Scientists
Vita
Dipl.-Ing. Daniel Ernst studied Electrical Engineering from 2000 to 2006 at TU Dresden. In his project work he get familiar with materials, technologies and the joint formation of Gold-Wire bond junctions, which were made under room temperature without any additional heating energy. At the time of his internship at a leading car manufacturer he dealt with the properties of electrical modules under high temperature conditions in the lifecycle in consideration of the different materials and devices.
In his diploma thesis he investigated the technologies and materials in more detail for the use on flexible printed Circuits (FPC). Core topics were the characterization of adhesive and soldering technologies as well as the Flip Chip Technology.
From 2006 to 2009 Mr. Ernst worked as process engineer for a mid-size company with special regard to adhesive application. Since 2010 he is working at the laboratory. With the aim to earn a doctorate he is concerning with technologies and materials for packaging organic and inorganic devices to combined modules both on rigid and flexible substrates. Core topics in this field are reliability and lifecycle characterization and technology development.
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Referenzen
2024
Adavi, K.; Quednau, S.; Mueller, X.; Ernst, D.; Meier, K.; Platz, H.
Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology based on Static I-V
Proceedings of the 9th Electronics System-Integration Technology Conference (ESTC), Berlin (Germany), 2024, DOI: 10.1109/ESTC60143.2024.10712135
Adavi, K.; Quednau, S.; Mueller, X.; Ernst, D.; Meier, K.; Platz, H.
Experimental Study of a Novel Printed Circuit Board Interconnection Technology
Proceedings of the IEEE 47th International Spring Seminar on Electronics Technology (ISSE), Prague (Czech Republic), 2024, DOI: 10.1109/ISSE61612.2024.10604153
Ernst, D.; Nieweglowski, K.; Bock, K.
Spannungsreduzierte Kontaktierungen in dehnbaren Elektroniksystemen
12. DVS/GMM-Fachtagung, Elektronische Baugruppen und Leiterplatten "EBL 2024", Fellbach, 05.03.2024
2023
Platz, H.; Matthes, M.; Biener, M.; Ernst, D.; Schleicher, M.; Kühn, W.
Klassifizierung der additiven Fertigungs- und 3D-Druckprozesse für die Elektronik - White Paper
FED - Fachverband Elektronikdesign und -fertigung, Arbeitskreis 3D-Elektronik, Juni 2023;
Downloadlink: https://www.fed.de/3d-elektronik/
2022
Ernst, D.; Nieweglowski, K.; Bock, K.
Feasibility Study of Magnetically Enhanced Interconnects for Integration of Flexible and Stretchable Electronics
9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania
Koschichow, R.; Ernst, D.; God, R.; Heckert, M.; Melzer, D.; Zerna, T.
Verfahrensentwicklung und Festigkeitsbewertung von Bauteilen in Sandwichbauweise mit integrierter Elektronik für die Luftfahrtanwendung
23. Symposium Verbundwerkstoffe und Werkstoffverbunde; Leoben, Österreich, 20.-22.07.2022
Ernst, D.; Heckert, M.; Koschichow, R.; Melzer, D.; God, R.; Zerna, T.
Elektronik trifft Leichtbau - Bericht aus dem Projekt "Bauteil 4.0"
Fachzeitschrift PLUS; Leuze-Verlag; Heft 4/22, S. 537-558
2021
Krenkel, M; Koch, S. G.; Reitz, S.; Scharf, P.; Ernst, D.; Wolf, M.
Miniaturized annular arrays for focused ultrasound
MikroSystemTechnik Kongress 2021, Ludwigsburg, 08.-10.11.2021
Ernst, D.; Nieweglowski, K.; Schubert, M.; Bock, K.
Magnetically Enhanced Stretchable Interconnects for Human- Machine Interface
MikroSystemTechnik Kongress 2021, Ludwigsburg, 08.-10.11.2021
Ernst, D.
Aufbau- und Verbindungstechnik für flexible, dehnbare und dreidimensionale Elektroniksysteme
29. FED-Konferenz, Nachhaltig & erfolgreich: Design, Fertigungs- und Managementprozesse in einer neuen Arbeitswelt, Bamberg, 17.09.2021
2020
Ernst, D.; Dallmann, E.; Zerna, T.
Zuverlässigkeit der Heterointegration von oberflächenmontierbaren Bauelementen für die flexible Elektronik
10. DVS/GMM-Fachtagung, Elektronische Baugruppen und Leiterplatten "EBL 2020", Fellbach, 19.02.2020
Ernst, D.; Faghih, M.; Liebfried, R.; Melzer, M.; Karnaushenko, D.; Hofmann, W.; Schmidt, O. G.; Zerna, T.
Packaging of Ultrathin Flexible Magnetic Field Sensors with Polyimide Interposer and Integration in an Active Magnetic Bearing
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10; no. 1, pp 39 -43, Jan. 2020; DOI: 10.1109/TCPMT.2019.2953830
2019
Ernst, D.; Richter, N.; Zerna, T.
Heterogeneous Integration of Surface Mounted Devices for Bendable Electronics
22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, Pisa, Italy, 2019
2018
Brachmann, E.; Seifert, M.; Ernst, D.; Menzel, S. B.; Gemming, T.
Pt-wire bonding optimization for electroplated Pt films on γ-Al2O3 for high temperature and harsh environment applications
Sensors and Actuators: A. Physical; Volume 284, 1 December 2018, Pages 129-134, https://doi.org/doi:10.1016/j.sna.2018.10.023
Ernst, D.; Menzel, S.; Brachmann, E.; Bock, K.
Realization of wire bond interconnecting process stable for high temperature applications with platinum wire and SAW sensors
Surface Acoustic Wave Sensor & Actuator (SAW) Symposium, Dresden, Germany, 2018
Ernst, D.; Brachmann, E.; Menzel, S.; Bock, K.
Wire Bonding of Surface Acoustic Wave (SAW) Sensors for High Temperature Applications
7th Electronics System-Integration Technology Conference (ESTC), Dresden, Germany, 2018
Ernst, D.; Wild, M.; Zerna, T.
Packaging of Ultrathin Flexible Magnetic Field Sensors with thin Silicon and Polyimide Interposer
7th Electronics System-Integration Technology Conference (ESTC), Dresden, Germany, 2018
Brachmann, E.; Seifert, M.; Neumann, N.; Ernst, D.; Menzel, S. B.
Platinum wire bonding on electroplated Pt antennas on Al2O3 ceramic for wireless SAW temperature sensors
Materials for Advanced Metallization Conference (MAM 2018), Milano, Italy, 18th - 21th of March 2018
Wild, P.; Mückl, T.; Bell, H.; Ernst, D.; Heller, C.; Schmoldt, A.; Wilmsmeier, O.; Heilmann, N.
Einsatz von RFIDs in der Elektronikfertigung zur Steigerung der Prozess- und Produktsicherheit - Von der Theorie zur Praxis
9. DVS/GMM-Fachtagung, Elektronische Baugruppen und Leiterplatten "EBL 2018", Fellbach, 20.-21.02.2018
Ernst, D.; Zerna, T.
Ultradünne Magnetfeldsensoren mit Silizium- und Polyimidinterposern
9. DVS/GMM-Fachtagung, Elektronische Baugruppen und Leiterplatten "EBL 2018", Fellbach, 20.-21.02.2018
2017
Ernst, D.; Brachmann, E.; Menzel. S.; Zerna, Th.
Hochtemperaturfeste Kontaktierungen für SAW-basierte Sensoren
IMAPS Herbstkonferenz, München, 19.-20.10.2017
2016
Wagner, D.; Jamal, F. I.; Guha, S.; Wenger, C.; Wessel, J.; Kissinger, D.; Ernst, D.; Schumann, U.; Pitschmann, K.; Schmidt, B.; Detert, M.
Packaging of a biCMOS Sensor on a catheter tip for the characterisation of atherosclerotic plaque
6th Electronics System-Integration Technology Conference (ESTC), Grenoble, France, 2016
Ernst, D.; Schumann, F.; Döring, S.; Zerna, Th.
Immer flexibel bleiben! - Die- & Drahtbonden auf Flex-Materialien
Präsentation beim 68. Treffen des Sächsischen Arbeitskreises Elektronik-Technologie
Ernst, D.; Menzel, S.; Brachmann, E.; Bock, K.
Platinum Wire Bonding for High Temperature Sensor Applications
Surface Acoustic Wave Sensor & Actuator Symposium, Dresden, Germany, 2016
Ernst, D.; Mönch, J. I.; Bahr F.; Hofmann, W.; Schmidt, O. G.; Zerna, Th.
Flexible Magnetic Field Sensors with Ultra-Thin Silicon Interposer
6th Electronics System-Integration Technology Conference (ESTC), Grenoble, France, 2016
Bahr, F.; Mönch, I., Ernst, D.; Zerna, T.; Schmidt, O.G.; Hofmann, W.
Direct Field Control of AMBs using Flux Feedback based Integrable Halls Sensors
Vortrag und Paper, 15th International Symposium on Magnetic Bearings (ISMB 15), 3.-6.08.2016, Kitakyushu, Japan
2015
Ernst, D.; Zerna, Th.
Organische Elektronik – Einfluss auf die etablierte Aufbau- und Verbindungstechnik
Zeitschrift "PLUS", Heft 10/2015; Eugen G. Leuze Verlag KG, Saulgau
Ernst, D.; Mönch, J. Ingolf; Schmidt, Oliver G.; Zerna, Th.
Manufacturing of Flexible (Ultra-)Thin Magnetic Field Sensors
20th European Microelectronics and Packaging Conference (EMPC), Friedrichshafen, Germany, 2015
Rost, K.; Mönch, I.; Karnaushenko, D.; Rodriguez, N.; Makarov, D.; Ernst, D.; Bahr, F.; Hofmann, W.; Schmidt, O. G.
Optimisation of an Electrochemical Etching Approach for Flexible Hall Sensorics
581. WE-Heraeus-Seminar: "Flexible, Stretchable and Printable High Performance Electronics", Bad Honnef, Germany, 12th - 14th of January 2015
Ernst, D.; Melzer, M.; Makarov, D.; Bahr, F.; Hofmann, W.; Schmidt, O. G.; Zerna, Th.
Realization of (Ultra-)Thin Sensors on Flexible Substrates
581. WE-Heraeus-Seminar: "Flexible, Stretchable and Printable High Performance Electronics", Bad Honnef, Germany, 12th - 14th of January 2015
2014
Schulz, K.; Ernst, D.; Menzel, S.; Gemming, Th.; Eckert, J.; Wolter, K.-J.
Thermosonic Platinum Wire Bonding on Platinum
37th International Spring Seminar on Electronics Technology, Dresden, Germany, 7th - 11th of May 2014
Ernst, D.; Melzer, M.; Makarov, D.; Bahr F.; Hofmann, W.; Schmidt, O. G.; Zerna, Th.
Packaging Technologies for (Ultra-)Thin Sensor Applications in Active Magnetic Bearings
37th International Spring Seminar on Electronics Technology, Dresden, Germany, 7th - 11th of May 2014
2013
Ernst, D.; Zerna, Th.; Wolter, K.-J.
Lifetime evaluation of flexible substrates or flexible systems under mechanical stress conditions
Plastic Electronics Exhibition & Conference, Dresden, 2013
Ernst, D.; Häfner, C.; Müller-Meskamp, L.; Wolter, K.-J.; Zerna, Th.
Realisation and Packaging on Transparent Conductive Layers made by Coating of Silver Nanowires
Large-area, Organic & Printed Electronics Convention (LOPE-C), Munich, 2013
2012
Ernst, D.; Schumann, F.; Nobis, C.; Zerna, T.; Wolter, K.-J.
Mikrokontaktierverfahren auf flexiblen Verdrahtungsträgern
Deutsche IMAPS-Konferenz, München, 11. - 12. Oktober 2012
2011
Ernst, D.; Zerna, T.; Wolter, K.-J.
Influences of Organic Materials on Packaging Technologies and their Consideration for Lifetime Evaluation
34th International Spring Seminar on Electronics Technology, High Tatras, Slovakia, 11th - 15th of May 2011
2006
Detert, M.; Ernst, D.; Zerna, T.; Wolter; K.-J.
Flexible Verdrahtungsträger - Alterungsverfahren in der Diskussion
31. Micro Reliability Seminar, 16. November 2006, IZM Berlin
Detert, M.; Ernst, D.; Zerna, T.; Wohlrabe, H.; Wolter, K.-J.
Reliability Qualification of Flexible Printed Circuits with Common and New Methods
1st Electronics Systemintegration Technology Conference, Dresden, Germany, September, 5th to 7th, 2006
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