IAVT and ZmP organize their joint research activities in working directions. These are based on current research and development needs both in basic research and in industry-related applied research. The range of working directions also reflects the holistic approach to system integration.

The working directions concern in detail:

• bio-compatible packaging,
• thick film technology,
• printed circuit board technology,
• assembling technologies and quality management,
• micro and nano scaled materials for system integration,
• 3D integration,
• optical interconnect technologies,
• module reliability and material properties,
• non-destructive diagnostics,
• microstructure characterisation.