Technologies and processes for electronic packaging are the main topics of our research work. System integration needs permanent adaption to the product demands.
Research in electronic packaging on a high scientific level, that's only possible by a combination of substantiated basic research and practical applied research. Additional important framework requirements are a good infrastructure in equipment and lab conditions, extended networking with other research institutions and industry as well as a suitable mix of competent know-how owners and innovative, interdisciplinary and sytem-relevant thinking scientists.
At the same time, only by such research work university students education on a high scientific level can be guaranteed. Thereby we establish the fundamentals for substantiated and practically educated graduates and next generation scientists.
The extended equipment infrastructure of IAVT/ZmP as well as the expert know-how of our staff is ready to be used by you. You can get information about our facilities in the "Services and Equipment" area and about the offers related to the competence platform "nanoeva"
