (IMAPS); Rimini; Italien; 15-18 Juni; 2009
Heimann, M.; Rieske, R.; Wirts-Ruetters, M.; Telychkina, O.; Böhme, B. ; Wolter, K.-J.
Application of Carbon Nanotubes as Conductive Filler of Epoxy Adhesives in Microsystems
1. GMM Workshopb Mikro-Nano-Integration; Seeheim; 12.-13. März; 2009
Heimann, M.; Böhme, B.; Scheffler, S.; Wirts-Ruetters, M.; Wolter, K.-J.
CNTs - a Comparable Study of CNT-filled Adhesives with Common Materials
59th Electronic Component & Technology Conference (IEEE); San Diego; Califonia; USA; 26. -29. Mai; 2009
Telychkina, O.; Böhme, B.; Heimann, M.; Morris, J. E.; Wolter, K.-J.
Study of Nanosilver Filled Conductive Adhesives and Pastes for Electronics Packaging
32th International Spring Seminar on Electronics Technology (IEEE); Brno; 13-17 Mai; 2009
Böhme, B.; Jansen, K.M.B.; Rzepka, S.; Wolter, K.-J.
Comprehensive Material Characterization of Organic Packaging Materials
10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE); Delft; pp. 289-296
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J.
Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Proceedings of the 59th Electronic Components and Technology Conference (ECTC); San Diego (California, USA); pp. 1781-1787
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Combining Experimental and Simulation Methods for the Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE); Delft; pp. 563 – 569
Heuer, H.; Hillmann, S.; Roellig, M.; Schulze, M.; Wolter, K.-J.
Thin Film Characterization using High Frequency Eddy Current Spectroscopy
Conference on Nanotechnology
Metasch, R.; Boareto, J.C.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Primary and Tertiary Creep Properties of Eutectic SnAg3.8Cu0.7 in Bulk Specimens
International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME
Metasch, R.; Roellig, M.; Wolter, K.-J.
A novel Thermo-Mechanical Test Method of Fatique Characterization of Real Solder Joints
European Microelectronics and Packaging Conference; EMPC; Rimini; 2009
Roellig, M.; Meyer, S.; Thiele, M.; Rzepka, S.; Wolter, K.-J.
Modeling, Simulation and Calibration of the Chip Encapsulation Molding Process
International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME; 2009,
Detert, M.; Zeise, M.; Wolter, K.-J.:
Replacement of Vias with Polymer Thick Film Pastes (PTF) for Use of Flexible Substrates
Circuit World, Journal Volume 35, Journal Issue 1 of 4, Journal Year 2009, DOI:10.1108/03056120910928707
2008
Walter, S.; Nieweglowski, K.; Rebenklau, L.; Wolter, K.-J.; Lamek, B.; Schubert, F.; Heuer, H.; Meyendorf, N.
Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers
31st International Spring Seminar on Electronics Technology (ISSE) 2008, IEEE, 2008, S. 255-260.
Walter, S.; Nieweglowski, K.; Rebenklau, L.; Wolter, K.-J.; Lamek, B.; Schubert, F.; Heuer, H.; Meyendorf, N.
Manufacturing and electrical interconnection of piezoelectric 1-3 composite materials for phased array ultrasonic transducers
Proc. 31st International Spring Seminar on Electronics Technology (ISSE)
Bramlage, S., Wolter, K.-J.
Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors
IEEE ISSE, Budapest, 2008.
Paproth, A.; Walter, S.; Wolter, K.-J.
Fracture Behavior of Adhesive Bonds by Different Shear Speed
Proceedings ECTC 2008, Orlando/Florida/USA, Mai/June 2008, p.1679-1683
Röllig, M.; Wiese, S.; Meier, K.; Wolter, K.-J.
Creep Measurements on SnAgCu Solder Joints in Different Compositions and after Mechanical and Thermal Treatment
Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME
Oppermann, M.; Heuer, H.; Meyendorf, N.; Wolter, K.-J.
Nano Evaluation in Electronics Packaging
2nd Electronics Systemintegration Technology Conference, London, 01.-04.09.2008
Wolter, K.-J.; Oppermann, M.; Zerna, T.
Nano Packaging – A Challenge for Non-destructive Testing
10th Electronics Packaging Technology Conference, Singapur, 9.-12.12.2008
Rieske, R.; Nieweglowski, K.; Wolter, K.-J.
Elektro-Optische Leiterplatte – Trends und aktuelle Forschung
Konferenzband zur 16. FED-Konferenz: "Elektronik-Design – Leiterplatten – Baugruppen 2008", Bamberg, 25 - 27 September 2008, pp. 259 – 265
Siesicki, M.; Nieweglowski, K.; Wolter, K.-J.; Patela, S.
Integrated optical waveguides for electrooptical PCB
IEEE Proceedings of the 2008 International Students and Young Scientists Workshop "Photonics and Microsystems", Wroclaw/Szklarska Poreba, June 20-23, 2008n
Siesicki, M.; Nieweglowski, K.; Wolter, K.-J.; Patela, S.
Development of Sol-Gel Integrated Optical Waveguides for Electro-Optical PCB
IEEE CPMT Proceedings of the 31th International Spring Seminar on Electronics Technology, Budapest, Hungary, May 7-17, 2008, pp. 224 – 229
Nieweglowski, K.; Wolter, K.-J.
Novel Optical Transmitter and Receiver for Parallel Optical Interconnects on PCB-Level
IEEE CPMT Proceedings of the 2nd Electronics Systemintegration Technology Conference, Vol 1, Greenwich, UK, September 5-7, 2008, pp. 607-611
Böhme, B.; Röllig, M.; Wolter, K.-J.
Material Characterization of Organic Packaging Materials to Increase the Accurancy of FEM Based Stress Analysis
2nd Electronics Systemintegration Technology Conference, London, Great Britain, September 1st - 4th, 2008
Böhme, B.; Wolter, K.-J.
Study of Temperature Dependent Properties of Organic Substrate Materials
Microelectronics Reliability, Volume 48, Issue 6, June 2008, Pages 876-880
Heimann M.; Meißner, F.; Schönecker, A.; Endler, I.; Wolter, K.-J.
Nanoskalige Funktionsschichten zum Strom- und Wärmetransport in der Aufbau- und Verbindungstechnik (AVT)
Fachvortrag, MICROCAR 2008, Microcar Conference, Leipzig, 27th February 2008
Wirts-Rütters, M.; Heimann, M.; Kolbe, J.; Wolter, K.-J.
Carbon Nanotube (CNT) Filled Adhesives for Microelectronic Packaging
2nd Electronics System-Integration Technology Conference (IEEE), Greenwich, London, UK, 1. - 4. September
Heimann M.; Meißner, F.; Schönecker, A.; Endler, I.; Wolter, K.-J.
Nano-Scaled Functional Layers for Current and Heat Transport in Electronics Packaging
2nd Electronics System-Integration Technology Conference (IEEE), Greenwich, London, UK, 1. - 4. September
Heimann, M.; Wirts-Ruetters, M.; Böhme, B.; Wolter, K.-J.
Investigations of Carbon Nanotubes Epoxy Composites for Electronics Packaging
58th Electronic Component & Technology Conference (IEEE), Orlando, Florida, USA, May 28 – May 30,
Beyreuther, C.; Wohlrabe, H.; Wolter, K.-J.; Köhler, A.
Multivariate Bohrbildkontrolle und –analyse
Zeitschrift für wirtschaftliche Fertigung 103(2008)7-8 S. 526-530
Wohlrabe, H.; Herzog, T.; Wolter, K.-J.
Optimization of SMT Solder Joint Quality by Variation of Material and Reflow Parameters
2nd Electronics Systemintegration Technology Conference, London, Great Britain, September 1st to 4th, 2008
Oppermann, M.; Striegler, A.; Wolter, K.-J.; Zerna, T.
New Methods of Non-destructive Evaluation for Advanced Packages
IMAPS Poland, Warsaw, September 2008
Detert, M.; Rebenklau, L.; Zerna, T.; Wolter, K.-J.
Thick film modules mounted on flexible printed circuits
IMAPS Nordic 2008, Helsingør, September 14th to 16th, 2008, Proceedings, TP-B1: APPLICATIONS & MANUFACTURING, pp. 203-206, ISBN 978-952-99751-3-6 (Paperback), ISBN 978-952-99751-4-3 (PDF)
Detert, M.; Rebenklau, L.; Schröder, St.; Wolter, K.-J.
Thick film modules assembled to flexible printed circuits
2nd Electronics Systemintegration Technology Conference, London, Great Britain, September 1st to 4th, 2008
Detert, M.; Zeise, M.; Wolter, K.-J.
Replace of vias with polymer thick film pastes (PTF) for the use on flexible substrates
2nd Electronics Systemintegration Technology Conference, London, Great Britain, September 1st to 4th, 2008
Zerna, T.; Wolter, K.-J.
System Integration - Recent Developments in Electronic Packaging
SCD 2008, April 2008, Dresden
2007
Meier, K.; Röllig, M.; Wiese, S.; Götte, C.; Deml, U.; Wolter, K.-J.
Elektromigration an Baugruppen der Leistungselektronik
Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag; ISSN 1436-7505
Böhme, B.; Wolter, K.-J.
Characterization of Organic Substrate Materials for High Temperature Automotive Applications
Fachvortrag, 1st MicroNanoReliability Conference, Berlin, Germany, September 2nd – 5th, 2007
Böhme, B.; Wolter, K.-J.
Study of Temperature Dependent Properties of Organic Substrate Materials
31st International IMAPS Poland Conference & Exhibition, Rzeszów-Krasiczyn, 23th - 26th September 2007
Böhme, B.; Decreßin, O.; Wolter, K.-J.
Qualification of Organic Substrate Materials for High Temperature Automotive Applications
30th International Spring Seminar on Electronics Technology (IEEE), Cluj Napoca, Rumänien, May 9th -13th, 2007
Heimann M.; Lemm, J.; Wolter, K.-J.
Characterization of Carbon Nanotubes / Epoxy Composites for Electronic Applications
30th International Spring Seminar on Electronics Technology (IEEE), Cluj Napoca, Rumänien, 9. -13. May
Detert, M.; Zerna, T.; Wolter, K.-J.
Integration von OLED-Technologie in Schaltungsträger
Die Leiterplatten- und Bestückungsindustrie in Europa, Festkolloquium 10 Jahre Fachabteilung Bestückung, Verleihung des E²MS-Award 2007, 25./26. Oktober 2007, Bad Homburg
Detert, M.; Zerna, T.; Wolter, K.-J.
Reliability Qualification of Flexible Printed Circuits
EMPC 2007 - 16th European Microelectronics and Packaging Conference Oulu, Finland, June 17-20, 2007
Detert, M.; Zerna, T.; Wolter, K.-J.; Bramlage, S.
Lead free solders in evaluation at thick film conductive pastes
IEEE CPMT SYMPOSIUM ON GREEN ELECTRONICS, Göteborg, Sweden, Chalmers University of Technology, 23.-24.05.2007
Detert, M.; Zerna, T.; Wolter, K.-J.
Erstuntersuchungen zur Entwicklung technologischer Voraussetzungen für die Integration organischer Leuchtdioden auf Schaltungsträgern
PLUS 2/2007
Rebenklau, L.; Bramlage, S.; Herzog, T., Wolter, K.-J.
Evaluation of thickfilm conductive pastes by using lead free solder alloys
CICMT-Conference, Denver, CO 04/2007
Heimann, M.; Lemm, J.; Wolter, K.-J.
Experimental investigations of Carbon Nanotubes /Epoxy composites for electronic applications
31st International IMAPS Poland Conference & Exhibition, Rzeszów-Krasiczyn, 23-26 September 2007
Müller, M.; Wiese, S.; Rollig, M.; Wolter, K.-J.
The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 446-455
Röllig, M.; Wiese, S.; Meier, K.; Wolter, K.-J.
Creep Measurements of 200µm - 400µm Solder Joints
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 255-264
Meier, K.; Röllig, M.; Wiese, S.; Goette, C.; Deml, U.; Wolter, K.-J.
Electromigration in Large Volume Solder Joints
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 464-470
Wiese, S.; Meier, K.; Scholz, D.; Müller, A.; Röllig, M.; Rzepka, S.; Wolter, K.-J.
Experimental Determination of Time Independent Elastic Plastic Behaviour of Solder Joints at High Strain Rates
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 422-426
Wiese, S.; Röllig, M.; Müller, M.; Wolter, K.-J.
The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties
EuroSimE 2007, 16.-18. April , London (GB), S: 699-706
Meier, K.; Röllig, M.; Wiese, S.; Goette, C.; Deml, U.; Wolter, K.-J.
Mechanical Degradation, Thermal- and Electromigration in Large Volume Solder Joints
57th ECTC 2007, 29.5 . 1.6.05 in Reno (USA), S. 1839 . 1845
Müller, M.; Wiese, S.; Röllig, M.; Wolter, K.-J.
Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints
57th ECTC 2007, 29.5 . 1.6.05 in Reno, (USA), S. 1579 . 1588
Wiese, S.; Röllig, M.; Müller, M.; Bennemann, S.; Petzold, M.; Wolter, K.-J.
The Size Effect on the Creep Properties of SnAgCu-Solder Alloys
57th ECTC 2007, 29.5 . 1.6.05 in Reno, (USA), S. 548 . 557
Röllig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Microelectronics Reliability. Bd. 47 (2007), S. 187-195
Wiese, S.; Wolter, K.-J.
Creep of thermally aged SnAgCu-solder joints
Microelectronics Reliability. Bd. 47 (2007), S. 223-232
Oppermann, M.; Wolter, K.-J.; Heuer, H.; Meyendorf, N.
Nano Evaluation of Electronics Packaging
PRODUCTRONICA-Forum, Productronica 2007, 15.11.2007
Oppermann, M.; Wolter, K.-J.; Heuer, H.; Köhler, B.; Krüger, P.; Meyendorf, N.
The Center for Non-Destructive Nano Evaluation of Electronic Packaging (nanoeva), a New Research Facility in Dresden
VDE Mikrosystemtechnik Kongress 2007, Dresden, 15.-17.10.07
Wolter, K.-J.; Oppermann, M.; Heuer, H.; Meyendorf, N.
The Center for Non-Destructive Nano Evaluation of Electronic Packaging (nano-Eva) - New Research Facility in Dresden
ISSE 2007, Cluj-Napoca (Rumänien), 09.-13.05.07.
Kirchner, R.; Uhlemann, J.; Wolter, K.-J.; Kolba, S., Beyer, A. Vollmer, G.
New Test Method for Cytotoxicity Assessment of Extracts of Electronic Packaging Materials
41. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik (DGBMT) im VDE, Aachen 26.-29.09.2007, Biomedizinische Technik Vol. 52, Ergänzungsband, ISSN 0939-4990
Beshchasna, N.; Uhlemann, J.; Wolter, K.-J.
Untersuchung elektronischer Werkstoffe im Kontakt mit simulierten Körperflüssigkeiten als Methode zur Biostabilitätsbestimmung
41. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik (DGBMT) im VDE, Aachen 26.-29.09.2007, Biomedizinische Technik Vol. 52, Ergänzungsband, ISSN 0939-4990
Uhlemann, J.; Beshchasna, N.; Kirchner, R.; Schindler, S.; Beyer, A.; Kolba, S., Vollmer, G.; Wolter, K.-J.
Aspects of Biocompatibility and Biostability of Electronics
1st International Conference of Biocompatible Electronics, 9th - 10th Mai 2007, Neu-Ulm, Germany
Detert, M.; Zerna, T.; Wolter, K.-J.
Erstuntersuchungen zur Entwicklung technologischer Voraussetzungen für die Integration organischer Leuchtdioden auf Schaltungsträgern
Zeitschrift PLUS, Heft 2/2007, S. 336-343, Eugen G. Leuze Verlag, Bad Saulgau
Oppermann, M.; Lenk, A.; Schönecker, A., Schuh, C.; Zerna, T.; Wolter, K.-J.
Electronics Packaging for High Reliable Piezoactuators
9th Electronics Packaging Technology Conference, Singapur, 10.-12.2007
Detert, M.; Rebenklau, L., Bramlage, S., Zerna, T.; Wolter, K.-J.
Lead Free Solders in Evaluation on Thick Film Conductive Pastes
IEEE CPMT Symposium on Green Electronics, Gothenburg, Sweden, May 24, 2007
Oppermann, M.; Sauer, W.; Wolter, K.-J., Zerna, T.
Cost Efficient Quality and Production Strategies for Electronics Production
EMPC 2007, Oulu, Finland, June 17-20, 2007
Wohlrabe, H.; Wolter, K-J.
Practical Usage of Design of Experiments in SMT-Production Processes
ISSE 2007 Cluj-Napoca, Rumänien 9.-13.5.2007
Beyreuther, C.; Münch, R.; Harms, K.; Wolter K.-J.; Wohlrabe, H.
Bessere Prozessregelung mit multivarianter Qualitätsregelkarte
Qualität und Zuverlässigkeit 52 (2007) 9 S. 27-30
2006
Paproth, A.; Wolter, K.-J.; Deltschew, R.
Adhesion of Metal/Polymer Bonds using PBT, PC, PS and Copper
Proceedings ECTC 2006, San Diego/CA/USA, Mai/June 2006, p.959-964
Böhme, B.; Röllig, M.; Wiese,S.; Wolter, K.-J.
Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints
29th International Spring Seminar on Electronics Technology, I St. Marienthal, Germany, May 10th to 14th, 2006
Rebenklau, L.; Schlottig, G.;Uhlemann, J.; Vollmer, G.; Wolter, K.-J.
LTCC Packaging for Bio-Application's Demands
2nd CICMT, April 2006, Denver, Colorado
Rebenklau, L.; Herzog,T.; Wolter; K.-J.
Evaluation of Lead Free Solder Joints on Thick Film Metallization
1st MacroNano-Colloquium on LTCC RF- and Microsystem Interconnect, Technische Universitat Ilmenau, November 29th to 30th 2006
Rebenklau, L.; Wolter, K.-J.; Hagen, G.
Realization of µ-Vias in LTCC Tape
29th International Spring Seminar on Electronics Technology, St. Marienthal, Germany, May 10th to 14th, 2006
Mis, E.; Borucki, M.; Dziedzic, A.; Kaminski, S.; Rebenklau, L.; Sonntag, F.; Wolter, K.-J.
Laser-Shaped Thick-Film and LTCC Microresistors
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006
Wolter, K.-J.; Zerna, T.
Trends in der Systemintegration
Sächsischer Arbeitskreis Elektronik-Technologie, Dresden, 8. November 2006
Zerna, T.; Wolter, K.-J.
X-ray and Ultrasonic Microscopy . Non-destructive Test Methods for Reliability Relevant Phenomenon in Electronics Packaging
IMAPS Poland, September 24th to 27th 2006, Krakow, Poland
Zerna, T.; Wolter, K.-J.
Zuverlassigkeitsanalysen an komplexen elektronischen Baugruppen mittels Rontgen- und Ultraschallmikroskopie
Kongress "Systemintegration in der Mikroelektronik" 31. Mai 2006, Nürnberg
Wohlrabe, H.; Wolter, K-J.
Practical Usage of Design of Experiments in the Production of SMT-Boards
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, pp 854-859
Herzog, T.; Wolter, K.-J.; Canchi Purushothama, K.; Manokaran, V.
Investigation and Optimization of Residue-free Plasma-assisted Reflow Soldering of SnAgCu by DoE
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006
Herzog, T.; Wolter, K.-J.; Prasad, K.; Manokaran, V.
Das rückstandsarme plasma gestützte Reflow-Löten von SnAgCu-Loten - Besonderheit, Ergebnisse und potentielle Einsatzgebiete
3. DVS/GMM-Tagung, Fellbach, 2006
Luniak, M.; Höltge, H.; Brodmann, R.; Wolter, K.-J.
Optical Characterization of Electronic Packages with Confocal Microscopy
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006
Detert, M.; Ernst, D.; Zerna, T.; Wolter; K.-J.
Flexible Verdrahtungsträger - Alterungsverfahren in der Diskussion
31. Micro Reliability Seminar, 16. November 2006, IZM Berlin
Detert, M.; Zerna, T.; Wolter; K.-J.
Herausforderungen an die Aufbau- und Verbindungstechnik bei OLED-gerechten Montageprozessen
IMAPS 2006, München, October 09th to 10th 2006
Detert, M.; Rebenklau, L.; Zerna, T.; Wolter, K.-J.
Polymer Thick Film Technology for Realization of Fine Line Structures on Different Substrates
29th International Spring Seminar on Electronics Technology, I St. Marienthal, Germany, May 10th to 14th, 2006
Detert, M.; Ernst, D.; Zerna, T.; Wohlrabe, H.; Wolter, K.-J.
Reliability Qualification of Flexible Printed Circuits with Common and New Methods
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006
Nieweglowski, K.; Wolter, K.-J.
Elektro-optisches Modul für optische Verbindungen auf LP-Ebene - Koppelkonzept und optische Charakterisierung
9. Workshop "Optik in Rechentechnik" - ORT 2006, Siegen, Germany, 27. Oktober, 2006
Nieweglowski, K.; Wolter, K.-J.
Optical Analysis of Short-Distance Optical Interconnect on the PCB-Level
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, pp. 392-397
Galardziak, P.; Nieweglowski, K.; Patela, S.; Wolter; K.-J.
Optical Multi-Chip Ceramic Transmitter Module
2006 International Students and Young Scientists Workshop "Photonics and Microsystems", June 30th - July 2d, 2006, Wroclaw/Szklarska Poreba, Poland
Nieweglowski, K.; Galardziak, P.; Wolter, K.-J.
Ceramic Interposer for Optoelectronic Array Devices
29th International Spring Seminar on Electronics Technology, IEEE Catalog Number: 06EX1493C, St. Marienthal, Germany, May 10th to 14th, 2006, pp. 68-73
Müller, M.; Wiese, S.; Wolter, K.-J.
Influence of Cooling Rate and Composition on the Solidification of SnAgCu Solders
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 1303 - 1311
Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.
Analytical and Mechanical Methods for Material Property Investigations of SnAgCu-Solder
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 376 - 382
Wiese, S.; Röllig, M., Müller, M.; Rzepka, S.; Nocke, K.; Luhmann, C.; Krämer, F.; Meier, K.; Wolter, K.-J.
The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 912 - 925
Röllig, M.; Wiese, S.; Wolter, K.-J.
Extraction of Material Parameters for Creep Experiments on Real Solder-Joints by FEAnalysis
EuroSimE 2006, April 24th to 26th in Como (I), S: 281-289
Wiese, S.; Krämer, F.; Krause, M.; Bennemann, S.; Müller, M.; Röllig, M.; Petzold, M.; Wolter, K.-J.
Compositional Effects on the Creep Properties of SnAgCu Solder
EuroSimE 2006, April 24th to 26th in Como (I), S: 684-653
Kaminski, S.; Rebenklau, L.; Uhlemann, J.; Wolter, K.-J.
Mixer with Microchannels in LTCC Technology
XXX International Conference of IMAPS Poland Chapter, Kraków, September 24th to 27th 2006, pp 331 - 337
Beshchasna, N.; Uhlemann, J.; Wolter, K.-J.
Researching of Biochemical Degradation of Electronic Materials in Fluid Electrolytic Mediums
29th International Spring Seminar on Electronic Technology, May 10th to 14th 2006, St. Marienthal, Germany, IEEE
Schlottig, G.; Rebenklau, L.; Uhlemann, J.; Nytsch-Geusen, C.; Wolter, K.-J.
Modeling LTCC-based Microchannels Using a Network Approach
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, pp 1374 - 1377
Beshchasna, N.; Uhlemann, J.; Wolter, K.-J.
Biostability of Electronic Packaging Material
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, pp 1047-1053
Uhlemann, J.; Rudolf, F.; Meusel, B.; Meusel, E.; Wolter, K.-J.
Influence of Medical Sterilization on Material Systems of Electronics
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, pp 1252 - 1254
Sauer, W.; Oppermann, M.; Weigert, G.; Werner, S.; Wohlrabe, H.; Wolter, K.-J.; Zerna, T.
Electronics Process Technology - Production, Modelling, Simulation and Optimisation
Springer-Verlag London, Limited, 2006
2005
Paproth, A.; Wolter, K.-J.; Deltschew, R.
Adhesion of Polymer/Metal Bonds for Molded Interconnect Devices
Proceedings ISSE 2005, Wien/Austria, Mai 2005, p.148
Paproth, A.; Wolter, K.-J., Friedrich, J.; Deltschew, R.
Metal-Polymer Composites for Molded Interconnect Devices (MID)
Proceedings ECTC 2005, Orlando/Florida/USA, Mai/June 2005, p.1891-1894
Heinze, R.; Speck, M.; Wolter, K.-J.
Analysis in Microelectronic Packaging by Acoustic Microscopy
Int'l Spring Seminar on Electronics Technology 28th (ISSE) 19-22 May 2005, Wiener Neustadt, Austria
Heinze, R.; Speck, M.; Wolter, K.-J.
Praktische Erfahrungen beim Einsatz der Ultraschallmikroskopie als zerstörungsfreies Prüfverfahren in der Aufbau- und Verbindungstechnik der Elektronik
Zeitschrift PLUS, 7. Jahrgang, Heft 7, S. 1258-1267, (G. Leuze Verlag), 2005
Bieberle, M., Wolter, K.-J.
Charakterisierung von elektronischen Baugruppen mit Hilfe der Röntgencomputertomographie
2. Fachkongress MicroCar - Mikrowerkstoffe, Nanowerkstoffe für den Automobilbau, Leipzig, 21.-22.06.2005.
Rebenklau, L.; Wolter, K.-J.; Hagen, G.
Erzeugung von Mikrodurchkontaktierungen in LTCC-Folienmaterial
Deutsche IMAPS Konferenz, München, Oktober 2005
Wolter, K.-J.; Hagen, G.; Rebenklau, L.
Via Formation in LTCC Tape: A Comparison of Technologies
1st CICMT Conference, Baltimore MD, April 2005
Nieweglowski, K.; Rieske, R.; Schulze, D.; Wolter, K.-J.
Technology downscale for optical waveguides in cost performance electrical-optical circuit boards
IEEE CPMT Proceedings of the 28th International Spring Seminar on Electronics Technology, Wiener Neustadt, Austria, May 19-20, 2005, pp. 202-206
Uhlemann, J.; Schlottig, G.; Schindler, S.; Starcke, S.; Vollmer, G.; Wolter, K.-J.
Evaluation of Cytotoxicity of Chip-on-Board-Materials
XXIX International Conference of IMAPS Poland Chapter, Koszalin-Darówko 19.-21.09.2005
Uhlemann, J.; Schlottig, G.; Schindler, S.; Starcke, S.; Vollmer, G.; Drechsler, M.; Wolter, K.-J.
Cytotoxicity of COB-Materials
55th Electronic Components and Technology Conference, Florida, May 31- June 3, 2005
Uhlemann, J.; Schlottig, G.; Schindler, S.; Starcke, S.; Vollmer, G.; Wolter, K.-J.
Spektroskopische Untersuchungen zur Zytotoxizität von Materialsystemen in der Aufbau- und Verbindungstechnik
Deutsche Gesellschaft für Materialkunde, Juniortag 2005, Hanau, 18.-20. Mai 2005
Uhlemann, J.; Schlottig, G.; Schindler, S.; Starcke, S.; Vollmer, G.; Wolter, K.-J.
Spectrometric analysis of cell viability on electronic packaging materials
39. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik im VDE, Nürnberg, 14.-17. September 2005
Uhlemann, J.; Schlottig, G.; Schindler, S.; Starcke, S.; Vollmer, G.; Wolter, K.-J.
Zytotoxizitätsprüfung von Chip-on-Board-Materialien für medizinische Mikrosysteme
5. Workshop "Funktionelle Oberflächen für die Medizintechnik", Erfurt 11.10.2005
Wiese, S.; Röllig, M.; Wolter, K.-J.
Creep of Eutectic SnAgCu in Thermally Treated Solder Joints
55th ECTC 2005, 31.05. - 03.06.2005 in Orlando (USA), S. 1272 - 1282
Wiese, S.; Röllig, M.; Wolter, K.-J.
Creep of Thermally Aged SnAgCu-Solder Joints
EuroSIME 2005, 18.-20.04.2005 in Berlin, Shaker Publishing, Maastricht, S.79 - 85
Detert, M.; Herzog, T.; Wolter, K.-J.; Zerna, T.
Electronics Technology: Meeting the Challenges of Electronics Technology Progress
28th International Spring Seminar on May 19-20, 2005
Wolter, K.-J.; Zerna, Th. (Hrsg.): Expertengruppe Nano-AVT
Produktionstechnik für eine Aufbau- und Verbindungstechnik für die Nanoelektronik, Abschlussbericht zur Ermittlung des Forschungs- und Handlungsbedarfs
herausgegeben beim ZVEI, August 2005
Wolter, K.-J.; Zerna, Th.
Aufgaben, Verfahren und Lösungsmöglichkeiten zur hochauflösenden geometrischen Charakterisierung elektronischer Bauelemente und Baugruppen
Institutskolloquium Aufbau- und Verbindungstechnik, Dresden, 07.12.2005
Wolter, K.-J.; Zerna, Th
:Produktionstechnik für eine Aufbau- und Verbindungstechnik für die Nanoelektronik
13. FED-Konferenz, Fulda, 23.09.2005
Wolter, K.-J.; Zerna, Th
:Developing a Course about Nano-Packaging
ECTC 2005, Orlando, Florida, 31.05.-03.06.2005
Wolter, K.-J.; Zerna, Th.
Produktionstechnik für eine Aufbau- und Verbindungstechnik für die Nanoelektronik - Ermittlung des Forschungs- und Handlungsbedarfes
Öffentlicher Diskurs, Nürnberg, 20.04.2005
2004
Ahrens, T.; Wulff, F.; Kaiser, C.; Wolter, K.-J.; Harms, L.
Diagnostics of Electronics Assemblies
in: Electronics Assembly Technology - 2nd Edition; by Scheel, W.; ISBN 0 901 150 41 X
Zerna, T.; Oppermann, M.; Sauer, W.; Wolter, K.-J.
Process Technology of Electronics - A Graduate Textbook
ECTC2004, 01.-04. Juni 2004 in Las Vegas (USA)
Herzog, T.; Wolter, K.-J.
Reliability of lead free solders joints and manufacturability during the SMT process
27th International Spring Seminar in Electronic Technology, Sofia May 12-16, 2004
Herzog, T.; Köhler, M.; Wolter, K.-J.
Improvement of the adhesion of new memory packages by surface engineering
54th ECTC, Las Vegas, NV, 2004
Herzog, T.; Wolter, K.-J.
Investigations of the Microstructure of Lead-Free Solder Joints and Reliability Behaviour by the Example of Chip Resistance Components
SMTA International; Chicago, IL; 2004
Malachowski, K.; Uhlemann, J.; Winter, M.; Bartha, J.-W.; Wolter, K.-J.
Modified Polyimide Substrate for Miniaturised Implants
XVIIth Aachen Colloquium on Biomaterials, Feb. 2004
Uhlemann, J.; Rebenklau, L.; Wolter, K.-J.
Determination of Biocompatibility of Commercially Low Temperature Cofiring Ceramics
In: "The World of Electronic Packaging and System Integration" pp. 270-277, Verlag ddp goldenbogen 2004, ISBN 3-933434-76-5
Uhlemann, J.; Meusel E.; Wolter, K.-J.
Biokompatible Aufbau- und Verbindungstechnik
38. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik im VDE, Ilmenau, September 2004
Uhlemann, J.; Gey, U.; Schlottig, G.; Starcke, S.; Vollmer G.; Wolter, K.-J.
Zytotoxizitätsuntersuchungen an Materialsystemen der elektrischen Aufbau- und Verbindungstechnik
38. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik im VDE, Ilmenau, September 2004
Rudolf, F.; Uhlemann, J.; Meusel, B.; Meusel, E.; Wolter, K.-J.
Degradation von Bondkontakten nach Belastung durch Dampfsterilisation
38. Jahrestagung der Deutschen Gesellschaft für Biomedizinische Technik im VDE, Ilmenau, September 2004
Uhlemann, J.; Rebenklau, L.; Thümmler, M.; Wolter, K.-J.
Biological Characterization of Commercially Low Temperature Cofiring Ceramics
7th World Biomaterials Congress, Sydney, Australia, May 17th - 21st, 2004, p. 1350, ISBN 1 877040 20 7
Uhlemann, J.; Malachowski, K.; Winter, M.; Wolter, K.-J.; Bartha, J.-W.
Determination of the surface energy of biomaterials
XVIIth Aachen Colloquium on Biomaterials, Feb. 2004
Detert, M.; Herzog, Th.; Wolter, K.-J.; Zerna, Th.
SMT GOES GREEN: Investigations and Optimization of Lead-free Solder Pastes with Use of Wetting Tests, Solder Balling Tests and Screen Printing under simulated Process Stops
CARTS Europe 2004, 18 -21 October 2004, Nice, France
Nieweglowski, K.; Wolter, K.-J.
Optical Interconnections on PCBs - recent developments
2004 International Students and Young Scientists Workshop "Photonics and Microsystems", Wroclaw/Szklarska Poreba, June 24-27, 2004, IEEE Conference Proceedings (ISBN 0-7803-8598-5), 2004.
Hormanski, P.; Nieweglowski, K.; Wolter, K.-J.; Patela, S.
Investigation on Butt-coupling of VCSEL into PCB integrated Waveguides
IEEE CPMT Proceedings of the 27th Int. Spring Seminar on Electronics Technology (Annual School Lectures, Vol 24, ISBN 0-7803-8422-9, IEEE Cat.No. 04EX830), Sofia, Bulgaria, May 14-16, 2004, pp. 167-170.
Duzynski, M.; Rieske, R.; Wolter, K.-J.; Patela, S.
PCB integrated waveguides - Launching light into highly multi mode structures
IEEE CPMT Proceedings of the 27th Int. Spring Seminar on Electronics Technology (Annual School Lectures, Vol 24, ISBN 0-7803-8422-9, IEEE Cat.No.04EX830), Sofia, Bulgaria, May 14-16, 2004, pp. 171-176
Speck, M.; Wolter, K.-J.; Daniel, D.; Danczak, M.
Application of computed tomography in microelectronic packaging
Zeitschrift PLUS, 6. Jahrgang, Heft 12, S. 2089-2096, (G. Leuze Verlag), 2004
Speck, M.; Wolter, K.-J.
Limited-Angle-Tomographie als Alternative zur CT bei der Untersuchung elektronischer Flachbaugruppen
4. Phoenix X-Ray Forum, TU Dresden, 16.09.2004
Speck, M.; Wolter, K.-J.; Daniel, D.; Danczak, M.
Anwendung der CT in der Aufbau- und Verbindungstechnik der Elektronik
Workshop zur industriellen Röntgentechnik, Fraunhofer Entwicklungszentrum Röntgentechnik, Dresden, 23.06.04
Speck, M.; Wolter, K.-J.; Danczak, M.; Daniel, D.
Application of Computer Tomography in Microelectronic Packaging
SPIE 9th International Symposium on NDE for Health Monitoring and Diagnostics - Testing, Reliability, and Application of Micro- and Nanomaterial Systems, San Diego, 15-17 March 2004
2003
Wiese, S.; Wolter, K.-J.
Microstructure and Creep Behaviour of eutectic SnAg and SnAgCu Solders
Eurosime Conference, Aix en Provence, France, April 6 - 9 2003
Wiese, S.; Wolter, K.-J.
Mechanical Properties of Packaging Materials - The Need and a Strategy for an Educational Module
Proceedings IEEE 53th Electronic Components and Technology Conference, New Orleans, 27-30 May 2003
Wiese, S.; Meusel, E.; Wolter, K.-J.
Microstructural Dependence of Constitutive Properties of eutectic SnAg and SnAgCu Solders
IEEE 53th Electronic Components and Technology Conference, New Orleans, 27-30 May 2003
Uhlemann, J.; Thümmler, M.; Rebenklau, L.; Wolter, K.-J.
Biokompatibilitätsprüfung von technischen LTCC-Glaskeramiken für Biomedizinische Mikrosysteme
Gemeinsame Jahrestagung der Österreichischen, Deutschen und Schweizerischen Gesellschaft für Biomedizinische Technik, Salzburg, Österreich, 24.-27. September 2003
Rebenklau, L.; Uhlemann, J.; Thümmler, M.; Wolter, K.-J.
Biological Characteristics of Commercially Low Temperatur Cofiring Ceramics
14th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, 23rd-25th June 2003
Patela, S.; Rieske, R.; Schmieder, K.; Stanowski, R.; Szecowka, P.; Wabynski, P.; Wolter, K.-J.
Reliability of photonic systems - an introduction
ISSE 2003, Stara Lesna, Slovakia
Danzak, M.; Wolter, K.-J.; Rieske, R.; Roth, H.
Application of Computer Tomography in Electronic Technology
ISSE 2003, Stara Lesna, Slovakia
Stanowski, R.; Rieske, R.; Patela, S.; Wolter, K.-J.
Thermal Analysis of Integrated Polymer Waveguides
ISSE 2003, Stara Lesna, Slovakia
Rieske, R.; Nieweglowski, K.; Wolter, K.-J.
Cost Effective Method for Spatially Resolved Characterisation of Board Level Optical Waveguides
ISSE 2003, Stara Lesna, Slovakia
Rieske, R.; Schmieder, K.; Wolter, K.-J.
Herstellung elektro-optischer Verdrahtungsträger mittels konventioneller Leiterplattentechnologien
e&i elektrotechnik und informationstechnik, Heft 6, Juni 2003, S. 192-194, Springer-Verlag/ Wien
Wolter, K.-J.; Detert, M.
Neue Technologien für Verdrahtungsträger von Morgen
11. FED-Konferenz, 18.-20.09.2003, Ludwigsburg
Paproth, A.; Wolter, K.-J.; Deltschew, R.
Surface Treatment of PA6 and ABS with Oxygen Plasma for Molded Interconnect Devices
ISSE 2003, Stara Lesna, Slovakia
Röllig, M.; Luniak, M.; Wolter, K.-J.
Optimization of plane antennae properties for Smart Label
SIITME 2003, Timisoara
Zerna, T.; Oppermann, M.; Wolter, K.-J.; Sauer, W.
Innovative Self-study Tools in Microsystems Packaging Education at Dresden University of Technology
IEEE 53th Electronic Components and Technology Conference, New Orleans, 27-30 May 2003
Wolter, K.-J.; Kürbis, G.; Heinze, R.
Technique and Equipment for Rework of Flip Chips with No Flow Underfiller
IEEE 53th Electronic Components and Technology Conference, New Orleans, 27-30 May 2003
Wolter, K.-J.; Daniel, D.
Anwendung der Computertomografie in der Aufbau- und Verbindungstechnik der Elektronik
3. Phoenix X-Ray Forum, TU Dresden, 18.09.2003
Wolter, K.-J.; Daniel, D.
3D-Röntgendiagnostik in der Aufbau- und Verbindungstechnik der Elektronik
Technologieforum, BuS Elektronik GmbH & Co. KG, 24.06.2003
Wolter, K.-J.; Wiese, S. (Herausgeber)
Interdisziplinäre Methoden in der Aufbau- und Verbindungstechnik, Festschrift für Ekkehard Meusel,
1. Auflage - München, Dresden, ddp goldenbogen, 2003
Sauer, W. (Herausgeber); Oppermann, M.; Weigert, G.; Werner, S.; Wohlrabe, H.; Wolter, K.-J.; Zerna, T.
Prozesstechnologie der Elektronik - Modellierung, Simulation und Optimierung der Fertigung
1. Auflage - München: Fachbuchverlag Leipzig im Carl Hanser Verlag, 2003
2002
Rieske, R.; Hart, G.; Wolter, K.-J.
Characterization of Polymer Waveguides for Electrical-Optical Circuit Boards
SIITME 2002, Cluj-Napoca, Rumänien, 19.-22.09.2002, ISBN 973-9357-13-X
Paproth, A.; Wolter, K.-J.
Influence of Surface Roughness on the Wettability by Packing Materials
ISSE 2002 in Prag, CSR, Mai 2002
Herzog, T., Wolter, K.-J., Rudolph, S.
Process Capability, Wetting Behavior and temperature dependent Shear Strength of alternative Lead free Solder Joints
SMTA International, Chicago, IL, Sept. 2002
Hagen, G.; Wolter, K.-J.; Wagner, A.
Vacuum Soldering in Electronics Packaging
SMTA International Conference, 22.-26.09.2002, Chicago, Illinois (USA)
Hagen, G.; Wolter, K.-J.; Wagner, A.
Vacuum Soldering in Electronics: Theory and Applications
25th International Spring Seminar on Electronics Technology (ISSE), 11.-14.05.2002, Prag (Tschechische Republik)
Dziedzic, A.; Rebenklau, L.; Golonka, L.; Wolter, K.-J.
Fodel Microresistors - Processing and Basic Electrical Properties
IMAPS - Europe CRACOW, 2002
Biedorf, R.; Heinze, R.; Wollanke, A.; Wolter, K.; Zerna, T.; Plötzke, A.
Alternative Bumping Processes for DRAM-CSP
52nd Electronic Components and Technology Conference, San Diego, USA, 28.-31.05.2002
Albrecht, H.-J.; Wolter, K.-J., Zerna, T.
Co-operation between University and Industry in Research and Education
5th International Academic Conference on Electronic Packaging Education and Training, Dresden, 20./21.03.2002, Templin, Verlag Dr. Markus A. Detert 2002
2001
Wolter, K.-J.
HDI-Leiterplatten von morgen
Jahrestagung des Fachverbandes Produktronik des VDMA 18.10.2001 - IZM, Berlin
Wolter, K.-J.
The Future of Interconnection Technology of Electronic Packaging
x-Ray Forum bei Phönix x-Ray Wunstorf am 04.09.2001
Wolter, K.-J.
High-Density-Interconnect-Baugruppen - Anforderungen und Herausforderungen
Elektroniktechnologie-Kolloquium am Institut für Industrielle Elektronik und Materialwissenschaften der Technischen Univerität Wien 29.06.2001
Wolter, K.-J.; Deltschew, R; Neumann, H; Herzog, T.; Zerna, T.
Plasma Treatment Process for Fluxless Reflow Soldering; Dresden
ECTC 2001; 29.05.-1.06.2001; Orlando, Florida, USA
Schmieder, K.; Wolter, K.-J.
Optical Interconnections for Board-Level Applications
Seminar: Electro/Optical Interconnections - Photonic Systems and Technology, Helsinki University of Technology, Laboratory of Electronics Production Technology, Espoo, Finland, September 2001
Schmieder, K.; Wolter, K.-J.
Suitable Technologies towards the Elerctro-Optical Printed Circuit Board
IMAPS Taiwan 2001, ITRI - ERSO, Hsinchu, Taiwan, April 2001
Paproth, A.; Wolter, K.-J.; Herzog, T.; Zerna, T.
Influence of Plasma Treatment on the Improvement of Surface Energy
ISSE 2001 in Rumänien, Mai 2001
Herzog, T.; Wolter, K.-J.; Zerna, T.
Reliability of Lead Free Solder Joints on Manufacturing Conditions
SMTA International, 30.09.-4.10.2001, Chicago, Illinois, USA
Hanreich, G.; Wolter, K.-J.; Nicolocs, J.
Rework of Flip-Chip Populated PCBs by Laser Desoldering
ISSE, 05. – 09.05.2001 in Calimanesti-Caciulata (Rumänien)
Golonka, L. J.; Wolter, K.-J.; Dziedzic, A.; Kita, J; Rebenklau, L.
Embedded passive components for MCM
Konferenz ISSE, 05.-09.05.2001 in Calimanesti-Caciulata (Rumänien)
Bauer, R.; Strickert, V.; Wolter, K.-J.; Sauer, W.; Leonescu, D.; Svasta, P.
Investigation on an Integrated Liquid Cooling System om LTCC-Multilayer
Konferenz ISSE, 05.-09.05.2001 in Calimanesti-Caciulata (Rumänien)
2000
Wolter, K.-J.; Rebenklau, L.
Realization of Microfluidic Devices using LTCC
3rd International Conference on Next Generation of Microelectronic Systems Packaging Education and Research, Atlanta, Georgia, March 8-10, 2000
Schmieder, K.; Wolter, K.-J.; Krabe, D.; Scheel, W.; Patela, S.
Low-Cost-Technologies for Board-Level Optical Interconnections
2. Szkoly Fotoniki i Mikrosystemow, Szklarska Poreba, Polen, Oktober 2000
Schmieder, K.; Wolter, K.-J.; Krabe, D.; Scheel, W.; Patela, S.
Effiziente Herstellungstechnologien für optische Wellenleiter auf Leiterplatten
9. Treffen der ITG-FG 5.4.1 - Optische Polymerfasern, Potsdam, Oktober 2000
Schmieder, K.; Wolter, K.-J.; Krabe, D.; Scheel, W.; Patela, S.
Efficient technologies for board-level optical interconnections
International Conference on Plastic Optical Fibers (POF'2000). Cambridge, M.A. (USA), September 2000
Schmieder, K.; Wolter, K.-J; Jahn, A.
Generation of optical waveguides on PCBs using printed wiring board Technologies
Optoelectronics Workshop. Dresden, July 2000.
Schmieder, K., Wolter, K.-J.
Electro-optical printed circuit board (EOPCB)
50th Electronic Components and Technology Conf., Las Vegas, N.V. (USA), May 2000, CD-ROM; ISBN 0569-5503.
Schmieder, K.; Wolter, K.-J.
Passive optische Komponenten für die Datenübertragung in der Sensorik
In G. Gerlach (Hrsg): Forschungsergebnisse des Graduiertenkollegs, w.e.b., 2000, S. 185-199.
Sauer, W.; Wolter, K.-J.; Bauer, R.
Project Electronics Technology - A New Lecture for All Students of Electrical Engeneering at Dresden University of Technology
23. ISSE, Mai 2000, Ungarn
Rebenklau, L.; Wolter, K.-J.; Howitz, S.
Realization of microfluidic modules using LTCC
XXIV INTERNATIONAL CONFERENCE IMAPS - POLAND 2000, Rytro, 25 - 29 September 2000
Rebenklau, L.; Wolter, K.-J.; Howitz, S.
Realization of Hybrid Microfluidic Systems Using Standard LTCC Process
50. Electronic Components and Technology Conference, 21.-24. Mai 2000 Las Vegas
Rebenklau, L.; Wolter, K.-J.; Bauer, R.
Technologische und werkstofftechnische Aspekte bei der Herstellung von mikrotechnischen Baugruppen mit der LTCC - Multilayer - Technologie
Symposium LTCC-Module: Eine neue Integrationsstufe in der Elektronik und Sensorik, 24./25. Januar 2000 in Dresden am Fraunhofer IKTS
Paproth, A.; Wolter, K.-J.
Model of Process Capability of Solder Paste Printing
ISSE 2000 in Balatonfured/Ungarn im Mai 2000
Herzog, Th.; Wolter, K.-J.; Zerna, Th.
Reliability of lead free solder joints on manufacturing conditions
SMTA International in Chicago 24.-28. September
Herenz, A. ; Daniel, D.; Wolter, K.-J.
Röntgen- und Ultraschallmikroskopie zur Qualitätsbewertung in der Baugruppentechnologie
SMT&Hybrid Nürnberg
Detert, M.; Herzog, T.; Wolter, K.-J; Zerna, T.
Joining Technologies with Lead-free Connecting Materials
SMT 2000 in Nürnberg, 27.-29. Juni,
Detert, M.; Herzog, Th.; Wolter, K.-J.; Zerna, Th.
Screen Printing, Placement And Joining Technologies with Lead-free Joining Materials
ECTC 2000 in Las Vegas 21.-24. Mai
1999
Wolter, K.-J.; Haba, B.
Application of Plasma Treatment for Surface Engineering in Advanced Packaging Technologies
22nd International Spring Seminar on Electronic Technology, Freital 1999.
Paproth, A.; Wolter, K.-J.
Models of Process Capability of Solder Paste Printing
SMTA International Conference 12. - 16. 09. 1999
König, A.; Herenz, A.; Wolter, K.-J.
Application of Neural Networks for Automated X-Ray Image Inspection in Electronics Manufacturing
5th International Work-Conference on Artificial and Natural Neural Networks (IWANN´99), Alicante, Spain, June 2 - 4, 1999, Springer LNCS, S. 588-595
Herenz, A.; Wolter, K.-J.; Meusel, E.; Hirschfeld, B.; Krautz, H.; Ronniger, R.
C-SAM Evaluation of Large Bonded Areas in the Field of Micromechanics and Microelectronics
International Acoustic Micro Imaging Symposium (IAMIS'99), Newport, Rhode Island, September 23-24,1999, Proceedings, S. 77-81
Herenz, A.; Daniel, D.; Wolter, K.J.; Krautz, H.; Elström, P.; Keller, J.
Die Ultraschallmikroskopie in der Baugruppeninspektion
SMT/ES&S/Hybrid´99, Messezentrum Nürnberg, Tutorial 8 am 04.05.1999, Band: Qualitätssicherung, Produktprüfung
Henke, M.; Bauer, R.; Golonka, J.; Rebenklau, L.; Dziedzic, A.; Wolter, K.-J.
Investigations on LTCC - Multilayer with High Density Pattern and Cofired Resistors
22nd ISSE, May 18th - 20th 1999 at Freital - Dresden
Dziedzic, A.; Golonka, L.J.; Henke, M.; Kita, J.; Thust, H.; Drue, K.-H.; Bauer, R.; Rebenklau, L.; Wolter, K.-J.
Electrical and Structural Characterization of Thick Film Resistorsat Various LTCC Systems
32nd International Symposium on Microelectronics IMAPS ´99, October 26-28, 1999, Chicago
Bauer, R.; Rebenklau, L.; Wolter, K.-J.; Sauer, W.
Aspects of LTCC Utilization for Microtechnical Application
3rd IEMT/IMC Symposium April 21-23, 1999, Omiya - Tokyo, Japan
1998
Wolter, K.-J., Biedorf, R.
Generating of solid solder bumps on printed circuit boards
Vortrag zur wissenschaftlichen Konferenz anläßlich der SMI-Messe San Jose, CA/USA, 25-27. 8.98 (Proceedings)
Wolter, K.-J., Biedorf, R.,
Generating of solid solder Bumps on printed circuit boards for direct Chip attachment (DCA)
Vortrag zur ISSE 98, 21st International Spring Seminar on Electronics Technology 4.-7. Mai 1998, Neusiedl/Austria
Wolter, K.-J., Detert, M., Herzog, Th.
Investigations of plasma compatibility of SMT assembly adhesives
3rd International Conference on Adhesive Joining and coating Technology in Electronics Manufacture 1998, Binghamton, New York, USA, September 28 - 30, 1998, pp. 152 - 155
Wolter, K.-J.; Zerna, Th.
Advanced Packaging Investigation Methods
Vortrag CSI´98 Germany, Weinheim 8.-9. September 1998
Schmieder, K.; Gotszalk, T.; Bauer, R.; Wolter, K.-J.; Golonka, L. J.; Licznerski, B. W.
Practical Training from a Students Group of Wroclaw Technical University at the Electronics Technology Laboratory of Dresden Technical University
ISSE ´98, 21st International Spring Seminar on Electronics Technology, 4.-7.5.1998, Neusiedl am See, Österreich
Rebenklau, L.; Bauer, R.; Wolter, K.-J.
Ceramic Multichip Modules for High Power Applications
21st. International Spring Seminar on Electronics Technology, Posterbeitrag, 4st. to 7st. May 1998, Neusiedl am See, Austria
Herenz, A., Daniel, D., Wolter. K.-J.
Applikation of Ultrasonic Microscopy in Electronics on Selected Examples
21st International Spring Seminar on Electronics Technology, May 4 to 7, 1998, Neusiedl am See, Austria, Conference Proceedings, S. 250
Bauer, R.; Rebenklau, L.; Luniak, M.; Wolter, K.-J.
Mikrotechnische Applikationen mit der Dickfilmtechnik
Deutschen ISHM Konferenz 1998, 12./13. Oktober 1998 in München
Bauer, R.; Wolter; K.-J.; Golonka, L. J.; Licznerski, B. W.; Nitsch, K.; Teterycz, H.
Examples of Gas Sensors by Application of Thick Film Technology
43rd International Scientific Colloquium;Technical University of Ilmenau; 21.-24.9.1998
Bauer, R.; Golonka, L. J.; Nitsch, K.; Patela, S.; Sauer, W.; Teterycz, H.; Wolter, K.-J.
Results of Students and Research Worker Exchange Between Dresden and Wroclaw Universities of Technology
ISSE ´98, 21st International Spring Seminar on Electronics Technology, 4.-7.5.1998, Neusiedl am See, Österreich
1997
Wolter, K.-J.; Kaiser, C.
Subpixelgenaue Lageerkennung für die Qualitätssicherung in der Elektronikfertigung.
In: SMT-ES&S-Hybrid, April 1997 in Nürnberg, Tutorial.
Wolter, K.-J.; Detert, M.
Einsatzerfahrungen zum Leitkleben in der Oberflächenmontage der Elektronik.
In: FED-Konferenz, Celle, Germany, September 1997.
Wolter, K.-J.
Statistische Merkmale bei der automatischen Röntgeninspektion von Lötstellen.
In: Oberseminar an BTU Cottbus, November 1997.
Wolter, K.-J.
Aufgaben der zerstörungsfreien Prüfung in der Fertigung elektronischer Baugruppen.
In: Symposium Elektronik-Technologie, TU Dresden im Mai 1997.
Sauer, W.; Wolter, K.-J.; Zerna, T.
Zentrum für mikrotechnische Produktion.
In: Wissenschaftliche Zeitschrift der TU Dresden, 46 (1997), Heft 2, S. 86-88.
Luniak, M.; Bauer, R.; Wolter, K.-J.
3D-Dickschicht-Hybridtechnik für die Sensorik und Mikrosystemtechnik.
In: VDE/VDI Sächsischer Arbeitskreis Elektronik-Technologie, Arbeitstreffen September 1997 in Chemnitz.
Kita, J.; Wolter, K.-J.; Bauer, R.; Luniak, M.; Teterycz, H.; Golonka, L. J.; Nitsch, K.
Investigations on a gas sensor in low temperature cofiring ceramics technology.
In: ISSE´97, June 1997 in Sklarska Poreba, Poland, Proceedings S. 39-44.
Jerke, G.; Herenz, A.; Wolter, K.-J.
Assessing Epithetic (Maxillofacial Prosthetic) Materials for Medical Applications.
In: European User´s SONOSCAN Workshop. Dresden, Germany, May 1997.
Herenz, A.; Bauer, R.; Wolter, K.-J.
Characterization of Ceramic Devicec by Ultrasonic Microscopy.
In: 2th International Acoustic Micro Imaging Symposium. Anaheim, California, February 1997, Proceedings.
Detert, M.; Wolter, K.-J.
Einsatzerfahrungen zum Leitkleben in der Oberflächenmontage der Elektronik.
In: Symposium des Fachverbandes Elektronik-Design, September 1997 in Celle.
Bauer, R.; Luniak, M.; Rebenklau, L.; Wolter, K.-J.; Sauer, W.
Realization of LTCC-Multilayer with Special Cavity Applications.
In: 30th International Symposium on Microelectronics. ISHM´97, Philadelphia, Oktober 1997, Proceedings S. 659-665.
Bauer, R.; Rebenklau, L.; Wolter, K.-J.
New Applications for Low Temperature Cofiring Ceramic Multilayers in 3D-Shaped Devices.
In: International Conference and Exhibition Micro Materials Micro Mat´97. Berlin, April 1997, Proceedings S. 331-334.
Wolter, K.-J.
Vorlesungsskript zur Lehrveranstaltung Elektroniktechnologie.
Institut für Elektronik-Technologie, 1997.
Kaiser, Ch.; Wolter, K.-J.
Zerstörungsfreie Prüfverfahren.
In: W. Scheel, Baugruppentechnologie der Elektronik - Montage, 1. Auflage, Berlin: Verlag Technik; Saulgau: Leuze Verlag, 1997, Teil 5.2, S. 552-610, ISBN 3-341-01100-5 (Verlag Technik), ISBN 3-87480-134-9 (Leuze Verlag).
1996
Wolter, K.-J.
Methoden der zerstörungsfreien Produktprüfung in der Baugruppenfertigung
SMT-ES&S-Hybrid'96, Nürnberg
Sauer, W.; Wolter, K.-J.; Zerna, T.
Das Zentrum für mikrotechnische Produktion, Wissenstransfer in die Industrie
Innovationsforum Dresden '96
Wolter, K.-J.; Michel, B.; Auersperg, J.; Detert, M.
Einflüsse von Fertigungstoleranzen auf die Zuverlässigkeit von Weichlötverbindungen
7. Hochschulkolloquium "Weichlöten in Forschung und Praxis", In: DVS-Berichte 182, DVS Verlag, Düsseldorf, S. 210 - 222
Wolter, K.-J.; Keil, M.
Optimization of Solder Volume for Area Packaging Applications
Surface Mount International, San Jose, CA, USA, 1996, Tagungsband, S. 750-761
Wolter, K.-J.; Kaiser, C.
Statistische Methoden der automatischen Röntgenbildauswertung
Workshop "Zerstörungsfreie Analysemethoden für die Qualitätssicherung und Zuverlässigkeitsanalyse" in der Themenreihe Packaging am FhG IZM Berlin am 04.-06.09.1996, Tagungsband
Sauer, W.; Wolter, K.-J.; Wohlrabe, H.; Kaiser, C.; Klatt, H.
Estimation of Machine Capabilities of Placing Machines
Nepcon West'96, Anaheim, CA, USA, Tagungsband, S. 152 - 166
Sauer, W.; Wolter, K.-J.; Wohlrabe, H.; Kaiser, C.; Keil, M.
Qualitätssicherung in der SMT-Bestückung - Bestimmung von Maschinen- und Prozeßfähigkeitskoeffizienten.
Symposium Elektronik-Technologie '96, TU Dresden, Mai 1996, Tagungsband, S. 75 - 88
Herenz, A; Wolter, K.-J.
Zerstörungsfreie Prüfung mittels Ultraschallmikroskopie in der Halbleitertechnologie
Tagesseminar am 22.0ktober 1996 in Itzehoe, CEM GmbH, Tagungsband
1995
Wolter, K.-J.; Strogies, J.
Untersuchungen zu Auswirkungen von Voids auf das mechanische Verhalten von BGA-Lötstellen
SMT ES&S Hybrid, Nürnberg, 03.-05.05.1995, Tagungsband, S. 803
Wolter, K.-J.; Streubei, P.; Keil, M.; Herzog, Th.
Test BGA for Examination of Mechanical Behavoir and Reliability of Solder Joint Interconnections under Real Thermal Conditions
18. ISSE 1995, Temesvar (Tschechien), 26.-30.06.95, S. 259-266
Wolter, K-J.; Streubel, P.; Keil, M.; Herzog, Th.
Test BGA for Examination of Mechanical Behavoir and Reliability of Solder Joint Interconnections under Real Thermal Conditions
ITAP San Jose, California
Wolter, K.-J.; Seidowski, Th.; Kriebel, F.
Leitkleben für die Realisierung von Low-Cost-Elektronikbaugruppen
Symposium Elektronik-Technologie, Dresden, 08.06.1995, Tagungsband, S. 139-144
Wolter, K.-J.; Kaiser, Chr.; Sturm, J.
Automated X-Ray Inspection of Ball Grid Arrays
18. ISSE 1995, Temesvar (Tschechien), 26.-30.06.95, S. 272-278
Wolter, K-J.; Kaiser, Chr.; Essa, S.K.
Statistische Merkmale bei der automatischen Röntgeninspektion von Lötstellen
Vortrag, Productronica 1995, München
Wolter, K-J.; Kaiser, Chr.; Sturm, J.
Automatische Röntgeninspektion von BGA
SMT ES&S Hybrid '95, Nürnberg, 03.-05.05.95, Tagungsband, S. 143-152
Wolter, K-J.; Detert, M.
Einfluß der Vorbelotung auf die Zuverlässigkeit von Lötstellen
Tutorial: Mechanisch-Thermische Zuverlässigkeit von Komponenten der Mikroelektronik, SMT ES&S, Hybrid '95, Nümberg
Wolter, K-J.; Bauer, R.; Ensminger, D.; Sauer, W.
Nutzung von LTCC-ML-Materialien für die Realisierung räumlich gestalteter Dickschicht-Verdrahtungsträger
SMT ES&S Hybrid '95, Nümberg, 03.-05.05.1995, Tagungsband, S. 321-333
Sauer, W.; Schiller, W.; Bauer, R; Ensminger, D.; Schulz, B.; Wolter, K.-J.
Werkstoff- und Verarbeitungsaspekte zu Low Temperature Cofiring Ceramic-Materialien für die Mikroelektronik
Vortrag, Micro Mat '95, Berlin, 28.-29.11.1995
Sauer, W.; Bauer, R; Wolter, K.-J.; Luniak, M.
Wechselbeziehung konstruktiver und technologischer Aspekte bei der Verarbeitung von LTCC
Internationales Wissenschaftliches Kolloquium, IImenau, 18.-21.09.1995, Tagungsband, S. 589-595
Sauer, W.; Bauer, R; Wolter. K.-J.
Three-Dimensionally Formed Thick Film Devices with Low Temperature Cofiring Ceramic Multilayer Technology
International Symposium on Microelectronics ISHM '95, Los Angeles, 24.-26.10.1995, Proceedings, S.481-487
Kaiser, Chr.; Wolter, K.-J.
Fehlstellenerkennung in Kontaktsystemen der Elektronik mittels Röntgendurchstrahlung
Internationales Wissenschaftliches Kolloquium, IImenau, 18.-21.09.95, Tagungsband
1994
Wolter, K.-J.; Skuras, I.
Statistische Merkmale für die automatische Inspektion von Lötstellen im Röntgenbild
Vortrag, 17. ISSE, Weißig b. Dresden
Wolter, K.-J.; Skuras, I.
Statistische Merkmale für die automatische Inspektion von Lötstellen im Röntgenbild
Vortrag SMT' 94, Nürnberg
Wolter, K.-J.; Kaiser, C.; Wirsing, F.
Meßgenauigkeit von Leiterplatten-Lageerkennungsverfahren
Vortrag, 17. ISSE, Weißig b. Dresden
Wolter, K.-J.; Essa, S.K.
Experimental Study of Shading Effect in X-Ray System
Vortrag, 17. ISSE, Weißig b. Dresden
Wolter, K.-J.; Detert, M.
Präparation von Testboards für Zuverlässigkeitsuntersuchungen an SMT-Lötstellen
Tutorial, SMT' 94, Nürnberg
Wolter, K.-J.; Detert, M.; Thierbach,
Untersuchungsergebnisse zum Ausfallverhalten von Lötstellen
Vortrag zum 2. Statusseminar, Oberpfaffenhofen, 27.10.94
Wolter, K.-J.
Untersuchungen von Fehlstellen in Kontaktsystemen mittels Röntgeninspektion
Vortrag, Symposium Elektronik-Technologie 94, Dresden
Sauer, W.; Wolter, K.-J.; Skuras, I.
New Results of Xray Inspection in Electronics Production
Vortrag, ROVPIA 94, Ipoh, Malaysia
1993
Sauer, W.; Wolter, K.; Keil, M.
Experimentelle Bestimmung der Maschinenfähigkeit von Bestückautomaten während ihres Einsatzes
Vortrag auf der Productronica 93, Tagungsband S. 69-77
1992
Wolter, K.; Kaiser, Chr.; Goetzke, T.
Lageerkennung von PCBs durch Korrelation
In: bild & ton, medienverlag Wilhelmshorst:45(1992)11/12. - Seite 333-336
Wolter, K.; Kaiser, Chr.; Goetzke, T.
Lageerkennung von PCBs durch Korrelation
SMT-Kolloquium des IET, TU Dresden, 7/92
Wolter, K.-J.
Integrierte Qualitätssicherung in der Oberflächenmontage (SMT) der Elektronik
Vortrag zum Test-Colleg`92 der Fa. Genrad München, 29./30.4.92
Wolter, K.
Integrierte Qualitätssicherung in der Oberflächenmontage (SMT) der Elektronik
SMT-Kolloquium des IET, TU Dresden, 7/92
Weck, G.; Wolter, K.
Forschungsaufgaben des Instituts im Rahmen des geplanten Verbundprojektes "Zuverlässigkeit von SMT-Weichlötstellen im visuellen Grenzfallbereich"
SMT-Kolloquium des IET, TU Dresden, 7/92
Sauer, W.; Wolter, K.; Flöricke, J.
Modellierung des Genauigkeitsverhaltens bei der Fine-Pitch-Bestückung
SMT/ASIC/HYBRID '92, Nürnberg
Sauer, W.; Wolter, K.; Flöricke, J.
Modellierung des Genauigkeitsverhaltens bei der Fine-Pitch-Bestückung
SMT-Kolloquium des IET, TU Dresden, 7/92
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