The fast and thus in-line-capable assessment of the quality of flat connection points of power semiconductors, which are produced by soldering or sintering, is a problem that has not yet been solved technically. Conventional diagnostic methods (e.g. X-ray or ultrasound microscopy) are either due to the principle or not due to the associated expenses, to carry out a direct quality control during the manufacturing process of the connection points. In the course of a previous project, a new process known as contact thermography was devised and examined in the laboratory. A miniaturized heating structure is coupled to the soldered or sintered power semiconductor as a measuring head. A short heating pulse is then introduced into the semiconductor. Depending on the quality of the connection layer underneath the semiconductor, this heating pulse spreads with different characteristics. This different propagation has a direct effect on the electrical properties of the heating structure, which can be measured. The actual measuring process (including the heating pulse) takes place within a maximum of 1 second and can therefore be integrated into the production line with absolute real-time capability. The technical implementation of the measuring principle and its integration into the process sequence in the production of power electronic modules will for the first time provide an in-line-capable test apparatus that enables real-time information on the quality of the connection points. In comparison to the previous practice of complex downstream investigations, the method promises cost-effective feasibility up to 100% testing in real time and thus direct feedback to the upstream process step of connection formation.

The goal of the project is the design of functions integrating, intelligtent and data processing sandwich panels for airplanes cabin - so called "Bauteile 4.0". In the past such constructional panels have been designed following strictly the convention "one function - one element". That hirarchical system and function separation restrains the ambition of developing multifunctional, highly integrated and hence weight optimized construction elements. Automotive industry has demonstrated that integration of additional functions like energy or data transfer into elements leads to wight reduction of the whole system while reliability and safety at least hold the former level. Functional integration is always combined with a plus on comfort for passengers and enables intelligent production processes as well as simplier assembly and maintenance.
Hence, there is a need in avionics industry as well to use the principle of funtional integration into elements. The airplanes cabin allows to design highly integrated elements with miscellaneous electronic and IT functions, to manufacture and implement those elements. Cabin interior, ground floor and multiple additional sndwich panels in the cabin are predestinated for that.

The project pursues the goal to improve the quality of area interconnects of power electronic modules by process integrated inspection and therefor to enhance the long-term reliability of such modules. To realize that, ceramic heating elements with high focused heating power and integrated cooling structures will be developed. A matrix of those heating-cooling elements allows an area-resolved induction of thermal energy. In addition the high dynamic behavior of the heaters allows a dedicated area- and time-resolved stimulation of the module for thermal inspection of  interconnects.

Current roadmaps are increasingly highlighting the role of optical bus systems as the backbone of future sensor and infotainment networks in many areas. Automotive, aerospace and industrial 4.0 applications in particular benefit from high EMC compatibility and low weight. In addition to these advantages, the high bandwidth energy efficiency and the low space requirement of optical connections are especially outstanding. In times of constantly increasing data volumes, standard copper wiring is reaching its limits, especially due to energy consumption at high transmission rates.

In the research group OPTAVER (Optical Packaging for 3D-optomechatronic-Devices) the modelling, simulation and additive production of polymer optical fibers on flexible foil substrates and their connection by asymmetric bus couplers as optical bus systems are investigated. In the first funding period, the system components were realized as planned and demonstrated in cooperation. The optical waveguides were first applied to a two-dimensional foil. This was conditioned in advance to improve the aspect ratio of the waveguide.

In the second funding period, the extension to three-dimensional opto-mechatronically integrated components (3D-opto-MID) is to be investigated. The formability of the thermoplastic film substrates will be used for this purpose. The three-dimensional integration of optical and mechatronic functionalities leads to an increase of the integration density and an extension of the design possibilities of opto-MID. The detachable optical couplers also offer a 3D-capable reconfigurable connection to a bus system.

The main objective of Productive4.0 is to achieve significant improvement in digitalising the European industry by means of electronics and ICT. Ultimately, the project aims at suitability for everyday application across all industrial sectors – up to TRL8. It addresses various industrial domains with one single approach, that of digitalisation.

What makes the project unique is the holistic system approach of consistently focusing on the three main pillars: digital production, supply chain networks and product lifecycle management.

This is part of the new concept of introducing seamless automation and network solutions as well as enhancing the transparency of data, their consistence, flexibility and overall efficiency. Currently, such a complex project can only be realised in ECSEL.

The well balanced consortium consists of 45% AENEAS, 30% ARTEMIS-IA and 25% EPOSS partners, thus bringing together all ECSEL communities. Representing over 100 relevant partners from 19 EU-member states and associated countries, it is a European project indeed.

Im SMT-Prozess erwartet man, dass die zu verarbeitenden Komponenten immer eben (bzw. unverbogen) sind. In der Realität treten aber Verwindungen und Wölbungen auf. Standards (z.B. IPC TM 650) geben Maximalwerte für diese Verbiegungen an, die aber nur für Raumtemperatur gelten. Für das Löten gibt es keine speziellen Grenzwerte. Am Institut steht mit dem TherMoiré® System eine Messausrüstung zur Verfügung, mit der man unter angenäherten Lötbedingungen die Verbiegungen von Bauelementen und Leiterplatten messen kann. Die zahlreich vorhandenen Messergebnisse zeigen, dass bei vielen Bauelementen und Leiterplatten erhebliche Verbiegungen nur während des Lötens auftreten, die mit real auftretenden Qualitäts- (z.B. Head in Pillow bei BGA) und Zuverlässigkeitsproblemen (z.B. Padabrissen) korrelieren.

Im Projekt werden Messungen an verschiedenen Bauelementen und Leiterplatten durchgeführt, deren Ergebnisse in eine Verbiegungsdatenbank einfließen. Es werden Testboards mit gezielt einstellbarem Verbiegungsverhalten konstruiert. In Experimenten werden die Einflüsse von solchen Verbiegungen auf die Qualität und die Zuverlässigkeit ermittelt. Die Zuverlässigkeitsanalysen werden durch FE-Simulationen ergänzt.

Als Endergebnis ergeben sich Empfehlungen für präzisere Grenzwerte von Verwindungen und Wölbungen, die in Standards einfließen können. Es wird dadurch möglich, qualitätskritische Komponenten zu identifizieren und Maßnahmen (notwendige Messungen, Änderungen der Konstruktion und der Materialauswahl) abzuleiten. Als Effekte können signifikante Fehlerquotensenkungen und Verbesserungen der Zuverlässigkeit von elektronischen Baugruppen erwartet werden.

The KoHLa project (miniaturised high voltage power supply for the integration in laser systems) aims for the miniaturisation and integration of a high voltage power supply used for a CO₂ laser system. The power supply is a 19” rack solution as of today. A significant reduction of the size and the system integration of the power supply, innovation of electrical functionality and substrate technologies as well as new cooling approaches are focus of the project.

Using the PowerBoard technology (organic substrates with thick and structured copper trace layers) as a starting point and developing new organic-ceramic composite substrates a novel power electronics device will be developed. Replacement of recent cooling approaches, integration of analog power and digital control systems, usage of standard low cost materials and components, and the miniaturisation and system integration will be realised. Finally, a demonstrator will be manufactured showing the functionality of the power supply based on the novel technological approaches of thick copper based and organic-ceramic composite substrates.

Die Technische Universität Dresden (TUD) und die Anvajo GmbH, eine studentische Ausgründung der TUD, führen gemeinsam das Telemedizin-Projekt »FlexEO - Auf flexibler Elektronik und Optik basierendes tragbares Gerät zur in vivo Spektrometrie von Blutbestandteilen für die Telemedizin« durch.

Ein tragbares Gerät wird entwickelt, das außerklinisch und nicht-invasiv Blutbestandteile und Parameter des Herz-Kreislauf-Systems analysieren kann. Das Kernstück der nicht-invasiven Messung wurde in den letzten drei Jahren am Institut für Aufbau- und Verbindungstechnik der Elektronik (IAVT) der Fakultät Elektrotechnik und Informationstechnik (EuI) entwickelt: ein optisches Mikrospektrometer, mit dessen Hilfe Licht in seine spektralen Bestandteile zerlegt und analysiert werden kann. Dieses Mikrospektrometer ist so klein, dass es leicht in einen Fingerclip oder ein tragbares Gerät integriert werden kann.

Das Mikrospektrometer soll in ein tragbares Gerät eingebettet werden, welches teilweise auf flexibler Elektronik basiert. Die Wissenschaftler/innen am IAVT der TUD werden dieses Gerät entwerfen. Aufgrund der flexiblen Elektronik werden sich die Sensoren des Gerätes an die Anatomie des Trägers anpassen können. Somit werden die verschiedenen  Sensoren im Gerät optimal zur Körperoberfläche hin ausgerichtet. Das wird zu einer deutlichen Verbesserung der Messqualität im Vergleich zu herkömmlichen Methoden führen. Neuartige Algorithmen sollen außerdem den pulsierenden Blutanteil im menschlichen Gewebe berücksichtigen. So sollen bisher nicht messbare Blutbestandteile nicht-invasiv bestimmt werden können. Die dafür benötigte Software wird im Rahmen des Projekts am Institut für Biomedizinische Technik der Fakultät EuI entwickelt.

Mit Hilfe des Gerätes und dessen neuer Messtechnik sollen konventionelle Messmethoden qualitativ entscheidend verbessert werden, um eine flächendeckende, telemedizinische Überwachung und Versorgung von chronisch erkrankten Menschen (wie z.B. Patienten mit obstruktiven-Schlafapnoe-Syndrom oder Diabetes Mellitus) im häuslichen Umfeld zu ermöglichen.

Die Projektlaufzeit von FlexEO umfasst insgesamt drei Jahre; im Dezember 2019 soll das Projekt abgeschlossen werden.

Im Rahmen des Projekts Responsive Fab bearbeitet unsere Arbeitsgruppe das Teilprojekt  "Erweitertes Scheduling". In diesem Teilprojekt werden Verbesserungs- und Optimierungsmaßnahmen im Bereich der Produktionsplanung und -steuerung untersucht, mit dem Ziel, die Flexibilität und Planungsstabilität in der Halbleiterfertigung zu erhöhen. Der Schwerpunkt liegt dabei auf der Ablösung bzw. Ergänzung des derzeitigen Dispatchings durch Scheduling-Algorithmen.

The center of excellence „Function integration for micro- and nanoelectronics“ is a network of facilities of TU Dresden, TU Chemnitz and the Fraunhofer Society. Its purpose is focused on strengthening the field micro- and nanoelectronics in Saxony in. A key aspect is the creation of cooperation structures between fundamental research and the needs of the local semiconductor industry. The demand of smaller, more complex and heterogeneous systems and the 3D integration of different components require a close coordination of research efforts in different fields of semiconductor manufacturing.Therefore, novel materials and processes will be investigated at the Institute for Electronic Packaging Technology. The new approaches are focused on manufacturing of micro-scale-interconnections at both lower temperatures and lower pressures and new interconnects with nanoporous intermetallic compounds.

Based on the results of phase I of the DFG project and in addition to the work packages of the partners IAVT is emphasized on the development of packaging technologies for ultra thin flux sensors for magnetic fields orthogonal to the sensors plane. The complete sensor package shall have a maximum height of 150 µm including substrate, interconnection, housing and adhesive layer. Long term stability of about more than 10 years is mandatory and has to be approved by accelerated aging tests.

Main electronic modules indispensable for recent trends like e-mobility and regenerative energies are converters, engine control units and other power electronic modules. They contain bare power semiconductor dies out of silicon (Si) or silicon carbide (SiC) as main devices, which are mounted on the substrates using area solder joints or sintered interconnects. Fig. 1 shows such a device and a power electronic module made with it.

One challenge using those semiconductor devices is the quality control of the interconnection with the substrate. To realize those interconnections mainly soldering is used, but more and more also sintering.

The goal of the project is to develop a cheap and finally inline capable solution for a thermography system with few pixels, that can measure the temperature distribution after thermal excitation with high temperature and time resolution as an integral across the measurement field (e.g. defined parts of the die area of a power semiconductor). The test procedure is planned as a comparing measurement, so that within a short time period (thus inline capable) the thermal transient process of the specimen can be compared with that one of a "golden part", whose interconnection quality has been evaluated in detail using laboratory methods (X-ray-tomography, scanning acoustic microscopy) or destructive testing (metallographic preparation) in detail.

• Verfahrensentwicklung zur Umsetzung, Integration und Kontaktierung sowohl von textilbasierten und ‑verarbeitbaren Sensoren zur präzisen Ermittlung von lokalen und globalen Beanspruchungszuständen und Schäden in CFK mit duroplastischem Matrixsystem als auch von textiltechnisch verarbeitbaren elektronischen Bauelement- und Schaltungsträgern zur vorzugsweise drahtlosen Signal- und Energieübertragung
• Verfahrensanweisung für die Umsetzung und Integration der Sensorsysteme in CFK unter möglichst geringen zusätzlichen Prozessaufwand für KMU als auch mit marginaler Beeinflussung der mechanischen Eigenschaften der CFK-Strukturen
• Realisierung von endanwendungsnahen Funktionsdemonstratoren (z. B. CFK-Lastenholm oder Rotorblatt WEA; CFK-Chassis Automobil)
• elektrische Isolation/Schirmung der Sensorsysteme / integrierten Elektronikkomponenten gegen CFK-Strukturen zur Vermeidung von Kurzschlüssen

Das Helmholtz-Zentrum Dresden-Rossendorf e.V. (HZDR), die Technische Universität Chemnitz (TUC) und die Technische Universität Dresden (TUD) haben sich zum Ziel gesetzt, im Rahmen des Kooperationsprojektes „Entwicklung SNEF-basierter Touchscreens zur hochsensitiven, störungsfreien Echtzeit-Kontrolle adhärenter Zellkulturen mittels kapazitiv-elektrischer, induktiv-elektrischer und akustisch-mechanischer Breitband-Impedanzspektroskopie (PolCarr-Sens)“ die PolCarr®-Technologie für die Kontrolle des adhärenten Aufwachsens von Zellkulturen weiter zu entwickeln. Innerhalb des Vorhabens soll die Mikro-Sensorik für drei verschiedene, sich ergänzende Breitband-Impedanzspektroskopie-Verfahren in Mikrotiterplatten mit PolCarr®-Boden integriert und eine Auswertesoftware für die Routine-Beobachtung des Zellverhaltens unter experimentellen Bedingungen mittels Breitband-Impedanzspektroskopie entwickelt werden. Die Anwendung PolCarr-Sens basiert auf der patentgeschützten PolCarr®-Basistechnologie des HZDR. PolCarr-Sens hat das Potential für eine automatisierte High-through-put-Kontrolle der Eigenschaften adhärenter Zellen und stellt eine signifikante Verbesserung gegenüber herkömmlichen Kontrollmethoden, bspw. gegenüber der Lichtmikroskopie, dar.

The discovery of oil in deep waters of the Pre-salt region reported some years ago by Petrobras is changing the national oil industry, requiring new technologies to be developed. Along with the challenges of marine exploitation (offshore) came the need to look for materials with increasingly specific properties to be used in submarine structures and equipment, primarily due to the severity of the environments in which these materials are operating. . In this context the steel industry has improved the development of special steels adding chromium, nickel and molybdenum contents to the basic carbon steel alloy.  Due to the possible emergence of fatigue cracks and the relevance of the structures manufactured by clad steel, it is extremely important to perform periodic inspections of such equipment, and the implementation of nondestructive testing is indicated. Nondestructive tests (NDT) are tests on materials used to verify whether there are any discontinuities or internal faults in the material, without changing its physical, chemical, mechanical or dimensional features and without interfering in its subsequent use. The nondestructive technique by Eddy Current, is widely known and commonly used for structure inspection [5], because of its high capability of detecting cracks and micro cracks in various metallic materials. By operating EC devices in high-frequency (HF) and very high frequency (VHF), range (3-300 MHz [9]), capacitive effects or effect related to permittivity of the object are significantly influencing the EC signal. By interpretation of both, the conductivity and capacitive effects, a far more detailed material diagnostic becomes possible. 

In the next 20 years, the continual miniaturization of electronics will reach its physical limits. Nowadays chips are manufactured in CMOS technology with structures less than 14 nm. The transistor geometries will decrease with further downscaling, reaching the size a few atom diameters. A promising solution is 3D-integration, the stacking of chips on top of each other. Hereby the die-stack becomes a “skyscraper” of electronics. For optimal technical usage, information must be transmit efficient through the whole die-stack. Therefore, it is necessary to analyze and develop a completely new communication infrastructure, which is both energy-efficient and resource saving.

This communication infrastructure enables a miniaturized internet within the chip-stack and therefore the young researcher scientist group calls it “3D-Atto-network”.

The microelectronic, semiconductor and photovoltaic industry has a long tradition in the area of Dresden/Freiberg/Chemnitz. The topic of this young researcher group is one of the most important for the future information and communication technology industry in Saxony and Germany (see high tech industry of the German Confederation and the Free State of Saxony). The Saxony research and development cluster “Silicon Saxony”, including around 300 companies and 40.0000 employees, which has recognized its importance, also supports it.

The 3D-Atto-networks that are based on 3D-integration will become a key technology for future products, innovative technologies and megatrends as Smart Cities, Smart Grids or Industry 4.0. Including for example the tactile internet and the 5G mobile phone standard launched in around 2022.

Sub-Project A10: System integration for optical and wireless Pbit/s communication in high performance computing

Addressing the increasing energy demand of global internet usage and the resulting ecological impact of it, the visionary goal of the collaborative research center HAEC (“Highly Adaptive Energy-Efficient Computing”) is to research technologies to enable computing systems with high energy efficiency without compromising on high performance. To achieve the goal of an integrated approach of highly adaptive energy-efficient computing, the problem is approached at all levels of technology involved, the hardware, the computer architecture and operating system, the software modeling as well as the application modeling and runtime control levels. A novel concept (HAEC box) of how computers can be built by utilizing innovative ideas of optical and wireless chip-to-chip communications shall be explored. The HAEC collaborative research center is a first attempt to achieve high adaptivity and energy efficiency with an integrated approach.

In the CRC 912 the IAVT works on the project A10: System integration for optical and wireless Pbit/s communication in high performance computing. The main research focus of the project is the integration of components of communication transceivers into the high performance package. In the phase II following research areas are investigated: electro-optical integration on board- and package-level, packaging for mm-wave communication and embedding/integration of link components on the wafer-level.

The potential of precise space-resolved strain measurements or the capacity to transmit very large amounts of data are two examples of the beneficial use of optical systems. Apart from the general advantages of the optical signal line, like as far as possible immunity to electromagnetic radiation, being non-sparking for the use in potentially explosive areas or the low weight compared to copper cables, modern technologies make use of the possibilities to integrate optical waveguides into structural components. Questions regarding the integration of optical waveguides into fiberglass composite components or into printed circuit boards are, among others, the subject of current research.

However, questions regarding the signal transfer at nods in photonic networks are still unsolved. There are possibilities of optical-electrical and electrical-optical signal conversion. Though an exclusively passive coupling of optical signals is currently subject to restrictions. This and other challenges of the optical assembly and interconnection technology are picked up by the dislocated research group.

The goal of the dislocated research group is to research methods and technologies for the design, construction and manufacturing of three-dimensional optically functionalized mechatronic components (3D-opto MID).

Thermo bulbs are thermal sensitive trigger trigger elements for sprinkler systems, fire flaps and other elements. The latest JOB development is the so called "Extinguishing Bulb (E-Bulb)" for fire extinction in electrical circuits. Bursting of the glas ampulla at a defined temperature level a non-conductive and non-toxic fluid is evaporated which immediatly becomes gaseous. The cooling effect and the eliminating of oxygen the fire is extinguished within seconds. This concept together with an electrical functionalization of the thermo bulb shall be developed further. In addition to the passive triggering based on the environmental temperature the newly develeoped EF-Bulb shall also be triggerable actively by heating up the bulb and such initializing the bursting. With such triggering mechanism new application field in fire protection can be developed with increased triggering sensitivity and reduced reaction time.

The general goal of the project is an improved networking between stakeholders in the field of aviation and space flight. It's especially emphasized on an improved interaction between suppliers and service providers of semiconductor and electronic industry on one side and specific module suppliers (Tier1, Tier2, etc.) and system manufacturers (OEM) of aviation industry on the other side.

The project part of TU Dresden is focused on "integration concepts for muliti functional components in the special environment of aviation industry". The special contribution of this part is the systematic analysis of research topics of the involved cluster regions as well as on an international level. The main focus is about the application of innovative technologies of electronics packaging in avionics, especially in the field of cabin systems.

Ziel des Forschungsprojektes ist die Weiterentwicklung des Hochfrequenz-Wirbelstrom-Verfahrens zu einem KMU-geeigneten, flexiblen, prozessintegrierten und automatisierten Qualitätssicherungs­verfahren für die textile carbonfaserbasierte Halbzeug- und Preformherstellung, den Imprägnierprozess und ausgehärtete CFK-Bauteile. Diese Weiterentwicklung verfolgt das Ziel, mithilfe der Wirbelstrom-Messtechnik eine Grundlage zur automatischen Detektierung, Identifizierung und Quantifizierung von Fehlern und Qualitätsmängeln entlang der gesamten Prozesskette der CFK-Herstellung zu schaffen. Aufgrund der besonderen technologischen und wirtschaftlichen Relevant für KMU soll diese Entwicklung anhand der Prozesse Multiaxial-Kettenwirken (Halbzeugherstellung), Binder-Umformtechnik (Preformherstellung) und Vakuum­infusion (Verbundherstellung) erfolgen.