Services

• Manufacturing of Herstellung von phot masters for PCB production
• Manufacturing of one-sided, double-sided and multilayer PCBs (up to 6 layers) including through hole metallization
• Manufacturing of copper printing masks by etching

Equipment

• Equipment for manufacturing of PCBs and printing masks
  • Computer controlled mill-drill-plotter Bungard CCD, maximum rotation speed 60.000 rot./min, drilling diameter 0.3 - 4 mm
  • PCB brush engine, Bungard
  • Galvanic Compakta for tenting technology, Bungard, maximum workpiece size 300 mm x 400 mm
  • Etching machine, Bungard, copper-II-chloride
  • Stripper sodium hydroxide
  • Rigid resist laminators (Hot rol), Bungard
    • phot. etching resist 40 µm, width 300 mm
    • phot. solder mask 65 µm, width 400 mm
  • Exposurer, Bungard EXP 8000
  • Multi layer laminator MLP 20

Services

• Testing of new materials and development of technologies
• Prototyping and manufacturing of examples
• Characterization of thick film components and layer systems

Equipment

• Mask preparation
  • photo plotter (Gerber format)
  • screens with emulsion (steel and polyester canvas, standard / fine)
  • copper masks (double sided etched)
  • steel masks (laser cut)
• Laser technology
  • drilling of vias in ceramic substrates and polymer foils
  • cutting and scribing of outlines for panel separation
  • resistor trimming
• Screen printing technology
  • MPM-SPM (with vision system)
  • EKRA X5 STS
• Sintering technology
  • programmable batch furnace ATV PEO 603
  • zone furnace BTU up to 1100 °C
• Possible technologies
  • CERMET thick film technology on Al2O3-ceramics
  • Low Temperature Cofired Ceramic Technology – LTCC
  • Polymer thick film technology on organic flex substrates

Services

• Assembly of electronic modules, prefered in SMD technology
• First- and second-level interconnect technologies

Equipment

Micro assembly:

• Ultrasonic and thermosonic wire bonder F&K Delvotec 54xx and 56xx
• Flip chip bonder
• Fineplacer

Application of interconnect materials:

• Mask printing equipment EKRA X3
• Dispensing machine Martin

Placement of components:

• SMD-assembling machine SIPLACE SX1
• SMD-aasembling machine Fuji NXT-II
• Places for manual assembly

Soldering technologies:

• Convection reflow soldering equipment Rehm V8 2.1
• Wave soldering equipment Seho GoWave
• Vapor phase soldering equipment IBL
• Rehm Condenso XM
• Selective soldering equipment (light) ATN economic A400

Services

• Material treatment of ceramics and thin metal foils
• Thick film resistor trimming
• Drilling and cutting
• Laser soldering
• Laser micro welding

Equipment

• 3D-Micromac microCUTms10.6: CO2 laser, 200 W + fibre laser, power 20 W
• Welding laser LSW 4001

Services

• contact-free topological measurement of surfaces
• determination of roughness
• volume calculation
• needle-contact topoligical Measurement of surfaces

Equipment

• Laser profilometer NanoFOCUS µScan AF2000
• Measurement system NanoFOCUS µSurf
• NanoFOCUS µSprint
• MarSurf CP select
• 3D-coordinates measurement equipment PMC 500
• Two-coordinates Measurement microscope ZKM 01-250C (Carl Zeiss)
• Bruker DektakXTA

Services

Measurement of topography and deformation and its changing on flat objects under changing temperature conditions (e.g. simulation of soldering temperature profile up to 280°C, temperature cycles down to -50°C)
Sample objects:

• bare Printed Circuit Boards
• components (BGA, LGA, QFP, QFN)

Sample objects which need special preparation:

• SMD connectors
• assembled PCB

other objects on request (please deliver object pictures and dimensions before)

Equipment

• Insidix TDM Compact II
  • Objects up to (300 x 200) mm²
  • Infrared heating (max. temperature gradient 3K/s)
  • Active cooling (max. temperature gradient -3K/s)
  • Temperature range: -50°C ... 300°C
  • Accuracy z-direction: 1,5 µm repeatabilityt
  • Resolution vs. measurement area (FOV = Field of View)
    • 53 µm @ (195 x 155) mm²
    • 31 µm @ (110 x 90) mm²
    • 10 µm @ (37 x 30) mm²
    • 3 µm @ (12 x 10) mm²

Rheology

Services

• Determination of rheological behaviour of pastes
• Investigation of the influence of surface treatment, in example on the releasing behaviour of printing screens and masks

Equipment

• Rheometer HAAKE RheoStress 600
  • VC Motor controlled
    • mimimum torque 0.5 µNm
    • angle resolution of 0.012 µrad
  • Peltier-tempered plate-conus-system
    • T=(-60 – 185) °C
  • Measurement in three modes:
    • shear stress presetting (CS-mode)
    • rotation speed presetting (CR-mode)
    • deformation-controlled (CD-Modus)

Contact angle measurement

Services

• Contact Angle measurement
• Calculation of surface tension and surface energy of packaging materials
• Statistical analysis and failure analysis

Equipment

• Contact angle measurement equipment dataphysics OCA 20

Service

• Non-destructive inspection of prototypes and samples of packaged and unpackaged components, devices and substrates.
• Layer by layer detection of failures like delaminations, gas inclusions,  cracks and selective micro defects, especially of laminates, large area adhesions (e.g. heatsinks) and DCB substrates.
• Run-time analysis to describe material inhomogeneity.
• Ultrasonic scans are documented as files or color printed images.

Equipment

Ultrasonic microscope SONOSCAN C-SAM® Gen6™

• Changeable transducers with the following frequencies and lateral resolutions:
  • 10 MHz: 250 µm
  • 15 MHz: 175 µm
  • 20 MHz: 125 µm
  • 30 MHz: 75 µm
  • 50 MHz: 50 µm
  • 60 MHz: 30 µm
  • 100 MHz: 25 µm
  • 230 MHz: 10 µm
• Investigation depth up to some millimeters depending on the frequency and the material
• Investigation methods C-Scan, Q-BAM™, THRU-Scan™
• VRM™ (complete storage of echo signals of the specimen), regenerating of defect images of any layer, extraction of three-dimensional information, run-time topography
• Coupling medium: de-ionised water

X-ray radiography

Service

Equipment

• Non-destructive inspection of electronic devices and modules, especially with high contrastive materials (solder, metallisation), e.g.:
  • Standard- and fine-pitch-SMT and THT solder joints
  • BGA-, COB-, CSP- and Flip-Chip solder joints
  • Missing and imperfect solder joints
  • Displacement
  • Shorts
  • Solder joint analysis (voids)
  • Multilayer PCB
  • X-ray microscope phoenix|x-ray nanome|x
    • high resolution vertical or oblique view up to 70°
    • high resolution real time image processing or alternatively digital detector
    • CCD camera: 1126 x 1600 pixel, resolution 12 bit
    • Digital detector: 1000 x 1000 pixel, resolution 14 bit
    • geometrical magnification: > 1.000 times
    • minimal detail visibility: 400nm

X-ray Computer Tomography

Services

• Volume analysis and reconstruction of electronic devices and modules

Equipment

• X-ray Computer Tomography equipment nanotom
  • open nanofocus tube with tungsten target
  • acceleration voltage: 10 – 180kV / 15W
  • beam current: 5 – 1.000µA
  • precision manipulation on a granit base
  • high resolution digital detector with 2.400 x 2.400 Pixel, 12 bit
  • pixel size: 50µm x 50µm
  • minimal voxel size: < (500nm x 500nm x 500nm)
  • geometric magnification: 1,7-times to 1.000-times
  • maximal specimen size/ weight: h = 150mm, d = 120mm, m = 1kg

Services

• Preparation of a target layer
• Analysis of microstructures, cracks, delaminations and voids (e.g. for packaging qualification after thermal-mechanical stress)
• Measurement of structure size, like intermetallics, lengths, layer thicknesses
• Documentation and reporting of the results

Equipment

• Grinding and polishing: TegraSystem (TegraForce-5, TegraPol-35)
• Precision sectioning saws: IsoMet 1000 (bis 1000 RPM), Accutom-2 (3000 RPM)
• Microscopy: Leica DM4000 M (max. magnification 1000x) and digital camera (2080x1544 pixel)
  • Reflected light methods: bright field, dark field, polarized light, differential
    interference contrast
• Database image management system

Service

• Temperature profile detection
• Off-line measurement
• On-line measurement
  • Zero-Ohms resistance measurement
  • Failure detection with defined shut down of cycle chambers
  • Voltage measurement

Equipment

• Temperature test chamber
• • Single chamber system Feutron TPK 600
  • Temperature range: -70 °C to 180 °C
  • Temperature gradient: 10K/min (-55 °C to 150 °C)
• Power cycle chamber
  • Two chamber system Feutron TSK 200
  • Hot chamber: 10 °C to 200 °C
  • Cold chamber: -75 °C to 180 °C
• Zerol-Ohm measurement system
  • Four-point resistance measurement
    • Software controlled
    • Temperature triggered
  • Keithley-Delta-Mode System
    • Nano volt meter Keithley Modell 2182A
    • Current source Keithley Modell 6121
  • 128 channel multiplexer
  • Voltage measurement
• Isothermal storage
  • Temperature range: -80 °C to 300 °C