Technologies and processes for electronic packaging are the main topics of our research work. System integration needs permanent adaption to the product demands.
Research in electronic packaging on a high scientific level, that's only possible by a combination of substantiated basic research and practical applied research. Additional important framework requirements are a good infrastructure in equipment and lab conditions, extended networking with other research institutions and industry as well as a suitable mix of competent know-how owners and innovative, interdisciplinary and sytem-relevant thinking scientists.
At the same time, only by such research work university students education on a high scientific level can be guaranteed. Thereby we establish the fundamentals for substantiated and practically educated graduates and next generation scientists.