Thermo-mechanical reliability is one of the major factors in the development of modern packaging solutions for electronics. Currently, about 65% of all failures in packages and assemblies are attributed to thermo-mechanical problems. However, unknown reliability figures may slows down the development of new technologies and might be an important limiting factor for the application of many of new packages. In order to analyze and solve thermo - mechanical related problems in electronic assemblies a number of different approaches is used at Institute of Electronic Packaging Technology at TU Dresden. These approaches span from classical root failure analysis to life time prediction using Finite Element Analysis.
Since further miniaturization and functional integration will reduce interconnection dimension while it increases power dissipation, thermo - mechanical issues are going to become more critical. In order to analyze and solve thermo-mechanical related problems in electronic assemblies a number of new approaches and methodologies (above all in the experimental area) will be required.