Scientists
Fraunhofer IKTS Dresden
Referenzen
2024
Meyer, J.; Metasch, R.; Meier, K.; Röllig, M.; Bock, K.
Mikrostrukturanalyse an Silbersinterkontakten unter Variation der Prozessparameter und Korrelation zu mechanischen Eigenschaften
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
Röllig, M.; Schwerz, R.; Meyer, J.; Meier, K.
Materialmodellierung von Ag-Sinter-Kontakten für FEM-Berechnungen unter Berücksichtigung von Plastizität, Porosität und Herstellungseinflüssen
Elektronische Baugruppen und Leiterplatten EBL 2024 Technologische Plattform für die digitale Transformation, 12. DVS/GMM-Fachtagung, Fellbach (Germany), 2024
2022
Metasch, R.; Roellig, M.; Schwerz, R.; Gleichauf, J.; Maniar, Y.; Ratchev, R.; Meier, K.
Optimized TMF Measurement Setup for reproducible Lifetime Measurements on Solder Joints under accelerated thermal-mechanical conditions
Proceedings of the 23th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Malta, 2022, DOI: 10.1109/EuroSimE54907.2022.9758911
2021
Meier, K.; Roellig, M.; Kuntzsch, R.; Rammer, T.; Peuckert, M.
Technologie-Entwicklung für PCB-integrierte Leistungsund Logikstrukturen
Produktion von Leiterplatten und Systemen (PLUS) 6/2021, S. 719-729, Eugen G. Leuze Verlag, Bad Saulgau
2020
Schwerz, R.; Metasch, R.; Roellig, M.; Meier, K.
FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), virtual event, 2020
2019
Meier, K.; Leslie, D.; Dasgupta, A.; Roellig, M.; Bock, K.
Analysis of Flip-Chip Solder Joints under Isothermal Vibration Loading
Proceedings of the 21st Electronic Packaging Technology Conference (EPTC), Singapore, 2019
Bickel, S.; Meier, K.; Roellig, M.; Bock, K.
Manufacturing and reliability issues of highly integrated packages for power electronic applications
Proceedings of the 42nd International Spring Seminar on Electronics Technology (ISSE) Advances in Printed and Ceramic Microsystems, Wroclaw (Poland), 2019
Metasch, R.; Roellig, M.; Knoch, P.; Weinmann, C.; Meier, K.
Methodology for Correlation of Porosity and Mechanical Properties of Silver Sintered Joints in Electronics
Proceedings of the 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Hannover (Germany), 2019
Metasch, R.; Schwerz, R.; Meier, K.; Roellig, M.
Numerical Study on the Influence of Material Models for Tin-based Solder Alloys on Reliability Statements
Proceedings of the 22nd European Microelectronics and Packaging Conference (EMPC), Pisa (Italy), 2019
2018
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Microelectronics Reliability 2018, vol. 87, 125-132; https://doi.org/10.1016/j.microrel.2018.06.003
Kraemer, F.; Roellig, M.; Metasch, R.; Wiese, S.; Ahmar, J.; Meier, K.
Experimental Determination of the Young’s Modulus of various Electronic Packaging Materials
Microelectronics Reliability 2018, vol. 91, 251-256; https://doi.org/10.1016/j.microrel.2018.06.002
Metasch, R.; Meier, K.; Roellig, M.
Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Proceedings of the 7th Electronics System-Integration Technology Conference (ESTC), Dresden (Germany), 2018
Meier, K.; Roellig, M.; Bock, K.
Developments for Highly Reliable Electronics – Experiments on Combined Thermal and Vibration Loading
Proceedings of the 68th Electronic Components and Technology Conference (ECTC), San Diego, California (USA), 2018
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Elektronische Baugruppen und Leiterplatten EBL 2018 Multifunktionale Aufbau- und Verbindungstechnik – Beherrschung der Vielfalt, 9. DVS/GMM-Fachtagung, Fellbach, 2018
2017
Meier, K.; Roellig, M.; Liu, Y.; Bock, K.
Solder Joint Fatigue Analysis under Combined Thermal and Vibration Loading
Proceedings of the 19th Electronics Packaging Technology Conference (EPTC), Singapore, 2017
Metasch, R.; Roellig, M.; Kuczynska, M.; Schafet, N.; Becker, U.; Meier, K.; Panchenko, I.
Accelerated Life Time Measurement with In-situ Force and Displacement Monitoring during Thermal Cycling on Solder Joints
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
Kraemer , F.; Roellig, M.; Metasch, R.; Wiese, S.; Al Ahmar, J.; Meier, K.
Experimental Determination of the Young’s Modulus of various Electronic Packaging Materials
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Fatigue Measurement Setup under Combined Thermal and Vibration Loading on Electronic SMT Assembly
Proceedings of the 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Dresden, 2017
2016
Meier, K.; Röllig, M.; Bock, K.
Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Elektronische Baugruppen und Leiterplatten EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit?, 8. DVS/GMM-Fachtagung, Fellbach, 2016
2015
Gluch, J.; Löffler, M.; Meyendorf, N.; Oppermann, M.; Röllig, M.; Sättler, P.; Wolter, K.-J.; Zschech, E.
Multi-scale Radiographic Applications in Microelectronic Industry
Vortrag & Paper auf QNDE 2015, 26.-31.07.2015 in Minneapolis (USA)
Meier, K.; Röllig, M.; Bock, K.
Untersuchung des Ausfallverhaltens von Lotkontakten unter Temperaturwechsel- und Vibrationsbelastung
VDE GMM 6. Mikrosystemtechnik-Kongress, Karlsruhe, 2015
Röllig, M.; Metasch, R.; Meier, K.; Schwerz, R.
Simulationsgestützte mikromechanische Werkstoffmodellierung von Zinn-Basisloten basierend auf produktangepassten Prüfkörpern und Messtechnik für Berechnungen von Temperaturwechselbeanspruchungen
VDE GMM 6. Mikrosystemtechnik-Kongress, Karlsruhe, 2015
Meier, K.; Röllig, M.
Reliability Study on SMD Components on an Organic Substrate with a Thick Copper Core for Power Electronics Applications
Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Budapest, 2015
2014
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.
Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung – Untersuchungen bei Raumtemperatur, bei Hochtemperatur und nach isothermer Voralterung
Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag; ISSN 1436-7505
Metasch, R.; Roellig, M.; Kabakchiev, A.; Metais, B.; Ratchev, R.; Meier, K.; Wolter, K.-J.
Experimental Investigation of the Visco-plastic Mechanical Properties of a Sn-based Solder Alloy for Material Modelling in Finite Element Calculations of Automotive Electronics
Proceedings of the 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Gent, 2014
Meier, K.; Lautenschläger, G.; Röllig, M.; Schießl, A.; Wolter, K.-J.
Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Elektronische Baugruppen und Leiterplatten EBL 2014 Von Hochstrom bis Hochintegration, 7. DVS/GMM-Fachtagung, Fellbach, 2014
Meier, K.; Röllig, M.; Schießl, A.; Wolter, K.-J.
Reliability Study on Chip Capacitor Solder Joints under Thermo-Mechanical and Vibration Loading
Proceedings of the 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Gent, 2014
2013
Schwerz, R.; Meier, K.; Röllig, M.; Osmolovskyi, S.; Wolter, K.-J.
Reliability of Passive Components Embedded in Organic Substrates
3rd Global Interposer Technology Workshop (GIT) 2013, Atlanta (USA)
Meier, K.; Röllig, M.; Wolter, K.-J.
The Effect of Cu and Ag on the Yielding Behaviour of Lead-Free Solders at High Strain Rates
Proceedings of the 15th Electronics Packaging Technology Conference (EPTC), Singapore
Röllig, M.; Metasch, R.; Schingale, A.; Schießl, A.; Meier, K.; Meyendorf, N.
Novel Quick Predict Approach for Identification of Critical Loadings in Electronic Components on PCB under Vibration Realized as a Design Support Tool
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Schwerz, R.; Meier, K.; Röllig, M.; Schingale, A.; Schießl, A.; Wolter, K.-J.; Meyendorf, N.
Evaluation of Embedded IC Approach for Automotive Application
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.; Meyendorf, N.
Determination of Life-time of Solder Joints under Temperature and Vibration Loadings
Proceedings of the International Conference MicroCar 2013
Meier, K.; Röllig, M.; Lautenschläger, G.; Schießl, A.; Wolter, K.-J.
Lifetime Assessment for Bipolar Components under Vibration and Temperature Loading
Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Wroclaw, 2013
2012
Schwerz, R.; Roellig, M.; Meier, K.; Wolter, K.-J.
Lifetime Assessment of BGA Solder Joints with Voids under Thermo-Mechanical Load
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Saettler, P.; Kovalenko, D.; Meier, K.; Roellig , M.; Boettcher , M.; Wolter, K.-J.
Thermo-mechanical Characterization and Modeling of TSV Annealing Behavior
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Roellig, M.; Schubert, F.; Lautenschlaeger, G.; Franke, M.; Boehme, B.; Meyendorf, N.
Reliability and Functionality Investigation of CFRP Embedded Ultrasonic Transducers supported by FEM and EFIT Simulations
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Roellig, M.; Schubert, F.; Lautenschlaeger, G.; Franke, M.; Boehme, B.; Meyendorf, N.
Capability Study of Embedded Ultrasonic Transducer Microsystems for SHM Applications in Airplane Composite Structures
EWSHM, Dresden, 2012
Münch, M.; Röllig, M.; Reithe, A.; Wachsmuth, M.; Meißner, M.
Flexible CIGS Modules – Selected Aspects for Achieving long-term stable Products
NREL, Photovoltaic Module Reliability Workshop (PVMRW), Golden (Colorado, USA), February 28–March 1, 2012
Yeap, K.-B.; Roellig, M.; Gall, M.; Sukharev, V.; Zschech, E.
Multi-Scale Materials Database for Accurate 3D IC Simulation Input
IEEE Transactions on Device and Materials Reliability, 2012
Meier, K.; Kraemer, F.; Roellig, M.; Wolter, K.-J.
Characterisation of Lead-free Solders at High Strain Rates Considering Microstructural Conditions
Proceedings of the 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Lisbon, 2012
Boehme, B.; Roellig, M.; Lautenschlaeger, G.; Franke, M.; Schulz, J.; Wolter, K.-J.
Einbettung von Ultraschallwandler- und Elektroniksystemen in CFK-Strukturen für die sensorische Strukturüberwachung
Elektronische Baugruppen und Leiterplatten; Hochentwickelte Baugruppen aus Europa, 6. DVS/GMM-Fachtagung; Fellbach 14-15. Februar, 2012, Pages 85-90
2011
Röllig, M.; Meier, K.; Metasch, R.; Schießl, A.
Hoch- und niederzyklische Ermüdungsuntersuchungen an Lotwerkstoffen zur Absicherung robuster Automobilelektronik
Proceedings of the International Conference MicroCar 2011
Roellig, M.; Boehme, B.; Meier, K.; Metasch, R.
Determination of Thermal and Mechanical Properties of Packaging Materials for the Use in FEM-Simulations
AIP 2011, AIP Conference Proceedings, vol.1378, nr. 1, Pages 79-103
Wiese, S.; Müller, M.; Panchenko, I.; Metasch, R.; Röllig, M.; Wolter, K.-J.
The Creep Behaviour and microstructure of Ultra Small Solder Joints
EuroSime, April 18th-20th, Linz, Austria
Schwerz, R.; Meyer, S.; Roellig, M.; Meier, K.; Wolter, K.-J.
Finite Element Modeling on Thermal Fatigue of BGA Solder Joints with Multiple Voids
34th International Spring Seminar on Electronics Technology (IEEE); High tatras, Slovakia, 11 – 15 Mai
Meier, K.; Roellig, M.; Schießl, A.; Wolter; K.-J.
Life Time Prediction for Lead-free Solder Joints under Vibration Loads
Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Linz, 2011
2010
Wiese, S.; Mueller, M.; Panchenko, J.; Metasch, R.; Wolter, K.- J.; Roellig, M.
The Scaling Effect on Microstructure and Creep Properties of Sn-based Solders
Electronics System Integration Technology Conference, Berlin, 13th - 16th of May
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Mechanical Behaviour of Typical Lead-Free Solders at High Strain Rate Conditions
Proceedings of the 12th Electronics Packaging Technology Conference (EPTC), Singapore, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Rate Dependent Mechanical Behaviour of SAC Solder in Fast Tensile Experiments
Proceedings of the 3rd Electronics Systemintegration Technology Conference, Berlin, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Characterisation of the Mechanical Behaviour of SAC solder at High Strain Rates
Proceedings of the 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Bordeaux, 2010
Meier, K.; Roellig, M.; Wiese, S.; Wolter; K.-J.
Mechanical Solder Characterisation under High Strain Rate Conditions
11th International Workshop on Stress-Induced Phenomena in Metallization, ISSN 0094-243X, American Institute of Physics, Bad Schandau, 2010
Roellig, M.; Boehme, B.; Lautenschlaeger, G.; Koehler, B.; Schubert, F.; Heinrich, F. .; Bergander, A..; Schulz, J.; Wolter, K.-J., Hentschel, D.; Franke, R.
Integration of US-based SHM Sensor System in CFRP-Airplane Structures
4th Airportseminar; Dresden; 3-4. November; 2010
Roellig, M.; Schubert, L.; Lieske, U.; Boehme, B.; Frankenstein, B.; Meyendorf, N.
FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components
11th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Bordeaux, Fr, 26.-28. April, 2010
2009
Meier, K.; Wiese, S.; Roellig, M.; Wolter, K.-J.
Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Proceedings of the 59th Electronic Components and Technology Conference (ECTC); San Diego (California, USA); pp. 1781-1787
Meier, K.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Combining Experimental and Simulation Methods for the Mechanical Characterisation of Lead Free Solder Alloys under High Strain Rate Loads
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE); Delft; pp. 563 – 569
Heuer, H.; Hillmann, S.; Roellig, M.; Schulze, M.; Wolter, K.-J.
Thin Film Characterization using High Frequency Eddy Current Spectroscopy
Conference on Nanotechnology
Metasch, R.; Boareto, J.C.; Roellig, M.; Wiese, S.; Wolter, K.-J.
Primary and Tertiary Creep Properties of Eutectic SnAg3.8Cu0.7 in Bulk Specimens
International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME
Metasch, R.; Roellig, M.; Wolter, K.-J.
A novel Thermo-Mechanical Test Method of Fatique Characterization of Real Solder Joints
European Microelectronics and Packaging Conference; EMPC; Rimini; 2009
Roellig, M.
Methoden zur Ermittlung von Werkstoffeigenschaften bleifreier Lote – Verformungs- und Ermüdungsverhalten
SMT Hybrid Packaging, Systemintegration in der Mikroelektronik, Nürnberg, 2009
Roellig, M.; Meyer, S.; Thiele, M.; Rzepka, S.; Wolter, K.-J.
Modeling, Simulation and Calibration of the Chip Encapsulation Molding Process
International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME; 2009,
2008
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B.
Thermal Test- and Field Cycling Inducted Degradation and its FE-Based Prediction for Different SAC Solders
Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm
Röllig, M.; Wiese, S.; Meier, K.; Wolter, K.-J.
Creep Measurements on SnAgCu Solder Joints in Different Compositions and after Mechanical and Thermal Treatment
Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EUROSIME
Böhme, B.; Röllig, M.; Wolter, K.-J.
Material Characterization of Organic Packaging Materials to Increase the Accurancy of FEM Based Stress Analysis
2nd Electronics Systemintegration Technology Conference, London, Great Britain, September 1st - 4th, 2008
2007
Meier, K.; Röllig, M.; Wiese, S.; Götte, C.; Deml, U.; Wolter, K.-J.
Elektromigration an Baugruppen der Leistungselektronik
Produktion von Leiterplatten und Systemen (PLUS), Eugen G. Leuze Verlag; ISSN 1436-7505
Müller, M.; Wiese, S.; Rollig, M.; Wolter, K.-J.
The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 446-455
Röllig, M.; Wiese, S.; Meier, K.; Wolter, K.-J.
Creep Measurements of 200µm - 400µm Solder Joints
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 255-264
Meier, K.; Röllig, M.; Wiese, S.; Goette, C.; Deml, U.; Wolter, K.-J.
Electromigration in Large Volume Solder Joints
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 464-470
Wiese, S.; Meier, K.; Scholz, D.; Müller, A.; Röllig, M.; Rzepka, S.; Wolter, K.-J.
Experimental Determination of Time Independent Elastic Plastic Behaviour of Solder Joints at High Strain Rates
EuroSimE 2007, 16.-18. April 07 in London (GB), S: 422-426
Wiese, S.; Röllig, M.; Müller, M.; Wolter, K.-J.
The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties
EuroSimE 2007, 16.-18. April , London (GB), S: 699-706
Meier, K.; Röllig, M.; Wiese, S.; Goette, C.; Deml, U.; Wolter, K.-J.
Mechanical Degradation, Thermal- and Electromigration in Large Volume Solder Joints
57th ECTC 2007, 29.5 . 1.6.05 in Reno (USA), S. 1839 . 1845
Müller, M.; Wiese, S.; Röllig, M.; Wolter, K.-J.
Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder Joints
57th ECTC 2007, 29.5 . 1.6.05 in Reno, (USA), S. 1579 . 1588
Wiese, S.; Röllig, M.; Müller, M.; Bennemann, S.; Petzold, M.; Wolter, K.-J.
The Size Effect on the Creep Properties of SnAgCu-Solder Alloys
57th ECTC 2007, 29.5 . 1.6.05 in Reno, (USA), S. 548 . 557
Röllig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Microelectronics Reliability. Bd. 47 (2007), S. 187-195
2006
Böhme, B.; Röllig, M.; Wiese,S.; Wolter, K.-J.
Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints
29th International Spring Seminar on Electronics Technology, I St. Marienthal, Germany, May 10th to 14th, 2006
Wiese, S.; Röllig, M., Müller, M.; Rzepka, S.; Nocke, K.; Luhmann, C.; Krämer, F.; Meier, K.; Wolter, K.-J.
The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006, S. 912 - 925
Röllig, M.; Wiese, S.; Wolter, K.-J.
Extraction of Material Parameters for Creep Experiments on Real Solder-Joints by FEAnalysis
EuroSimE 2006, April 24th to 26th in Como (I), S: 281-289
Wiese, S.; Krämer, F.; Krause, M.; Bennemann, S.; Müller, M.; Röllig, M.; Petzold, M.; Wolter, K.-J.
Compositional Effects on the Creep Properties of SnAgCu Solder
EuroSimE 2006, April 24th to 26th in Como (I), S: 684-653
2005
Wiese, S.; Röllig, M.; Wolter, K.-J.
Creep of Eutectic SnAgCu in Thermally Treated Solder Joints
55th ECTC 2005, 31.05. - 03.06.2005 in Orlando (USA), S. 1272 - 1282
Wiese, S.; Röllig, M.; Wolter, K.-J.
Creep of Thermally Aged SnAgCu-Solder Joints
EuroSIME 2005, 18.-20.04.2005 in Berlin, Shaker Publishing, Maastricht, S.79 - 85
2003
Röllig, M.; Luniak, M.; Wolter, K.-J.
Optimization of plane antennae properties for Smart Label
SIITME 2003, Timisoara
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