IAVT and ZmP organize their joint research activities in working areas. These are based on current research and development needs both in basic research and in industry-related applied research. The range of research areas also reflects the holistic approach to system integration.

The working directions concern in detail:

• Next-Generation Electronics Packaging Technologies
• Electronics Packaging for Power Electronics and Harsh Environment
• Electronics Packaging for Sensors, Biotechnical and Medical Applications
• Photonics System Integration
• Electronics Packaging for Open-Form Applications
• Sustainable Electronics Packaging
• Package Level Diagnostics and Characterization
• Materials Characterization and Quality Assurance Methods
• Reliability Prediction, Simulation and Machine Learning