The Institute of Electronic Packaging Technology (IAVT) and the Centre for Microtechnical Manufacturing (ZmP) are working together already more than 25 years in research and education. Together they represent one of the largest university research institutions in Germany active in the field of Electronic Packaging.
The Institute of Electronic Packaging Technology (German abbrev. IAVT) is one of the Institutes of the Faculty of Electrical Engineering and Information Technology of Technische Universität Dresden. In 2003 the IAVT emerged from the former Electronics Technology Lab.
Prof. Dr.-Ing. Dr. h.c. Karlheinz Bock is the Director of IAVT.
Dr.-Ing. Karsten Meier and Dr.-Ing. Krzysztof Nieweglowski are Assistant Directors.
Prof. Dr.-Ing. habil. Thomas Zerna is the Second Director of IAVT.
The Centre for Microtechnical Manufacturing (German abbreviation ZmP) was founded in 1995. Since 1999 it is a central scientific institution of the Faculty of Electrical Engineering and Information Technology of Technische Universität Dresden.
In close cooperation with IAVT of TU Dresden, ZmP is working in the field of processes and technologies in electronics production. ZmP is active in research and students education, but especially in scientific services. In addition ZmP is teaching apprenticees in Microtechnology.
Prof. Dr.-Ing. habil. Thomas Zerna is the Director of ZmP.
PD Dr.-Ing. habil. Martin Oppermann is the Assistant Director.
Prof. Dr.-Ing. Dr. h.c. Karlheinz Bock is the Second Direcotor of ZmP.
The office of IAVT and ZmP is located in Günther-Landgraf-Bau in Mommsenstr. 15, 01069 Dresden, room 7-105.
