3D-Integration
3D stacked heterogeneous electro-optical package as planned in SFB 912; PetaBit-HAEC-Box, optical data throughput aimed at 60 Tbit/s per node, mm-wave RF performance aimed beyond 180 GHz with Butler-Matrix based antenna arrays.

The technological development of our society might be characterized with the “Internet of Things (IoT)”. Electronics packaging provides the hardware in many products being part of such an extended network. Nearly everything in future will be connected with a more or less powerful electronic hardware to the network or to the IoT and “the network of humans and things”. In order to ensure proper function of the IoT the electronics (hardware) and the control programs and protocols (software) drastically need to be advanced.

We have to ensure only smallest delays in signals and reactions in order to allow the advanced services to operate, for example autonomous driving vehicles or remote surgery in a hospital. Only if delays less than 1 millisecond can be achieved, then the IoT is considered “realtime” for such services and is then called “tactilel internet”.

Contact person
Prof. Dr.-Ing. Dr. h.c. mult.
Karlheinz Bock
Phone: 
(0351) 463 36345